隨著產業發展許多產品日趨微小化，進行超精密加工時，以單晶鑽石為切削刀具，係目前效率較高的加工方式。由於近年來光學產業對精密度的需求越來越高，刀具磨耗無法直接以肉眼識別，必須卸離機台才能測知磨耗程度。為了減少因過度磨耗造成加工的不良品浪費，以及提高加工製程的自動化程度，本研究提出光學檢測的方法，於切削過程中以雷射光照射鑽石刀具切削工件之微結構表面，藉由量測檢測其散射特性，評估刀具的磨耗狀況。根據所得結果顯示，切削微結構之散射可有效用於判斷刀具的磨耗狀況。收集入射光左側之全部散射光束(裝置 A)之結果，可以作為刀具壽命最主要之檢測參數，另外收集指定位置散射光束(裝置 B)在 1mm 及 5mm 的檢測區域，並使用入射角 10 度、20 度及30 度檢測參數，可以用來監測刀鼻半徑磨耗小於 2.5μm 的微量磨耗，此外值得一提的是，50 度入射角適合檢測刀鼻半徑磨耗大於 2μm 的嚴重磨耗。本檢測方法對於換刀時機的掌控與切削品質的提升，將有直接的助益。

Diamond cutting is more efficient for producing optical components and the die core in ultra-precision machining. However, the effect of tool wear not only reduces the quality of machining but also causes the waste of
material and time. In order to maintain the quality of diamond cutting, the tool wear is a crucial problem to be addressed. Currently, tool wear in ultra-precision machining can not been identified directly with the naked eye. This paper provides an optical method for collecting the signal detection of laser scattering from the workpiece to monitor the tool wear. The research
proposes an innovative method for monitoring the tool wear of cutting edge radius. In this way, one can estimate the condition of the tool wear and determine the time to change the tool. As seen from the result of the experiment collecting all scattering light of the designated position using the incident angle of 10, 20 and 30 degrees are the best for monitoring tool life. The proposed method of monitoring tool life is effective for better cutting quality.

目 錄

摘要 I
Abstract II
致謝 III
目 錄 IV
圖目錄 VIII
表目錄 XII
第一章 緒論 1
1.1前言 1
1.2背景 2
1.3研究動機 4
第二章 文獻回顧 5
2.1直接檢測 5
2.1.1距離 5
2.1.2光學方法 5
2.2間接檢測 7
2.2.1 聲波發射(Acoustic Emission, AE) 7
2.2.2 切削力檢測(Cutting force) 7
2.2.3 光學方法(Optical method) 7
2.2.4 溫度(Temperature) 10
2.2.5 振動(Vibration) 10
2.3其他 10
2.4結語 10
第三章 刀具磨耗於V型溝槽微結構設計理論與模擬結果 23
3.1 刀具磨耗之設計理論 23
3.1.1切削工件v型溝槽結構 23
3.1.2刀具磨耗 24
3.2 V型溝槽微結構模型建立 26
3.2.1結構與材料參數設定 27
3.2.2光學條件設定 28
3.3模擬結果與分析 29
3.3.1 收集入射光左側之全部散射光束(裝置A) 30
3.3.2 收集指定位置散射光束(裝置B) 30
3.3.3 不同光線數量模擬 31
3.3.4 P-P 與 V-V 模擬 31
3.3.5 模擬結果 32
第四章 實驗規劃 53
4.1切削刀具與工件 53
4.1.1單晶鑽石刀具 53
4.1.2工件材料 54
4.2實驗方法與設備 54
4.2.1實驗方法 54
4.2.2實驗設備 55
4.3工件加工參數 56
4.4光路量測系統架設 57
第五章、實驗結果與模擬驗證分析 74
5.1工件與刀具磨耗關係 74
5.1.1刀具與工件SEM 74
5.1.2表面粗糙度值 75
5.2 刀具磨耗實驗結果與模擬分析-量測區域 75
5.2.1收集入射光左側之全部散射光束(裝置A) 76
5.2.2收集指定位置散射光束(裝置B) 77
5.3刀具磨耗實驗結果與模擬分析-入射角度 79
5.4 討論 80
5.4.1 工件切削結果 80
5.4.2刀具磨耗 80
第六章、結論與未來建議 104
6.1結論 104
6.2未來建議 104
參考文獻 106

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