近年來，生物高分子材料去氧核醣核酸(DNA)，除了在生物上的探討外，由於DNA分子的數種特色，逐漸被應用在光電領域中，並且在奈米科技上的探討也逐漸增加。
本論文分成兩大部分，首先我們將DNA作為主體，並以光化學的方式在DNA內形成奈米粒子，探討此DNA奈米複合材料的導電度，並在DNA材料內添加Tris-EDTA緩衝液，以提升DNA高分子材料的溶解度。此外由於DNA適合做為金屬奈米粒子合成的模板，因此我們利用光化學合成DNA奈米複合物，並將其應用在有機記憶體元件上。實驗顯示，可藉由照光控制奈米粒子的濃度，使元件具雙穩態，並具有不同的操作模式。當元件照光後，根據時間長短，元件可表現出寫入一次、讀取多次，或表現出寫入-讀取-抹除的循環。

In recent years, deoxyribonucleic acid (DNA) has attracted much attention in biology. Owing to several unique properties of DNA molecules, DNA has been utilized in optoelectronic devices and nanotechnology.
In this work, we study the electrical conductivity of DNA nanocomposites consist of DNA and nanoparticles. The DNA nanocomposites were synthesized by a phototriggered method. The Tris-EDTA buffer was used to increase the solubility of DNA biopolymer. Besides, DNA is a good template for metal nanoparticle synthesis. We used a phototriggered method to synthesize the DNA nanocomposites, and apply the nanocomposites in organic memory devices. Our experiments show that the device exhibits bistable property and the switching behavior is related to the concentration of nanoparticles in DNA nanocomposites. Depending on the irradiation time, the device may exhibit a behavior of write-once-read-many-times or follow a write-read-erase cycle.

目 錄


致謝 I 摘要 III Abstract IV 目錄 V
第一幸 緒論 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 前言 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 DNA生物高分子介紹及其應用 . . . . . . . . . . . . . . . . . . . . . . . 1
1.2.1 DNA 介 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2.2 DNA材料發展與應用 . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 金屬奈米拉子的介紹與應用 . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3.1 金屬奈米拉子 介 . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3.2 金屬奈米拉子的製備方法 . . . . . . . . . . . . . . . . . . . . . . 6
1.3.3 金屬奈米拉子的其他應用 . . . . . . . . . . . . . . . . . . . . . . 8
1.4 有機記憶體的介紹及其應用 . . . . . . . . . . . . . . . . . . . . . . . . 8
1.4.1 有機記憶體的發展 . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.4.2 有機記憶體的種類 . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.4.3 有機記憶體的參數 . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.4.4 傳導機制 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.5 實驗目標與研究動機 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
第二幸 實驗方法 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.1 材料製備 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16




2.1.1 DNA高分子材料的製備 . . . . . . . . . . . . . . . . . . . . . . . 16
2.1.2 DNA-CTMA之合成 . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.1.3 DNA奈米複合材料的製備 . . . . . . . . . . . . . . . . . . . . . . 18
2.2 有機 記憶體元件製備方法與量測 . . . . . . . . . . . . . . . . . . . . . . 19
2.2.1 有機記憶體元件製備方法 . . . . . . . . . . . . . . . . . . . . . . 19
2.3 有機記憶體元件量測儀器 . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.1 電性量測儀器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.2 TEM量測儀器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.3.3 SEM量測儀器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.3.4 月厚量測儀器(α-step) . . . . . . . . . . . . . . . . . . . . . . . . 22
2.3.5 光學吸收光譜量測(UV-visible spectra) . . . . . . . . . . . . . . . 23
第三幸 DNA 奈米複合材料之探討 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1 材料之探討與導電性之分析 . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1.1 不同濃度想離子 . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1.2 不同長度之 DNA 生物高分子材料 . . . . . . . . . . . . . . . . . 28
3.1.3 不同體積之Tris-EDTA buffer . . . . . . . . . . . . . . . . . . . . 29
3.1.4 DNA奈米複合材料之導電性量測 . . . . . . . . . . . . . . . . . 30
3.2 導電性機制討論 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
第四幸 記憶體元件之結果與討論 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.1








4.1.4 不同照光時間的DNA奈米複合材料 . . . . . . . . . . . . . . . . 44
4.1.5 經純化後的DNA高分子材料 . . . . . . . . . . . . . . . . . . . . 45




4.2 元件 機制討論 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.2.1 未照光的元件 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.2.2 寫入一次讀取多次(WORM)記憶體元件 . . . . . . . . . . . . . . 48
4.2.3 可抹除的記憶體元件 . . . . . . . . . . . . . . . . . . . . . . . . 50
4.2.4 含有較高濃度的元件 . . . . . . . . . . . . . . . . . . . . . . . . 51
第五幸 結論與未來展望 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
參考文獻 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

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