自2004年二維材料單原子層石墨烯首度利用機械玻璃法成功地從高定向熱裂解石墨(HOPG)上穩定的被分離出來，除了基礎石墨烯的物理特性外，石墨烯還兼具導電、高光學穿透率以及良好的機械特性，使得石墨烯在觸控技術領域上的應用備受矚目。相較於過去人與電腦或機器之溝通介面主要以鍵盤或滑鼠為主，觸控螢幕技術可使用戶進行快速直觀的功能選擇，令全球消費者帶來全新的使用體驗，使得現在是人手一觸控介面，消費者的需求亦越趨多元化，因此如何將石墨烯應用於觸控面板則成為眾多研究團隊爭相投入之領域，並且能最快驗證石墨烯未來在產業的發展潛能。

本研究首先從觸控技術的演進歷程與碳材料的應用發展，說明石墨烯的研究發現及應用領域，同時完整介紹石墨烯的基本物理特性、製備和參雜，並透過觸控面板製程中常使用的材料、種類和檢測技術原理等作系統性的說明，接著以系統性的規劃研究實驗架構和製成流程，進行一系列的實驗規劃與驗證，最終並成功研製出符合石墨烯觸控面板的整套製作流程，並成功製作出兩種觸控面板結構，並實現了多點感應的石墨烯電容式觸控面板，希以此作為未來石墨烯在觸控產業發展的基石。本研究對於運用石墨烯製作可撓式觸控面板的實務應用，在製程規劃與實驗模式亦奠定了基礎，同時藉由實驗上的製程關鍵技術與分析方法之運用，可提供觸控面板產業未來多元性發展的指標依循。

Since two dimensional material of single atomic carbon layer – graphene was isolated successfully from HOPG using mechanical exfoliation methods in 2004, many researchers have showed their interests to the graphene’s fantastic and excellent properties. In addition to physical properties of the graphene, the graphene also attracts more interests in touch technology due to its high transmittance, stiffness and conductivity properties. Transparent conductive film is a kind of substance which can be combined with the grapheme quickly in touch industry.

In the past, the communication interface between men and computers is keyboard or mouse; however, touch technology enables users to perform fast, intuitive function selection today and brings new experiences to users. Nowadays touch technology is becoming increasingly popular and no one can live without it. So how to use the graphene in this field becomes an important issue.

In this study, we changed the metal bridge structure, the traditional process of making touch panels, and use bottom bridge structure to make the graphene touch panel. Finally, we developed the graphene touch panel manufacturing process successfully, and achieved a multi-point sensing graphene capacitive touch panel inclusive of two structures — bottom bridge structure and double side structure. It can be the foundation of flexible touch panel practical applications and provides diverse development of indicators to followers in the display industry in the future.

論文摘要................................................ I
目錄................................................... VIII

第一章序論................................................1
1.1 觸控技術的演進. . . . . . . . . . . . . . . . . . . . 1
1.2 碳材料的發展與應用. . . . . . . . . . . . . . . . . . .3
1.3 研究動機與目的. . . . . . . . . . . . . . . . . . . . 5

第二章石墨烯..............................................7
2.1 石墨烯的基本物理特性. . . . . . . . . . . . . . . . . 7
2.1.1 石墨烯晶體結構. . . . . . . . . . . . . . . . . . .7
2.1.2 石墨烯能帶結構. . . . . . . . . . . . . . . . . . . 9
2.2 石墨烯的光學與機械特性. . . . . . . . . . . . . . . . 10
2.3 石墨烯的製備. . . . . . . . . . . . . . . . . . . . 15
2.4 石墨烯的摻雜. . . . . . . . . . . . . . . . . . . ...19

第三章透明導電膜......................................... 25
3.1 透明導電膜介紹. . . . . . . . . . . . . .............25
3.1.1 透明導電膜簡介. . . . . . . . . . . . . . . . . ...25
3.1.2 透明導電膜材料. . . . . . . . . . . . . . . . . ...26
3.2 觸控式螢幕種類. . . . . . . . . . . . . . . . . . . .29
3.2.1 電阻式. . . . . . . . . . . . . . . . . . ........30
3.2.2 電容式. . . . . . . . . . . . . . . . ............32
3.2.3 波動式. . . . . . . . . . . . . . . . . . . . . . 37
3.3 電容式觸控技術檢測. . . . . . . . . . . . . . . . . . 39

第四章元件製程.......................................... 45
4.1 以化學氣相沉積法備製石墨烯. . . . . . . . . . . . . . 45
4.1.1 化學氣相沉積系統. . . . . . . . . . . . . . . . . .45
4.1.2 大面積石墨烯成長. . . . . . . . . . . . . . . . . 46
4.1.3 大面積石墨烯轉移. . . . . . . . . . . . . . . . . 51
4.2 觸控元件設計與製程. . . . . . . . . . . . . . . . . 54
4.2.1 觸控元件設計. . . . . . . . . . . . . . . . . . . 54
4.2.2 觸控元件製程. . . . . . . . . . . . . . . . . . . 57
4.3 以石墨烯製作軟性觸控面板. . . . . . . . . . . . . . . 63
4.4 實驗儀器介紹. . . . . . . . . . . . . . . . . . . . 68
4.4.1 光學微影. . . . . . . . . . . . . . . . . . . . .68
4.4.2 熱金屬蒸鍍. . . . . . . . . . . . . . . . . . . .69
4.4.3 反應式離子蝕刻. . . . . . . . . . . . . . . . . . 70
4.4.4 電漿增強型化學氣相沉積. . . . . . . . . . . . . . 71

第五章元件量測與分析................................... 73
5.1 量測方法與系統. . . . . . . . . . . . . . . . .... 73
5.2 電極線阻值檢測與絕緣品質測試. . . . . . . . . . . . 74
5.2.1 硬基板之量測結果. . . . . . . . . . . . . . . . 74
5.2.2 絕緣品質測試. . . . . . . . . . . . . . . . . . 77
5.2.3 軟基板之量測結果. . . . . . . . . . . . . . . .. 81
5.3 觸控IC . . . . . . . . . . . . . . . . . . . . . 83
5.3.1 觸控IC 結構. . . . . . . . . . . . . . . . . . 83
5.3.2 觸控IC 連接. . . . . . . . . . . . . . . . . . 84
5.4 觸控元件測試. . . . . . . . . . . . . . . . . . . 86
5.4.1 觸控軟體介面. . . . . . . . . . . . . . . . . . 86
5.4.2 硬基板元件測試. . . . . . . . . . . . . . . . . 88
5.4.3 軟基板元件測試. . . . . . . . . . . . . . . . . 91
5.5 元件量測結果與分析. . . . . . . . . . . . . . . . 94

第六章結論與未來展望................................... 95

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