|
[1] Neely, A. (2008). Exploring the financial consequences of the servitization of manufacturing. Operations Management Research, 1(2), 103-118. [2] Hobo, M., Watanabe, C., & Chen, C. (2006). Double spiral trajectory between retail, manufacturing and customers leads a way to service oriented manufacturing. Technovation, 26(7), 873-890. [3] Phaal, R., Farrukh, C., & Probert, D. (2004). Customizing Roadmapping. Engineering Management Review, IEEE, 32(3), 80. [4] Lei, D., Hitt, M. A., & Bettis, R. (1996). Dynamic core competences through metalearning and strategic context. Journal of Management, 22(4), 549–569. [5] Barton D L. (1995). Wellsprings of knowledge: Building and sustaining the source of innovation. Long Range Planning, 29(6), 909-909. [6] Javidan, M. (1998). Core competence: What does it mean in practice? Long Range Planning, 31(1), 60–71. [7] Mascarenhas, B., Baveja, A., & Jamil, M. (1998). Dynamics of Core Competencies in Leading Multinational Companies. California Management Review, 40(4), 117-132. [8] Petts, N. (1997). Building growth on core competences – a practical approach. Long Range Planning, 30(4), 551–561. [9] Hamel, G., & Prahalad, C. K. (1994). Competing for the future. Boston, Mass. : Harvard Business School Press. [10] Zhang, Y., Shi, Y., & Zhang, P. (2009). Core competencies for commercialising emerging technologies. In The 14th Cambridge International Manufacturing Symposium, Cambridge. [11] Prahalad, C. K., & Hamel, G. (1990). The core competence of the corporation. Harvard Business Review, 68(3), 79–91. [12] Wernerfelt, B. (1984). A resource‐based view of the firm. Strategic management journal, 5(2), 171-180. [13] Penrose, E. T., & Pitelis, C. (2009). The Theory of the Growth of the Firm (4th ed.). Oxford University Press. [14] Barney, J., Wright, M., & Ketchen, D. J. (2001). The resource-based view of the firm: Ten years after 1991. Journal of management, 27(6), 625-641. [15] Brockhoff, K. (2003). Exploring strategic R&D success factors. Technology Analysis & Strategic Management, 15(3), 333–348. [16] Yoon, B., & Park, Y. (2007). Development of new technology forecasting algorithm: hybrid approach for morphology analysis and conjoint analysis of patent information. Engineering Management, IEEE Transactions on, 54(3), 588-599. [17] Sug, H. (2010). A comparison of RBF networks and random forest in forecasting ozone day. International Journal of Mathematics and Computers in Simulation, 3(4), 59-66. [18] Huang, C. C., Chu, P. Y., & Chiang, Y. H. (2008). A fuzzy AHP application in government-sponsored R&D project selection. Omega, 36(6), 1038-1052. [19] Chan, F. T. S., Chan, M. H., & Tang, N. K. H. (2000). Evaluation methodologies for technology selection. Journal of Materials Processing Technology, 107(1), 330-337. [20] Meade, L. M., & Presley, A. (2002). R&D project selection using the analytic network process. Engineering Management, IEEE Transactions on, 49(1), 59-66. [21] Postma, T. J., & Liebl, F. (2005). How to improve scenario analysis as a strategic management tool?. Technological Forecasting and Social Change, 72(2), 161-173. [22] Cheng, A. C., Chen, C. J., & Chen, C. Y. (2008). A fuzzy multiple criteria comparison of technology forecasting methods for predicting the new materials development. Technological Forecasting and Social Change, 75(1), 131-141. [23] Halal, W. E. (2013). Forecasting the technology revolution: Results and learnings from the TechCast project. Technological Forecasting and Social Change, 80(8), 1635-1643 [24] Daim, T. U., Rueda, G., Martin, H., & Gerdsri, P. (2006). Forecasting emerging technologies: use of bibliometrics and patent analysis. Technological Forecasting and Social Change, 73(8), 981-1012. [25] Vasconcelos Loureiro, A. M., Borschiver, S., & de Andrade Coutinho, P. L. (2010). The Technology Roadmapping Method and its Usage in Chemistry. Journal of technology management & innovation, 5(3), 181-191. [26] Kostoff, R. N., & Schaller, R. R. (2001). Science and technology roadmaps, IEEE Transactions on Engineering Management, 48(2), 132-143. [27] Petrick, I. J., & Echols, A. E. (2004). Technology roadmapping in review: A tool for making sustainable new product development decisions. Technological Forecasting and Social Change, 71(1), 81-100. [28] Gerdsri, N., Assakul, P., & Vatananan, R. S. (2010). An activity guideline for technology roadmapping implementation. Technology Analysis & Strategic Management, 22(2), 229-242. [29] Abraham, B. P., & Moitra, S. D. (2001). Innovation assessment through patent analysis. Technovation, 21(4), 245-252. [30] Lee, C., Park, H., & Park, Y. (2013). Keeping abreast of technology-driven business model evolution: a dynamic patent analysis approach. Technology Analysis & Strategic Management, 25(5), 487-505. [31] Jun, S., Park, S. S., & Jang, D. S. (2012). Technology forecasting using matrix map and patent clustering. Industrial Management & Data Systems, 112(5), 786-807. [32] Shane, S. (2001). Technological Opportunities and New Firm Creation. Management Science, 47(2), 205. [33] Moon, S. K., Shu, J., Simpson, T. W., & Kumara, S. R. (2010). A module-based service model for mass customization: service family design. IIE Transactions, 43(3), 