本研究利用發展成熟之半導體標準製程，在矽基材上進行一微小化的薄膜拉伸測試。由於半導體製程中的薄膜沉積會形成特殊邊界(Nomially-Clamped)，此邊界會造成額外力矩而產生出平面變形的缺點，本研究利用這項缺點，並藉由白光干涉儀次奈米等級的出平面量測精度，達到更精確位移量測，將缺點轉成優點，萃取出更準確的薄膜機械性質。此外，提出以後組裝的方式增強其剛性比，使得拉伸過程穩定平滑。最後本研究在製程中引進高分子材料-聚對二甲苯(parylene)，利用其共型旋塗(conformal coating)的特性包覆住待測試片避免製程中物理及化學性攻擊，使可受測的材料不因製程限制。此元件結構藉由模組化的概念，設計者可以因應個別特殊需求，在晶圓上建構出合適的模組，搭配相同的製程流程，批量化製造進行微小化拉伸測試。

This study reports a novel tensile testing platform for MEMS thin films by microfabrication. Due to ‘nominally-clamped’ boundary from microfabrication, the boundary exists extra moment leading to out-of-plane deflection which is a disadvantage for MEMS designers. This study primarily changes that innate disadvantage to an advantage that can measure the out-of-plane deflection precisely by WYKO sub-nano scale measurement. We transform the weak point to the strong point to get the thin films mechanical properties precisely. Besides, we assemble the force gauge to improve the stiffness of tensile chips in order to stretch smoothly. Finally, the parylene passivation technique allows the users to change the specimens without limiting by fabrication. This chip consists of specimens, supporting springs modules and connection modules. According to user’s concerns, they can construct their own modules and extract material properties .

目錄
中文摘要 i
目錄 iii
圖目錄 v
表目錄 x
第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 2
1-3 研究目標 9
第二章 設計與分析 20
2-1 參數的萃取 21
2-1-1定力拉伸公式 22
2-1-2定位移拉伸公式 24
2-1-3公式誤差傳遞探討 26
2-2 彈簧模組設計 28
2-2-1直線型彈簧 29
2-2-2蟹腳型彈簧 29
2-2-3摺合型彈簧 30
2-3 連接模組設計 32
第三章 製程與結果 51
3-1 製程流程 51
3-2 製程討論與結果 53
第四章 量測與實驗架設 66
4-1 實驗量測系統架設 66
4-1-1 拉伸量測實驗架設 66
4-1-2 剛性之校正 67
4-2 新型拉伸實驗 68
4-2-1 定力拉伸實驗 68
4-2-2 定位移拉伸實驗 69
4-2-3 應力-應變曲線及電性量測 70
第五章 結論與未來工作 80
5-1 結論 80
5-2 未來工作 81
5-2-1 設計內嵌式位移感測模組 81
5-2-2 提高良率之新製程流程 82

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