本研究是探討聯結 “封裝元件” 與 “電路板”之間的錫球焊點之可靠度，又名板級可靠度。近年來，環保意識高漲，導致無鉛焊料與無鹵電路板逐漸地取代有鉛焊料(又名錫鉛焊料)與有鹵電路板於電子產品上。相較於有鉛焊料與有鹵電路板，無鉛焊料與無鹵電路板較硬且脆。所以此二者經組裝後，錫球焊點在動態荷載下極易發生破裂，其板級可靠度值得探討。據我們所知目前並無文獻探討此二者組裝後的板級可靠度。
由於業界在錫球成份上均以導入無鉛製程，而電路板中的無鹵阻燃劑仍未完全導入。本研究將採用最常用的兩種無鉛錫球、有鹵與無鹵電路板、電路板中是否添加填充材料等三個材料因子去規劃實驗設計。以掉落衝擊與循環彎曲測試兩種方式去評估電路板受到動態彎曲之下板級可靠度。
在板級可靠度中所使用電子元件工程聯合協會（Joint Electron Device Engineering Council, JEDEC）所制定的JEDEC 22-B111規範中掉落衝擊標準板並不是完全對稱。業界常把板上九顆元件納入同一組後去分析樣品的板級可靠度，未將位置因素考慮進去。所以本研究將加入位置因素，探討其對板級可靠度的影響並與未考量位置時做一比較。比較後發現元件在電路板上位置是會影響掉落衝擊壽命。經由實驗設計分析研究結果後，建議採用標準實驗板中角落位置4顆元件去探討材料的影響，讓實驗成本低且更有效(去除位置的區集效應; Block Effect)。

Motivated by the environmental awareness, printed circuit board (PCB) with the lead free solder and halogen-free (named as PCBF) is gradually replacing the traditional PCB with (tin) lead solder and halogen PCB in most electronic products. PCBFs are harder and more brittle than traditional PCNs, and therefore the corresponding board-level is less reliable, where the board-level is defined to be the solder joint between the packaging components and PCB. There is no evidence in the literature of analyses of the board-level reliability for PCBF. This paper provides an assessment of the board-level reliability for PCBF.
In this study, drop impact and cyclic bend test are used to evaluate the board-level reliability of PCB under dynamic bending. Traditional experiments, designed by JEDEC22-B111 standard, suggest placing 9 packaging components in each testing board. Three factors considered are: (1) two kinds of lead free solder balls, (2) halogen and halogen-free PCB, and (3) PCB with or without filler.
Results show that location of each packaging component should be considered as the fourth factor since it influences the reliability for PCBF. To minimize the influence of the location factor, we suggest to place 4 packaging components into four corners in each testing board. The new experiment design is not only more effective, but also more economic compared with the traditional one.

第一章 緒論
1-1 研究背景 1
1-2 研究動機與目的 2
1-3 研究方法 3
1-4 名詞解釋 3
第二章 理論基礎
2-1 無鉛與無鹵的介紹與趨勢 4
2-2 實驗設計法介紹 9
2-3 板級可靠度概念介紹 14
2-4 統計分析方法 16
第三章 實驗之建立與評估
3-1 實驗規劃 20
3-2 實驗試片介紹 24
3-3 上板製程 26
3-4 板級可靠度之掉落衝擊試驗 27
3-5 板級可靠度之循環彎曲試驗 30
第四章 實驗結果分析
4-1 掉落衝擊試驗結果分析 33
4-2 循環彎曲試驗結果分析 44
第五章 結論與建議
5-1 結果與討論 50
5-2 建議與未來研究方向 52
參考文獻 53

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