本論文提出了一種包含低壓乾燥、近紅外光燒結及高強度脈衝光還原步驟之奈米銅粒子步進燒結製程。此製程針對具有低重量百分比及大奈米粒子之銅墨水設計，使其於噴印或塗佈後能以此步進燒結達成與塊材銅具有相同數量級電阻率之薄膜。研究證明，低壓乾燥使奈米銅墨水中之溶劑揮發並使奈米粒子緊密連結，在表面平整度改善同時亦促進後續燒結之效率。以熱能表現的近紅外光燒結因紅外光頻譜與銅之吸收頻譜相近而有高效率，亦改善了單純以高強度脈衝光燒結之銅膜剝離現象。低劑量之高強度脈衝光於本研究中僅做為近紅外光燒結之銅膜還原，避免了連續製程中出現高強度脈衝光連接界面之銅膜不均勻性。
最終，本研究實現具有7.1×10-8 Ω-m電阻率(24%塊材導電率)之銅膜。

This research proposed a sequential copper nanoparticle sintering process, which includes low pressure drying, near infrared sintering, and intensive pulsed light reduction. This process was designed for copper nanoparticle inks with lower solid contents and larger particle sizes, making the reduced copper thin film by inkjet printing or coating having the sane order resistivity as the bulk one. The result proved that the low pressure drying accumulated copper nanoparticles during solvent evaporation, resulting flat surfaces for continuous sintering. The near infrared sintering was efficient because of similar near infrared and copper absorption spectra, improving the copper delamination resulted from intensive pulsed light-only sintering. The low intensive pulsed light dose was used for copper-oxide reduction and avoided uniformity issue of stitching multiple areas.
The final copper thin film resistivity reached 7.1×10-8 Ω-m, which equals to 24 % of the bulk conductivity.

目錄
摘要 I
ABSTRACT II
致謝 III
目錄 IV
表目錄 XII
符號表 XIV
第1章 緒論 1
1.1. 前言 1
1.1.1. 噴墨印刷技術應用於軟性電子之必要性 1
1.1.2. 奈米金屬墨水 4
1.1.2.1. 奈米粒子 4
1.1.2.2. 奈米粒子表面效應 5
1.1.2.3. 奈米粒子大小與熔點之關係 6
1.1.2.4. 小粒子高濃度之銅墨水製作挑戰 7
1.1.3. 奈米金屬粒子燒結手法 8
1.1.3.1. 熱燒結(Thermal Sintering) 9
1.1.3.2. 微波燒結(Microwave Sintering) 9
1.1.3.3. 光燒結(Photonic Sintering) 10
1.1.3.4. 電燒結(Electrical Sintering) 12
1.1.3.5. 化學藥劑燒結(Chemical sintering)[12] 12
1.2. 文獻回顧 14
1.2.1. 奈米銅高強度脈衝光燒結 14
1.2.2. 高強度脈衝光燒結後金屬剝離現象 16
1.2.3. 近紅外光(Near-infrared; NIR)燒結 18
1.2.4. 複合燒結製程 19
1.2.4.1. 高強度脈衝光結合微波燒結 19
1.2.4.2. 高強度脈衝光結合IR 20
1.2.4.3. 兩步驟高強度脈衝光 20
1.2.5. 小結 23
1.3. 研究動機 24
第2章 理論與設計 25
2.1. 燒結現象與燒結機制 25
2.1.1. 燒結之驅動力 25
2.1.2. 奈米墨水燒結之機制 26
2.1.3. 燒結之物理性質變化 28
2.1.3.1. 厚度與重量改變: 28
2.1.3.2. 電阻率變化: 29
2.2. 高能量脈衝光燒結原理 29
2.2.1. 光還原氧化銅原理 29
2.2.2. 吸收光譜探討 30
2.2.2.1. IPL照射波段 30
2.2.2.2. 金屬奈米粒子 31
2.2.2.3. 綜合吸收光譜探討 32
2.2.3. 曝光燒結機構探討 33
2.3. 近紅外光燒結原理 35
2.4. 近紅外光暨脈衝光複合燒結理論設計 35
2.5. 奈米銅電阻率優化製程設計 36
2.5.1 噴印圖樣設計 37
2.5.2 奈米銅墨水噴印參數設計 37
2.5.2.1. 液滴間距(Drop space) 37
2.5.2.2. 噴印條件設定 38
2.5.2.3. 噴印參數選定 40
2.5.3. 乾燥製程改善設計 40
2.5.4. 近紅外光燒結參數設計 41
2.5.5. 高強度脈衝光燒結參數設計 41
2.5.6. 物理驗證 42
2.5.6.1. 電性 42
2.5.6.2. 孔洞率 42
2.5.6.3. 表面裂縫率分析 43
第3章 實驗製程方法 45
3.1. 實驗流程圖 45
3.2. 實驗製程與設備 46
3.2.1. 奈米銅膜噴印製程 46
3.2.1.1. Drop on demand 噴印系統 46
3.2.1.2. 實驗材料 49
3.2.2. 奈米銅燒結製程 50
3.2.2.1. 近紅外光燒結系統 50
3.2.2.2. Xenon Sinteron 3000 高能量脈衝光系統 51
3.2.2.3. 熱燒結烘箱 52
3.2.3. 四點探針量測系統 52
3.2.4. 聚焦離子束電子束掃瞄式顯微鏡系統 53
3.2.5. 影像分析方法 54
3.2.5.1. 孔洞率 54
3.2.5.2. 表面裂縫比例 55
第4章 結果與討論 57
4.1. 乾燥製程改良效果 57
4.2. 以NIR優化電阻率 59
4.2.1. 孔洞率 59
4.2.2. NIR燒結能量 61
4.3. 以IPL還原CUO 63
4.4. 燒結後奈米銅膜特性 64
4.4.1. 電阻率及氧含量之關係 64
4.4.2. 電阻率與孔洞率之關係 65
4.4.3. 電阻率與裂縫之關係 69
4.4.4. 附著力刮刀測試結果 72
第5章 結論與未來工作 73
5.1. 結論 73
5.2. 裂縫比例改善 76
5.3. 未來應用 76
參考文獻 77
發表清單 80

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