本論文使用國家晶片中心所提供的台灣積體電路公司0.18μm CMOS製程服務，並採用靜電驅動機制，成功實現了直流接觸式微機電系統開關元件。在結構設計上，我們使用平板開關結構做為開關元件的主體，提供非常一致的垂直位移以確保觸點區域的接觸品質。而折疊式彈簧則提供較低的彈簧剛性，同時也減緩了殘餘應力所造成的翹曲變形，用以大幅降低吸附電壓。在後製程上，使用複合的濕式蝕刻方式，保留了開關電極周圍的二氧化矽材料，使得結構更能抵抗來自環境的外力。而在需要有金屬接觸的區域留下了氮化鈦/鈦薄膜，使得微機電系統開關元件能夠利用化學活性較低的氮化鈦/鈦來實現金屬接觸。本論文最大的貢獻在於使用標準CMOS製程首次實現接觸式開關，而毋須使用額外的黃光微影或金屬沈積製程，相信對於亟需整合理想開關功能的CMOS電路而言，提供了一有效解決方案。
本論文所設計的開關元件之面積為295×225 μm2，目前所量測到的最低吸附電壓為21V，接觸電阻為368Ω，切換時間小於10μs，回復時間落在18μs。在0.1–10MHz頻率下的隔離度和插入損耗則分別為84.03–71.88dB和13.38–16.15dB。

第一章 前言
1.1研究背景
1.2研究動機
1.3文獻回顧
第二章 理論分析
2.1元件設計
開關元件類別
觸點材料
開關結構
2.2機械模型
結構模型
彈簧剛性
吸附電壓
切換時間
2.3電路模型
開關電路
切換能量
第三章 製程
3.1製程平台
3.2製程流程
3.3製程結果
3.4材料分析
3.5結果討論
第四章 量測
4.1射頻量測
4.2光學量測
4.3電性量測
4.4機械量測
第五章 結論
文獻參考

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