本研究欲開發一壓電製程平台，並利用該平台進行微型麥克風設計、分析與製作。市售商用電容式麥克風由於受到設計上諸多限制，而使得麥克風之訊雜比無法進一步提升，壓電式麥克風則受壓電材料成長品質與蝕刻困難，使得壓電式麥克風發展受限。本研究透過相較簡單的SOI (Silicon-on-insulator wafer) 製程，提出利用結構設計方式增加壓電麥克風之感測靈敏度，利用黃光微影定義出壓電膜層凸塊形狀，縮小感測電極面積，使得主體振膜與壓電膜層之間的應力分布進一步提升，可增加單一壓電麥克風之感測靈敏度，透過有限元素模擬軟體結果顯示，所設計壓電式麥克風，相較傳統設計可提升兩倍感測靈敏度，透過麥克風頻率響應量測結果，初步驗證了利用壓電材料設計微型麥克風的可行性。

This study proposes a sensitivity improving approach for MEMS piezoelectric microphones by using structral design. Compared to exsited commercial microphone constrained by several design limitations, piezoelectric microphones have great potential to achieve higher Signal-to-Noise Ratio. In application, the present design has been implemented on the Silicon-on-Insulator (SOI) wafer. By patterning piezoelectric material, stress distribution in bimorph structure can be improved. Through design different geometry, the sensitivity of piezoelectric microphone can be enhanced 190% from simulation. Reference type microphone design has been measured, and the results can verify the possibility of using piezoelectric platform to fulfill microphone design.

中文摘要 i
Abstract ii
誌謝 iii
目錄 v
圖目錄 vi
表目錄 xi
第一章 緒論 1
1-1前言 1
1-2文獻回顧 2
1-2-1 封閉式振膜壓電麥克風 3
1-2-2 開放式懸臂樑壓電麥克風 6
1-3研究動機 8
第二章 設計與分析 22
2-1感測原理 23
2-2設計概念 26
2-3開放式懸臂樑振膜設計 27
2-3-1機械靈敏度 27
2-3-1-1 平面幾何尺寸效應 27
2-3-1-2薄膜厚度效應 32
2-3-2壓電靈敏度 33
2-3-3感測電路靈敏度 35
2-3-4低頻衰減效應評估 37
第三章 製程結果 52
3-1製程流程 52
3-2製程問題討論 53
3-2-1壓電料及白金下電極乾式蝕刻 54
3-2-2光阻選擇比與光阻焦化 57
3-2-3蝕刻負載效應 57
3-3製程結果 58
第四章 量測與實驗架設 71
4-1 材料係數量測錯誤! 找不到參照來源。 71
4-1-1壓電轉換係數量測 71
4-1-2楊氏模數量測 73
4-1-3介電係數與介電損失量測 74
4-2動態量測 75
4-3性能量測 76
第四章 量測與實驗架設結論與未來工作 84
5-1結論 85
5-2未來工作 86
參考文獻 90

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