對矽光子(Silicon Photonics, SiP)技術而言，光訊號的傳輸效率與光學元件的對準精度皆為至關重要的議題。本研究首先將針對過去本實驗室設計用於耦合位在垂直側壁的邊射型雷射與平面光柵的新型光子引線，進行結構的改善與發散角補償設計；經光學損耗模擬驗證，改良後結構的插入損耗較過去的設計減少7.78dB、僅剩0.31dB，而發散角補償設計之插入損耗也改善了0.92dB。接著利用本實驗室自行架設之雙光子聚合加工系統，將新型光子引線製作於矽基板及玻璃基板上。再來開發獨立於雙光子聚合加工系統的影像辨識對位系統，驗證其對位誤差於x方向小於 ± 0.1 μm、y方向小於 ± 0.5 μm。接著透過本研究設計之影像辨識對位系統，辨識對位標記的座標後，於設計之座標位置進行雙光子聚合的二次製程，製作出對應的包覆層結構。最後，本研究實現了在同一基板上進行兩種以上光阻材料的對位製作。

For Silicon Photonics (SiP) technology, the efficiency of optical signal transmission and the alignment precision of optical components are both critical issues.
This study first focuses on improving the shape of a novel photonic wire bond (PWB) in previous research to improve the optical transmission efficiency and compensate for the insertion loss of the semiconductor laser beam divergence. Optical simulations have verified that the insertion loss of the improved novel PWB is 7.78 dB, leaving only 0.31 dB, less than that of previous designs. And the insertion loss of the divergence angle compensation design has also improved by 0.92 dB.
Then, using the Two-Photon Polymerization system established by our laboratory, the novel PWBs have been fabricated on silicon and glass substrates. Subsequently, an image recognition alignment system independent of the Two-Photon Polymerization system has been developed, verifying that its alignment error is less than ±0.1 μm in the x direction and less than ±0.5 μm in the y direction.
Subsequently, using the image recognition alignment system designed in this study, after identifying the coordinates of the alignment marks, secondary processes have been performed at the appropriate positions to create suitable clads on the existing structures. Finally, this study has successfully realized the alignment fabrication of two or more types of photoresist materials on the same substrate.

摘要---------------------------------------------------i
Abstract----------------------------------------------ii
目錄--------------------------------------------------iii
圖目錄--------------------------------------------------v
表目錄-------------------------------------------------ix
第一章、緒論---------------------------------------------1
1.1 前言------------------------------------------------1
1.2 研究背景--------------------------------------------3
1.2.1 矽光子--------------------------------------------3
1.2.2 光子引線連接技術-----------------------------------4
1.2.3 半導體雷射----------------------------------------5
1.3 文獻回顧--------------------------------------------7
1.3.1 雙光子聚合----------------------------------------7
1.3.2 自動對位-----------------------------------------12
1.3.3 混合整合(Hybrid Integration)之傳輸效率------------14
1.4 研究動機-------------------------------------------17
1.5 論文架構-------------------------------------------18
第二章、研究方法----------------------------------------19
2.1 加工系統-------------------------------------------19
2.2 光阻----------------------------------------------20
2.3 影像辨識對位系統-----------------------------------21
第三章、實驗規劃---------------------------------------25
3.1 模擬結構測試---------------------------------------25
3.1.1 彎曲式與反射式光子引線之光學傳輸效率--------------25
3.1.2 支撐結構之插入損耗影響測試-----------------------28
3.1.3 發散角(Beam Divergence)之插入損耗影響測試--------29
3.2 製程規劃-------------------------------------------31
3.2.1 反射式新型光子引線試做----------------------------31
3.2.2 二次製程對位實驗----------------------------------33
3.2.3 二次製程製作包覆層於既有之反射式新型光子引線--------34
第四章、研究結果----------------------------------------35
4.1 模擬結構測試結果------------------------------------35
4.1.1 彎曲式與反射式光子引線之光學傳輸效率測試結果--------35
4.1.2 支撐結構之插入損耗影響測試結果---------------------37
4.1.3 發散角(Beam Divergence)之插入損耗影響測試結果------38
4.1.4 模擬結構測試結果整理------------------------------39
4.2 製程驗證-------------------------------------------40
4.2.1 反射式新型光子引線試做結果-------------------------40
4.2.2 二次製程對位實驗結果------------------------------44
4.2.3 二次製程製作包覆層於既有之反射式新型光子引線結果-----45
4.2.4 二次製程之兩種以上光阻材料應用---------------------47
第五章、結論與未來展望----------------------------------49
5.1 結論-----------------------------------------------49
5.2 未來展望-------------------------------------------49
參考文獻-----------------------------------------------51

