封裝廠打線機台若無法將金線打上將造成巨大之良率損失，本論文應用DMAIC手法來改善IC載板金手指凸起問題。在定義階段從客訴件數柏拉圖分析主要來自金手指凸起問題。由高階主管參與組成六標準差團隊務必解決此功能性問題。在衡量階段將改善目標訂定明確，何謂良好的金手指？如何表示？針對量測機台的重複性及再現性探討並了解現行製程能力是合規定的。在分析階段利用特性要因圖將可能原因列出，並針對可能因子進行模擬測試，透過統計軟體Minitab分析找出影響因子。在改善階段則是利用實驗設計法來求得因子的最佳設計，並驗證改善效果。在控制階段是由團隊將改善方法修訂於標準作業書中並交由產線執行。經過廠內出貨品質保證部門打線測試及確認物料出貨至客戶端無再接收到客戶抱怨，說明此改善有效降低客戶抱怨及提升製程良率，每月可減少花費品質成本約一百三十萬。

It would cause huge yield loss if wire bonding machine cannot do wire-bonding well in assembly house. This study aims to tackle bond finger nodule problem on IC substrate by deploying DMAIC methodology. At “Define” stage, according to the complaint cases Pareto analysis, the top 1 defect is “Bond finger nodule”, thus, the team assigned by top management to solve this issue. At “Measure” stage, it is to define the project CTQ and standards, such as what is normal bond finger and how to distinguish the bond finger nodule. Measurement system is also required to be analyzed and validated to make sure the measurement system is effective. At “Analyze” stage, the possible factors are listed through “Cause and Effect” analysis and simulation test proceeded on those possible factors and find out the main factors by statistic software, Minitab. At “Improve” stage, DOE (Design of Experiment) conducted to figure out the best process control condition, and perform small volume with the best condition to validate the effectiveness. At “Control” stage, to update the SOP (Standard Operation Procedure) with the optimized levels accordingly and publish to production line to follow. After then, there is no more customer complaint by continual monitoring. Through the Six Sigma DMAIC methodology, the customer complaint is reduced and also yield improved in customer site. Besides, quality cost decreased NTD 1.3 million per month as well. It is encouraging for the team to continually proceed the quality improvement with Six Sigma methodology for defect improvement in the future.

摘要
目錄
第一章 緒論
第二章 文獻回顧
第三章 研究方法
第四章 個案研究
第五章 結論
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