本論文提出一種方法進行二維圖樣之完整性分析，此方法可於影像分析後量化邊緣平整度和平均線寬。與傳統的肉眼圖樣完整性判別相比，可避免人為評估差異及肉眼無法區別之微小差異貢獻。此方法可有效地判別光學顯微鏡與電子顯微鏡取得之影像。
為驗證提案之方法，本研究以不同噴墨印刷條件製作二維圖樣，包含線、轉角、圓、橢圓及算數級數與非算術級數之螺旋以觀察優劣化圖樣之量化效果。實驗結果證明，因圖樣扭曲、鼓脹、縮頸及墨料累積等現象皆可藉此手法量化邊緣平整度。此外，由非算數級數螺旋產生之量化誤差亦於本研究中探討，可作為使用者評估量化信心水準之參考。

A methodology for quantifying and qualifying pattern transfer completeness in inkjet printing through examining both pattern dimensions and pattern contour deviations from reference design is proposed, which enables scientifically identifying and evaluating inkjet-printed lines, corners, circles, ellipses, and spirals with irregular edges of bulging, necking, and unpredictable distortions resulting from different process conditions. This methodology not only avoids differences in individual perceptions of ambiguous pattern distortions but also indicates the systematic effects of mechanical stresses applied in different directions to a polymer substrate, and is effective for both optical and electrical microscopy in direct and indirect lithography or lithography-free patterning.

摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VII
表目錄 XI
符號表 XII
第1章 緒論 1
第2章 理論與設計 17
第3章 實驗製程方法 29
第4章 結果與討論 41
第5章 結論 59
第6章 未來工作 61
參考文獻 65
附錄一 阿基米德螺旋邊緣平整度之語法 67
附錄二 雙曲螺旋邊緣平整度之語法 73
附錄三 費馬螺旋邊緣平整度之語法 77
附錄四 對數螺旋邊緣平整度之語法 83
附錄五 連鎖螺旋邊緣平整度之語法 87
附錄六 軟體操作流程 93
發表清單 99

[1] J. F. Chen, T. Laidig, K. E. Wampler and R. Caldwell, “Optical proximity correction for intermediate-pitch features using sub-resolution scattering bars”, Journal of Vacuum Science & Technology B, 15, 2426-2433, 1997.
[2] X. Zhang and Z. Liu, “Superlenses to overcome the diffraction limit”, Nature Materials, 7, 435-441, 2008.
[3] M. Chandhok, S. Datta, D. Lionberger, and S. Vesecky, “Impact of Line Width Roughness on Intel’s 65nm process devices”, in Proc. SPIE, 6519, 2007.
[4] Y. Ban, S. Sundareswaran and D. Z. Pan, “Electrical impact of line-edge roughness on sub-45nm node standard cell”, Journal of Micro/Nanolithography, MEMS, and MOEMS, 9, 041206, 2010.
[5] S. Y. Chou, P. R. Krauss and P. J. Renstrom, “Imprint of sub-25nm vias and trenches in polymers”, Applied Physics Letter, 67, 3114-3116, 1995.
[6] K. H. Liao and C. Y. Lo, “Thermoresistive Strain Sensor and Positioning Method for Roll-to-Roll Processes”, Sensors, 14, 8082-8095, 2014.
[7] C. Kim, M. Nogi and K. Suganuma, “Electrical conductivity enhancement in inkjet-printed narrow lines through gradual heating”, Journal of Micromechanics and Microengineering, 22, 035016 , 2012.
[8] M. L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen and H. Seppä, “Electrical sintering of nanoparticle structures”, Nanotechnology, 19, 175201, 2008.
[9] J. Virtanen, T. Björninen, L. Ukkonen and L. Sydänheimo, “Passive UHF Inkjet-Printed Narrow-Line RFID Tags”, IEEE Antennas and Wireless Propagation Letters, 9, 440-443, 2010.
[10] T. Öhlunda, J. Örtegrena, S. Forsberg, H. E. Nilsson, “Paper surfaces for metal nanoparticle inkjet printing”, Applied Surface Science, 259, 731-739, 2012.
[11] B. J. Kang and J. H. Oh, “Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate”, Thin Solid Films, 518, 2890–2896, 2010
[12] C. T. Chen and K. Z. Tu, “Morphologies of conductive looped liquid lines inkjet-printed on substrate surfaces”, Journal of Micromechanics and Microengineering, 22, 055001, 2012
[13] B. D. Bunday, J. S. Villarrubia, A. E. Vladar, “CD-SEM measurement line-edge roughness test patterns for 193-nm lithography”, Microlithography International Society for Optics and Photonics, 5038, 674-688, 2003.
[14] A. Yamaguchi, R. Nakagaki and H. Kawada, “CD-SEM Technologies for 65-nm Process Node”, Hitachi Review 54, 15-21, 2005
[15] I. Kawata, N. Hasegawa and S. Takami, “New World of CD-SEM in Utilization of Design Data”, Hitachi Review, 55, 61-68, 2006
[16] A. Yamaguchi, R. Steffen, H. Kawada and T. Iizumi, “Bias-free measurement of LER/LWR with low damage by CD-SEM.”, In SPIE 31st International Symposium on Advanced Lithography, 6152, 61522D1-61522D8, 2006.
[17] Dimatix Materials Printer DMP-2800 Series User Manual, Document Number PM000040 Rev. 02 – August 29, 2008.
[18] DuPont Teijin Films Teonex® Technical Data.
[19] Adphos Technology NIR L-series introduction.