本研究探討精簡型電腦於不同側殼開孔率、機殼材料、印刷電路板以及熱沉熱輻射放射係數對於CPU熱沉自然對流和熱輻射散熱的影響。研究中的側殼開孔一律為孔徑4mm方孔且CPU熱沉設置於印刷電路板正中央。研究發現，就熱沉自然對流散熱而言，若為塑膠機殼，則熱沉熱對流散熱瓦數隨側殼開孔率下降而上升；若為鋁機殼，則熱沉熱對流散熱瓦數隨側殼開孔率下降而下降。對於整體熱沉散熱而言，增加熱沉輻射散熱途徑會略微降低熱沉對流散熱，然而整體散熱效應則會因為增加熱輻射散熱途徑而提升。此外，若增加印刷電部板散熱則會大幅提升熱沉底部的熱對流和熱輻射散熱，使熱沉整體散熱瓦數會較無印刷電路板散熱時高。而增加熱沉熱輻射放射係數會增加整體熱沉散熱，其中熱沉正面熱輻射放射係數相較於熱沉底部熱輻射放射係數對於熱沉整體散熱有較明顯的影響。

Natural convection and radiation heat transfer from the CPU heat sink in a thin client chassis are numerically investigated with respect to different free area ratios on the front chassis, chassis materials, and heat sink emissivities. The effects of the printed circuit board (PCB) on the natural convection and radiation are also studied. In the analysis, perforations on the side chassis are square with 4 mm sides and the CPU heat sink is mounted on the center of PCB. From the analysis, natural convection heat transfer rate increases (decreases) with decreasing free area ratio for plastic (aluminum) chassis. With the presence of radiation, natural convection heat transfer rate is slightly reduced; but the overall heat transfer significantly improves due to the contribution of radiation. Increasing the heat sink surface emissivity enhances the radiation heat transfer rate. In addition, the PCB has substantial influence on the overall heat transfer, as it shares a considerable portion of the heat load through the routes across the CPU-PCB interface and the heat sink base.

第一章 緒論
1.1 研究背景
1.2 基礎原理與文獻回顧
1.3 研究動機與目的
第二章 理論基礎與模型建立
2.1 物理模型建構
2.2 數學模型
2.2.1 The Boussinesq Model
2.2.2 The Discrete Ordinates (DO) Radiation Model
2.2.3 統御方程式
2.2.4 邊界條件
2.3 數值方法
2.3.1 速度與壓力求解方式
2.3.2 其餘離散化方程式
2.3.3 相關參數
2.4 模擬參數
2.5 流固耦合計算之網格建立
第三章側殼開孔率和熱沉熱輻射對熱沉散熱影響
3.1側殼開孔率和熱沉熱輻射對熱沉對流散熱影響
3.2 側殼開孔率和熱沉熱輻射對熱沉整體散熱影響
第四章 印刷電路板對熱沉散熱影響
4.1 印刷電路板散熱與否對熱沉對流散熱的影響
4.2 印刷電路板散熱與否對熱沉輻射散熱的影響
第五章 熱沉熱輻射放射係數對熱沉散熱影響
5.1 熱沉底部熱輻射放射係數影響
5.2 熱沉正面熱輻射放射係數影響
5.3 熱沉底部和正面熱輻射放射係數比較
第六章 結論
參考文獻

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