本論文將設計一台能製作複雜且任意三維結構的系統機台，使用奈秒級的綠光雷射中心波長532nm，搭配自行組裝的顯微鏡與二種規格移動平台，能涵蓋釐米尺度的大尺度結構與奈米等級精細的小結構，最後將實際製作出奈米等級之結構測試機台性能。
接著是針對系統建置與製程優化，我們提出(1)雷射加工即時觀測的新穎設計，調整雷射聚焦點與顯微鏡觀測成像面的誤差僅0.9um。(2)並以此設計做延伸配合影像分析相似度的演算法，完成了自動對焦的系統。以及(3)針對基板做傾斜校正。
製程上，克服了(4)玻璃基板與SU-8負光阻黏著度不足的問題，並加入了Lift-off製程的可能性與減低基板背曝的線寬影響。(5)完成了線寬與劑量的關係圖，配合不同的結構調整不同的功率與速度，(6)尤其是深寬比高的結構，使用了重複路徑疊合的做法，加強結構穩定度而不變動整體架構。
最後製作了光諧振器與光子晶體，從中優化的系統地不足，並完成了結構。也說明了改用中心波長532nm的雷射系統，其系統特性與效能，比起780nm之飛秒脈衝雷射，有過之而無不及，尚可減低成本預算又可提高系統穩定度，實為一舉數得之設計。

This paper set out to design a 3D nano/micro-machining system which is able to produce complex and any three-dimensional structure. Using nanoseconds level of green laser center wavelength of 532nm, and self-assembly of a microscope and two kinds of specifications mobile stage, which are able to cover large structures of centimeter-scale and fine structures of nano-grade. Finally, the study show the production of the nano-grade structures and test machine performance.
About the system setup and process optimization, we propose：(1) The novel design that when laser is processing and CCD get the real-time observation simultaneously. In addition to, the error between laser focal position and microscope imaging plane is merely 0.9um by manual adjustment. (2) Extending the preceding design and combining with the similarity of image analysis algorithms. We build up the auto-focus system. (3) Doing the tilt correction of the substrate. Then, on the process we overcome ：(4) Lack adhesion between glass substrates and SU-8 negative photoresist. And, in consequence we get the Lift-off process and reduce the exposure of the substrate back linewidth effect. (5) The completion of the linewidth and dose relationship diagram, with different structural adjustment different power and speed. (6) In particular of the aspect ratio of the structure, using the overlap path plan to strengthen the stability of the structure and not change the overall structure.
Finally, we produce a photonic crystal and optical resonator also prove the better performance that switching to a center wavelength of 532nm laser system. Besides, compared to the 780nm femtosecond pulse laser, that may reduce the cost estimates and improve the stability of the system.

1 緒論
1.1 前言 P.1
1.2 雙光子微加工技術 P.2
1.3 文獻回顧 P.4
1.3.1 加工模式 P.4
1.3.2 目前最小的結構線寬 P.5
1.3.3 大尺度結構體 P.5
1.3.4 加強解析度 P.6
1.3.5 加強穩定性 P.7
1.3.6 提高產量 P.8
1.4 研究動機 P.9

2 研究方法
2.1 雙光子吸收 P.12
2.2 雙光子吸收強度計算 P.16
2.2.1 脈衝雷射 P.16
2.2.2 高倍率、高NA值物鏡 P.17
2.3 系統架構與加工流程 P.19
2.4 移動平台 P.23
2.4.1 壓電式移動平台與其校正 P.23
2.4.2 移動平台組裝設計 P.29
2.5 雷射加工即時觀測系統 P.35
2.6 軟體開發與使用者介面 P.38
2.6.1 控制平台與使用者介面 P.38
2.6.2 切層軟體與其使用者介面 P.40
3 實驗規劃
3.1 光阻 P.41
3.2 黏著度測試 P.44
3.3 機台基本曝光性能測試 P.48
3.3.1 自動對焦系統 P.48
3.3.2 定位光阻與基板交界面之Z軸位置 P.50
3.3.3 結構線寬與雷射功率、加工速率關係 P.54
3.3.4 結構線寬與劑量關係圖 P.56

4 結構範例與系統優化
4.1 案例一：光諧振器 P.59
4.2 案例二：光子晶體 P.63

5 結論 P.66

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