1. Ting, Y.-S., Novel Bonding Structure Design and Process Development for Connecting Edge Emitting Laser with Grating Coupler, in Power Mechanical Engineering. 2023, National Tsing Hua University.
2. Soref, R. and J. Larenzo, All-silicon active and passive guided-wave components for λ= 1.3 and 1.6 µm. IEEE Journal of Quantum Electronics, 1986. 22(6): p. 873-879.
3. Lockwood, D.J. and L. Pavesi, Silicon Photonics IV. Vol. 139. 2021: Springer.
4. Lee, K.-W., et al., Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems. IEEE Transactions on Electron Devices, 2010. 58(3): p. 748-757.
5. FiconTEC, Photonics assembly and testing – From Lab to Fab – ficonTEC. 2023. https://www.ficontec.com/.
6. Dietrich, P.-I., et al., In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration. Nature Photonics, 2018. 12(4): p. 241-247.
7. Lindenmann, N., Photonic wire bonding as a novel technology for photonic chip interfaces. Vol. 21. 2018: KIT Scientific Publishing.
8. Lipson, M., Guiding, modulating, and emitting light on silicon-challenges and opportunities. Journal of Lightwave Technology, 2005. 23(12): p. 4222-4238.
9. Baldacchini, T., Three-dimensional microfabrication using two-photon polymerization: fundamentals, technology, and applications. 2015: William Andrew.
10. He, J., T. Dong, and Y. Xu, Review of photonic integrated optical phased arrays for space optical communication. IEEE Access, 2020. 8: p. 188284-188298.
11. Hitz, C.B., J.J. Ewing, and J. Hecht, Introduction to laser technology. 2012: John Wiley & Sons.
12. Jiang, Y., et al., Organic solid-state lasers: A materials view and future development. Chemical Society Reviews, 2020. 49(16): p. 5885-5944.
13. Shimoda, K., Introduction to laser physics. Vol. 44. 2013: Springer.
14. Chang, W.S., Principles of lasers and optics. 2005: Cambridge University Press.
15. Göppert‐Mayer, M., Elementary processes with two quantum transitions. Annalen der Physik, 2009. 18(7‐8): p. 466-479.
16. Garrett, C., W. Kaiser, and W. Bond, Stimulated emission into optical whispering modes of spheres. Physical Review, 1961. 124(6): p. 1807.
17. Li, T.-Y., Development of On-line Alignment and Processing Module for Silicon Photonics Packaging with Two-Photon Lithography System, in Power Mechanical Engineering. 2023, National Tsing Hua University.
18. Snyder, B., B. Corbett, and P. O'Brien, Hybrid Integration of the Wavelength-Tunable Laser With a Silicon Photonic Integrated Circuit. Journal of Lightwave Technology, 2013. 31(24): p. 3934-3942.
19. Carroll, L., et al., Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices. Applied Sciences, 2016. 6(12).
20. Song, B., et al., 3D integrated hybrid silicon laser. Opt Express, 2016. 24(10): p. 10435-44.
21. Chang, Y.-W., Research on Photoresist and Manufacturing Process of Two-Photon Lithography System: Building the Optimum Photoresist Performance Table, in Power Mechanical Engineering. 2021, National Tsing Hua University.
22. Chang, W.-W., Photoresist Development of Two-photon Lithography Applied to Photonic Wire Bonding, in Institute of NanoEngineering and MicroSystems. 2023, National Tsing Hua University.
23. Cheng, L., et al., Grating couplers on silicon photonics: Design principles, emerging trends and practical issues. Micromachines, 2020. 11(7): p. 666.
24. Song, J.H., et al., Polarization-independent nonuniform grating couplers on silicon-on-insulator. Opt Lett, 2015. 40(17): p. 3941-4.
25. Lee, M.H., et al., Comparative Study of Uniform and Nonuniform Grating Couplers for Optimized Fiber Coupling to Silicon Waveguides. Journal of the Optical Society of Korea, 2016. 20(2): p. 291-299.
26. Jin, F., et al., λ/30 inorganic features achieved by multi-photon 3D lithography. Nature Communications, 2022. 13(1): p. 1357.
27. Chen, S.-C. Breaking the resolution and speed limit: Next-generation technology for scalable micro additive manufacturing. in Emerging Digital Micromirror Device Based Systems and Applications XIII. 2021. SPIE.