摘要
隨著電子元件的功率越來越大，為了有效降低散熱模組與發熱源間的表面接觸熱阻以及填補零件之間的公差，故需要使用熱介面材料(Thermal Interface Material, T.I.M.)以填補介面中的空隙，達到提升熱傳效果。本論文主要目的為以實驗方法去討論不同粒徑之氮化鋁粉末，搭配不同的高分子材料，探討其對於熱傳導係數所造成之影響。
本論文實驗分為三大部分：第一部分為T.I.M.量測平台的穩定性分析，第二部份為Thermal Pad之研發，第三部份為Dummy Heater系統熱阻性能測試。
由實驗結果可以發現，Thermal Pad量測部分利用高柏科技有限公司提供之2種樣品，T.I.M.量測平台所測得之熱傳導係數之準確性誤差皆在10%以下。而在Thermal Grease量測部分利用道康寧TC-5121，T.I.M.量測平台所測得之熱傳導係數準確性誤差都在6%以下；而在由此可得知本量測平台有良好的準確性及穩定性。在Thermal Pad實驗部分以矽凝膠為底材搭配不同粒徑氮化鋁作適當搭配可得到3.08(W/m.K)高熱傳導性之導熱片。







關鍵詞：熱介面材料、熱傳導係數、Thermal Pad、Thermal Grease。

Abstract
In order to reduce the contact thermal resistance between Cooler and CPU surface,and Fill tolerances between parts, the Thermal Interface Material (TIM) was necessary to fill the gap interface and also enhance heat transfer. The main purpose of this paper was to discuss the experimental methods conducted with using different size of aluminum nitride powder to fill the thermal pad, the effect of thermal conductivity caused by the method was also evaluated in this study.
This study include three major method: The first part was the stability analysis on T.I.M. measuring system. The second part was research and development of the Thermal Pad, and final part was the Dummy Heater performance testing for the system thermal resistance. In Thermal Pad measurement, the results shown the accuracy error within 10% in thermal conductivity compare with the data provided by T-global Technology Company. Experiment results shown the accuracy error was below 5% for TIM measuring system by using the Dow Corning TC-5121. As for the Thermal Pad experiment, silicone gel was used as the substrate and mixed with appropriate size of aluminum nitride, the thermal conductivity could reach to 3.08 W/m.K.








Key words: thermal interface material, thermal conductivity, Thermal Grease, Thermal Pad.

目　錄
頁次
摘要……………………………………………………………………………………………………………………………………………i
致謝…………………………………………………………………………………………………………………………………………iii
目錄…………………………………………………………………………………………………………………………………………iv
圖目錄………………………………………………………………………………………………………………………………………vi
表目錄………………………………………………………………………………………………………………………………………ix
第一章　緒論……………………………………………………………………………………………………………………………1
1-1前言………………………………………………………………………………………………………………………………………1
1-2研究動機及目的…………………………………………………………………………………………………………………3
1-3文獻回顧………………………………………………………………………………………………………………………………4
第二章　實驗依據及理論模式……………………………………………………………………………………………8
2-1材料的熱力性質………………………………………………………………………………………………………………10
2-2ASTM—D5470理論分析…………………………………………………………………………………………………12
2-3.1金屬材料熱傳導係數理論分析………………………………………………………………………13
2-3.2 Thermal Pad熱傳導係數理論分析…………………………………………………………15
2-3.3 Thermal Grease熱傳導係數理論分析…………………………………………………18
第三章 實驗設備與方法…………………………………………………………………………………………………19
3-1實驗設備及實驗材料……………………………………………………………………………………………19
3-1.1 T.I.M.量測平台與治具設計製作……………………………………………………………19
3-1.2電源供應器與訊號接受……………………………………………………………………………………23
3-1.3可程式邏輯控制器（Programmable Logic Controller)…………26
3-1.4 冷卻系統……………………………………………………………………………………………………………26
3-1.5 spacer之設計製作………………………………………………………………………………………27
3-1.6 T.I.M.量測平台整合主體架構…………………………………………………………………28
3-1.7 Dummy Heater熱阻測試機………………………………………………………………………31
3-1.8 Three-roll Mill(三滾筒混練機)………………………………………………………32
3-1.9真空幫浦………………………………………………………………………………………………………………32
3-1.10 烘箱…………………………………………………………………………………………………………………33
3-1.11 實驗材料…………………………………………………………………………………………………………33
3-2 儀器校正與實驗步驟……………………………………………………………………………………………………37
3-2.1 實驗前儀器校正………………………………………………………………………………………………37
3-2.1.1 檢查T型熱電偶檢查………………………………………………………………………………37
3-2.1.2 溫度表頭之效正………………………………………………………………………………………37
3-2.2熱介面材料之熱傳導係數量測操作流程……………………………………………………38
3-2.2.1 Thermal Pad………………………………………………………………………………………… 38
3-2.2.2 Thermal Grease……………………………………………………………………………………39
3-2.3 T.I.M.量測系統操作注意事項…………………………………………………………………40
3-3 Thermal Pad製作過程……………………………………………………………………………………………42
3-4 Thermal Grease製作過程……………………………………………………………………………………43
第四章 結果與討論…………………………………………………………………………………………………………44
4-1 T.I.M.量測系統穩定性分析實驗…………………………………………………………………………45
4-1.1 Thermal Pad量測系統穩定性分析結果與討論…………………………………45
4-1.2 Thermal Grease量測系統穩定性分析結果與討論…………………………55
4-2 Thermal Pad之研發………………………………………………………………………………………………60
4-2.1填充粉體選擇對於熱傳導係數影響之實驗結果及討論…………………………60
4-2.2以不同粒徑搭配對熱傳導係數影響之實驗結果及討論…………………………69
4-2.3 冷熱循環實驗、黏性測試與粉體改質之實驗與討論……………………………79
4-2.3.1 冷熱循環實驗………………………………………………………………………………………………79
4-2.3.2 導熱片黏性實驗…………………………………………………………………………………………80
4-2.3.3粉體改質之實驗及討論………………………………………………………………………………82
4-2.4利用改質氮化鋁粉製備散熱膏之實驗結果及討論……………………………………84
4-3 Dummy Heater系統熱阻測試之實驗結果與討…………………………………………………86
第五章 結論………………………………………………………………………………………………………………………89
附錄A 熱介面材料編號說明……………………………………………………………………………………………90
參考文獻 ………………………………………………………………………………………………………………………………91

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