153-163. [34] Jiao, Jianxin, Ma, Qinhai, & Tseng, Mitchell M. (2003). Towards high value-added products and services: mass customization and beyond. Technovation, 23(10), 809-821. [35] Shooter, Steven B, Simpson, Timothy W, Kumara, Soundar RT, & Stone, Robert B. (2005). Toward a multi-agent information management infrastructure for product family planning and mass customisation. International Journal of Mass Customisation, 1(1), 134-155. [36] Messac, A., Martinez, M. P., & Simpson, T. W. (2002). Effective product family design using physical programming. Engineering Optimization, 34(3), 245-261. [37] Park, J., Simpson, T. W., Moon, S. K., & Kumara, S. R. (2008). A dynamic multiagent system based on a negotiation mechanism for product family design. Automation Science and Engineering, IEEE Transactions on, 5(2), 234-244. [38] Johannesson, H., & Claesson, A. (2005). Systematic product platform design: a combined function-means and parametric modeling approach. Journal of Engineering Design, 16(1), 25-43. [39] Thevenot, H. J., Alizon, F., Simpson, T. W., & Shooter, S. B. (2007). An Index-based Method to Manage the Tradeoff between Diversity and Commonality during Product Family Design. Concurrent Engineering, 15(2), 127-139. [40] Da Silveira, G., Borenstein, D., & Fogliatto, F. S. (2001). Mass customization: Literature review and research directions. InternationalJjournal of Production Economics, 72(1), 1-13. [41] Meyera, M. H., & DeToreb, A. (2001). Perspective: Creating a platform‐based approach for developing new services. Journal of Product Innovation Management, 18(3), 188-204. [42] Simpson, T. W. (2004). Product platform design and customization: status and promise. AI EDAM: Artificial Intelligence for Engineering Design, Analysis and Manufacturing, 18(01), 3-20. [43] Tseng, M. M., Jiao, R. J., & Wang, C. (2010). Design for mass personalization. CIRP Annals-Manufacturing Technology, 59(1), 175-178. [44] Hidaka, K. (2006). Trends in services sciences in Japan and abroad. Quarterly review, 19(4), 35-40. [45] Fitzsimmons, J. A., & Fitzsimmons, M. J. (2004). Service management: Operations, strategy, and information technology (6th ed.). [46] Stacey, G. S., & Ashton, W. B. (1990). A structured approach to corporate technology strategy. International Journal of Technology Management, 5(4), 389-407. [47] Ernst, H. (2003). Patent information for strategic technology management. World Patent Information, 25(3), 233-242. [48] Alpaydin, E. (2010). Introduction to machine learning (2nd ed.). MIT press. [49] Haykin, S. S. (2007). Neural networks: a comprehensive foundation (3rd ed.). Englewood Cliffs, NJ: Prentice Hall. [50] Witten, I. H., & Frank, E. (2005). Data Mining: Practical machine learning tools and techniques (2nd ed.). Morgan Kaufmann. [51] Chen, L. F., Su, C. T., & Chen, M. H. (2009). A neural-network approach for defect recognition in TFT-LCD photolithography process. Electronics Packaging Manufacturing, IEEE Transactions on, 32(1), 1-8. [52] Ananda, J., & Herath, G. (2009). A critical review of multi-criteria decision making methods with special reference to forest management and planning. Ecological economics, 68(10), 2535-2548. [53] Belton, V., & Stewart, T. J. (2001). Multiple criteria decision analysis: an integrated approach (1st ed.). Springer. [54] Edwards, W., & Barron, F. H. (1994). SMARTS and SMARTER: Improved simple methods for multiattribute utility measurement. Organizational Behavior and Human Decision Processes, 60(3), 306-325. [55] Wang, H. F. (2004). Multicriteria Decision Analysis: From Certainy to Uncertainty (1st ed.). Ting Lung Book. [56] Bonissone, P. P. (1980, January). A fuzzy sets based linguistic approach: theory and applications. In Proceedings of the 12th conference on Winter simulation, 99-111. IEEE Press. [57] Chen, S. J., & Hwang, C. L. (1992). Fuzzy Multiple Attribute Decision Making Methods : methods and applications (1st ed.). Springer Berlin Heidelberg. [58] Moore, G. E. (1998). Cramming more components onto integrated circuits. Proceedings of the IEEE, 86(1), 82-85. [59] Temple, D., Malta, D., Lannon, J. M., Lueck, M., Huffman, A., Gregory, C., Robinson, J. E., Coffman, P. R., Welch, T. B., & Skokan, M. R. (2008). Bonding for 3-D integration of heterogeneous technologies and materials. ECS Transactions, 16(8), 3-13. [60] Cooper, K. A., Stead, M. D., America, S. N., Lecarpentier, G., Mottet, J. S., & St Jeoire, F. (2010, October). Flip Chip Die Bonding: An Enabling Technology for 3DIC Integration. In Proc International Wafer Level Packaging Conference 2010, 55-59. [61] Gerlach, G., & Wolter, K. J. (Eds.). (2012). Bio and nano packaging techniques for electron devices: Advances in electronic device packaging (2012 ed.). Springer. [62] Pavlidis, V. F., & Friedman, E. G. (2010). Three-dimensional integrated circuit design (1st ed.). Morgan Kaufmann. [63] Li, G., & Shi, J. (2010). On comparing three artificial neural networks for wind speed forecasting. Applied Energy, 87(7), 2313-2320. [64] Lau, J. H. (2011). Overview and outlook of through-silicon via (TSV) and 3D integrations. Microelectronics International, 28(2), 8-22. [65] Lakenan, B., Boyd, D., & Frey, E. (2001). Why Cisco fell: outsourcing and its perils. Strategy and Business, 54-65.
|