|
[1] Bassi, A. Veggetti, L. Croce, and A. Bogliolo, “Measuring the Effects of Process Variations on Circuit Performance by Means of Digitally Controllable Ring Oscillators,” Proc. of Microelectronic Test Structures, pp. 214-217, March 2003. [2] C.-C. Chi, E. J. Marinissen, S. K. Goel, and Cheng-Wen Wu, “Post-Bond Testing of 2.5D-SICs and 3D-SICs Containing a Passive Silicon Interposer Base,” Proc. of Int’l Test Conf., pp. 1-10, Sept. 2011. [3] C.-C. Chi, E. J. Marinissen, S. K. Goel, and C.-W. Wu, “Multi-Visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base,” Proc. of Asian Test Symp., pp. 451-456, 2011. [4] P. Das, B Amrutur, H. S. Jamadagni, N.V. Arvind, and V. Visvanathan, "Within-Die Gate Delay Variability Measurement Using Re-Configurable Ring Oscillator," Proc. of IEEE Custom Integrated Circuits Conference(CICC), pp.133-136, Sept. 2008. [5] L. S. Dutta and T. Hillmann-Ruge, “Application of Ring Oscillators to Characterize Transmission lines in VLSI Circuits,” IEEE Trans. on Components, Packaging, Manufacturing Technology, vol. 18, no. 4, pp. 651–657, Nov. 1995. [6] K. S.-M. Li, C. L. Lee, C. Su, and J. E. Chen, “Oscillation Ring Based Interconnect Test Scheme for SoC,” Proc. of IEEE Asia South Pacific Design Automation Conf. (ASP-DAC), pp. 184–187, 2005. [7] K. S.-M. Li, C.-L. Lee, C.-C. Su, Y.-M. Chang, and J.-E. Chen, “IEEE Standard 1500 Compatible Oscillation Ring Test Methodology for Interconnect Delay and Crosstalk Detection,” Journal of Electronic Testing: Theory and Applications, Vol. 23, No. 4, pp. 341-355, Aug. 2007. [8] Y.-H. Lin, S.-Y. Huang, K.-H. Tsai, W.-T. Cheng, S. Sunter, Y.-F. Chou, and D.-M. Kwai, “Small Delay Testing for TSVs in 3D ICs,” Proc. of IEEE Design Automation Conf., June 2012. [9] Y.-H. Lin, S.-Y. Huang, K.-H. Tsai, W.-T. Cheng, S. Sunter, Y.-F. Chou, and D.-M. Kwai, "Parametric Delay Test of Post-Bond TSVs in 3-D ICs via VOT Analysis", IEEE Trans. on Computer-Aided Design of Electronic Circuits (TCAD), Vol. 32, No. 5, pp.-737-747, May 2013. [10] E. J. Marinissen, C.-C. Chi, J. Verbree, and M. Konijnenburg, “3D DfT Architecture for Pre-Bond and Post-Bond Testing,” Proc. of IEEE 3D Systems Integration Conf., pp. 1-8, 2010. [11] Nadeau-Dostie, J. F. Cote, H. Hulvershorn, and S. Pateras, “An Embedded Technique for At-Speed Interconnect Testing”, Proc. of IEEE Int’l Test Conf., pp. 431-438, 1999. [12] P. R. O’Brien and T. L. Savarino, “Modeling the Driving-Point Characteristic of Resistive Interconnect for Accurate Delay Estimation,” Proc. of IEEE Design Automation Conf., pp. 512–515, Nov. 1989. [13] R. Pendurkar, A. Chatterjee, Y. Zorian, "Switching Activity Generation with Automated BIST Synthesis for Performance Testing of Interconnects", IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, Vol. 20, No. 9. pp. 1143-1158, Sept. 2001. [14] S. H. Wu, D. Drmanac, L.-C. Wang, “A Study of Outlier Analysis Techniques for Delay Testing,” Proc. of IEEE Int’l Test Conf., pp. 1-10., 2008. [15] F. Ye and K. Chakrabarty, “TSV Open Defects in 3D Integrated Circuits: Characterization, Test, and Optimal Spare Allocation”, Proc. of IEEE Design Automation Conf., pp. 10240-1030, June 2012. [16] IEEE Computer Society, “IEEE Std 1149.1 TM-2001, IEEE Standard Test Access Port and Boundary scan Architecture”, IEEE, June, 2001. [17] “CIC Reference Flow for Cell-based IC Design”, Chip Implementation Center, CIC, Taiwan, Document no. CIC-DSD-RD-08-01, 2008. |