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Chapter 1 [1-1] K. T. Park, ”A 64-Cell NAND Flash Memory with Asymmetric S/D Structure for Sub-40nm Technology and Beyond”. VLSI Tech Dig 2006:19, 2006. [1-2] N. D. Young, G. Harkin, R. M. Bunn, D. J. MaCulloch, and I. D. French, “The Fabrication and Characterization of EEPROM Arrays on Glass Using a Low-Temperature Poly-Si TFT Process” ,IEEE Trans on Electron Device, vol. 43 , 11, pp. 1930 - 1936, 1996. [1-3] M. F. Hung, Y. C. Wu, T. M. Tsai, J. H. Chen, and Y. R. Jhan, “Enhancement of Two-Bit Performance of Dual-Pi-Gate Charge Trapping Layer Flash Memory,” Applied Physics Express, vol. 5, pp. 121801-121803, 2012. [1-4] E. K. Lai, ”A Highly Stackable Thin-Film Transistor (TFT) NAND-Type Flash Memory,” VLSI Tech Dig 2006:46, 2006. [1-5] H. T. Lue, ” A highly scalable 8-layer 3D vertical-gate (VG) TFT NAND Flash using junction-free buried channel BE-SONOS device,”VLSI Technology Symposium, 2010. [1-6] A. Nitayama, ” Bit Cost Scalable (BiCS) technology for future ultra high density memories,” VLSI Technology, Systems, and Applications (VLSI-TSA), 2013. [1-7] Y. C. Wu, P. W. Su, C. W. Chang, and M. F. Hung, ”Novel Twin Poly-Si Thin-Film Transistors EEPROM With Trigate Nanowire Structure,” Electron Device Letters, 29:11, 2008. [1-8] Y. C. Wu, P. W. Su, C. W. Chang, and M. F. Hung, ” Program/Erase Characteristics of Twin Poly-Si Thin Film Transistors EEPROM with Tri-Gate Nanowires structure,” Silicon Nanoelectronics Workshop, 2008. [1-9] J. H. Oh, H. J. Chung, N. I. Lee, and C. H. Han, “High-performance polycrystalline silicon thin-film transistor with multiple nanowire channels and lightly doped drain structure,” Appl Phys Lett., vol. 84, 19, pp. 3822, 2004. [1-10] N. Gabrielyan, K. Saranti, K.N. Manjunatha, and S. Paul, “Growth of low temperature silicon nano-structures for electronic and electrical energy generation applications,” Nanoscale Research Lett., vol. 8, 83, pp. 1 - 8, 2013. [1-11] Y. C. Wu, M. F. Hung, and P. W. Su, “Improving the Performance of Nanowires Polycrystalline Silicon Twin Thin-Film Transistors Nonvolatile Memory by NH3 Plasma Passivation,” Journal of the Electrochemical Soc., vol. 158, 5, pp. H578-H582, 2011. [1-12] M. F. Hung, Y. C. Wu, J. J. Chang, K. S. Chang-Liao, “Twin Thin-Film Transistor Nonvolatile Memory With an Indium–Gallium–Zinc–Oxide Floating Gate,” IEEE Electron Device Lett., vol. 34, 1, pp. 75 - 77, 2013. [1-13] K. Kahng and S. Sze, "A floating gate and its application to memory devices," IEEE Transactions on Electron Devices, vol. 14, pp. 629-629, 1967. [1-14] J. Lee; intel, ” Design considerations for scaling FLOTOX E2PROM cell,” Electron Devices Meeting, vol.29, 1983. [1-15] G Verma; intel, ” Reliability performance of ETOX based flash memories,” Reliability Physics Symposium, 1988 [1-16] K. Naruke; Toshiba Corp, “Stress induced leakage current limiting to scale down EEPROM tunnel oxide thickness,” Electron Devices Meeting, 1988. Chapter 2 [2-1] P. Pavan, R. Bez, P. Olivo, and E. Zanoni, “Flash memory cells-an overview,” Proceedings of IEEE, Vol. 85, pp. 