本研究的目標是量測接合矽晶片的鍵結力量，比較以微波或傳統加熱兩種方法鍵結的力量差異，藉此來分析微波對材料的影響。矽晶片在以化學方法清潔表面後，會分別在微波系統或傳統加熱爐以同樣溫度加熱相同時間達成鍵結。微波系統是採取單模式的加熱腔體以精確地控制電場的分布以及強度。在退火之後矽晶片會以拉力測試或其他輔助性的分析方法來進行分析。
實驗結果顯示以傳統加熱來進行接合的樣品，其接合狀態及鍵結力量是與退火溫度及表面處理狀態高度相關。另一方面，以微波加熱來鍵結的樣品具有十分穩定的結果，此結果與退火溫度高度相關，卻與表面處理的狀態沒有太大的關係。在強度的量測上，兩種加熱方法的樣品一旦成功鍵結，其鍵結強度皆會提升到非常高，但微波加熱可以在較低的溫度下達到此種狀態。除此之外，微波加熱的樣品表面會產生獨特的樹枝狀結構，可能是由表面的粒子擴散所造成。這個現象也可能造成鍵結強度的差異。

The purpose of this study is trying to systematically analyze the difference between microwave and conventional annealing by measuring the bonding strength of samples prepared in each way. Silicon wafers are treated by microwave and conventional annealing at the same time and temperature right after surface processing. Single mode applicator is used here for precisely control the electric field profile and intensity. After that both group of wafers will be measured their bonding strength by tensile test along with other supportive analysis.
As a result, the performance of silicon bonding by conventional furnace was highly dependent on both temperature and the surface cleanness. On the other hand, the microwave group has consistent bonding result strongly depending just on temperature, and surface condition has nearly no influence in this case. For bonding strength measurement, both groups showed that once it was bonded successfully, the strength could be very strong. But microwave group can attain the high bonding strength at lower temperature. Apart from that, the microwave group has unique branch-like patterns on the bonding interface, which might indicates movement of diffusing charge particle. It might be related to the difference in bonding strength between the groups.

Chapter 1 Introduction and Motivation 1
Chapter 2 Literature review 4
2-1 Development and Applications of Microwave process 4
2-2 Resonant Mode in the Cavity 7
2-3 Progress of Silicon Wafer Direct Bonding 9
Chapter 3 Experimental Designs 15
3-1 Experimental Procedures 15
3-1-1 Experiment Overview 15
3-1-2 Pre-annealing Settings 16
3-1-3 Annealing Procedures 18
3-1-4 Tensile Test 20
3-2 Experiment instruments 22
Chapter 4 Results and Discussion 31
4-1 Scanning Acoustic Tomography 31
4-2 TEM/EDS 33
4-3 X-Ray Diffraction 36
4-4 Bonding Strength Measurement 38
4-4-1 Successful Rate 38
4-4-2 Tensile Test Results 42
4-5 Branch-like Pattern 45
Chapter 5 Summary 47
Reference 49

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