1248, 1997. [2-2] M. Woods, “Nonvolatile Semiconductor Memories: Technologies, Design, and Application,” C. Hu, Ed. New York: IEEE Press, ch. 3, p.59, 1991. [2-4] M. Lezlinger and E. H. Snow, J. Appl. Phys., 40, 278 (1969) [2-3] J. Moll, “Physics of Semiconductors, ” New York, NY : McGraw-Hill, 1964 [2-4] M. Lezlinger and E. H. Snow, ”Fowler‐Nordheim Tunneling into Thermally Grown SiO2,” J. Appl. Phys.,vol.40,1 ,1969. [2-5] N Kimizuka, T Yamamoto, T Mogami and K Yamaguchi, “The impact of bias temperature instability for direct-tunneling ultra-thin gate oxide on MOSFET scaling,” VLSI Technology, 1999. [2-6] K. R. Ashwani, C. Narottam and K. Vinod, “Trap Assisted Tunneling Model for Gate Current in Nano Scale MOSFET with High-K Gate Dielectrics,” World Academy of Science, Engineering and Technology, Vol. 27, 2009. [2-7] B. Eitan and D. Frohman-Bentchkowsky, “Hot electron Injection into the Oxide in n- Channel MOS-Devices,” IEEE Trans. Electron Devices., Vol. ED-28, p.328, 1981. [2-8] Joe E. Brewer, Manzur Gill, “Nonvolatile Memory Technologies with Emphasis on Flash,” ch. 4, New Jersey: Wiley-InterScience, 2008. [2-9] T. Ohnakado, K. Mitsunaga, M. Nunoshita, H. Onoda, K. Sakakibara, N. Tsuji, N. Ajika, M. Hatanaka and H. Miyoshi, “Novel Electron Injection Method Using Band- to-Band Tunneling Induced Hot Electron(BBHE) for Flash Memory with a P-channel Cell”, Electron Devices Meeting, 1995. [2-10] Roberto Bez, Emilic Camerlenghi, Alberto Modelli, and Angelo Visconti,“Introduction to Flash Memory,” Proc. IEEE, Vol. 91, pp. 489-502, 2003. [2-11] J. Van Houdt, “Reliability Issues of Flash Memory,” short course of the 14th IEEE Nonvolatile Semiconductor Memory Workshop Monterey, CA, 1995. [2-12] D. A. Baglee and M. Smayling, ”The Effects of Write/Erase Cycling on Data Loss in EEPROMs,” IEEE IEDM Tech. Dig., pp. 624-626, 1985. [2-13] Van Houdt J.F., Wellekens D., Ravazzi L., and Sangiorigi E., “Soft-programming in scaled flash memory cells,” H.C. de Graaf and H.V. Kranemburg (Eds.), Proc. ESSDERC 95, The Hague (The Netherlands), pp. 549. [2-14] P. Cappelletti, C. Golla, P. Olivo, E. Zanoni., “Flash Memories,” 2nd Ed., Norwell, Massachusetts: Kluwer Academic, 2000. Chapter 4 [4-1] A. Kranti, R. Yan, C. W. Lee, I. Ferain, R. Yu, N. Dehdashti Akhavan, P. Razavi, J. P. Colinge “Junctionless nanowire transistor (JNT): Properties and design guidelines,” Solid-State Device Research Conference (ESSDERC), 2010. [4-2] H. B. Chen, Y. C. Wu, C. Y. Chang, M. H. Han, N. H. Lu, and Y. C. Cheng, “Performance of GAA poly-Si Nanosheet (2nm) channel of Junctionless Transistors with ideal Subthreshold Slope”, VLSI symposium.2013. [4-3] H. C. Lin, C. I. Lin, and T. Y. Huang,” Characteristics of n- Type Junctionless Poly-Si Thin-Film Transistors With an Ultrathin Channel,” IEEE Electron Dev. Lett., vol.33, p.53, 2012. [4-4] H. T. Lue, S. H. Chen, Y. H. Shih, K. Y. Hsieh, and C. Y. Lu, “Overview of 3D NAND Flash and Progress of Vertical Gate (VG) Architecture,” Solid-State and Integrated Circuit Technology (ICSICT), 2012.
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