本研究針對半導體元件應用之成長趨勢及其對先進封裝技術之需求，以技術創新理論探討扇出型封裝之技術發展演進，並探討M公司因應板級封裝發展於製程設備解決方案之創新發展路徑，研究結果顯示板級封裝正以破壞性創新模式切入市場，利用市場供應鏈失衡與元件技術規格需提升之變數，拓展市場應用機會；而M公司則以開放性創新模式，擴大產業上下游合作與新技術交流，加速創新板級封裝技術發展，且達到具有整廠規劃之全方位濕製程生產解決方案，順利攫取市場新產品需破壞性創新技術之機會，創造組織成長契機，於2022年在板級封裝新產品線營收佔比成長至37%，建立轉型跨入半導體產業之重要灘頭堡。

This research uses technical innovation theory to study the technical development of fan-out package in respect to the growth trend of IC device application and its demand on advanced IC package technology. Then, innovative development roadmap on total solution of processing equipment to fan-out panel level package in M company is discussed as well. The result reveals that panel level package, as a disruptive innovation, enters package industry and catches up the application opportunity by use of parts shortage problem in supply chain and demand on better specification of new devices. For M company, it adopts open innovation strategy and extends frontend and backend partners’ cooperation to speed up innovative panel level package technology development to be a total solution for wet-process production plant design. Therefore, M company successfully seizes the opportunity of new device demand on disruptive innovative technology. In 2022, the ratio of panel level package product portfolio income rapidly grew to 37% of M company’s revenue. This recognition by semiconductor industry symbolizes an important beachhead for M company’s transformation toward high added value technology.

摘 要 i
Abstract ii
誌 謝 辭 iii
目 錄 iv
圖目錄 v
第一章 緒 論 7
第一節 研究背景與動機 8
第二節 研究目的與議題 9
第三節 研究方法與流程 9
第二章 文獻探討 11
第一節 技術創新理論回顧 11
第二節 技術創新理論於創新技術之應用 19
第三章 個案背景 23
第一節 個案公司之化學濕製程核心技術與產品 25
第二節 個案公司板級半導體封裝技術及產品 28
第四章 個案研究 30
第一節 市場發展 30
第二節 個案公司與板級封裝之技術創新發展 39
第五章 結論與建議 50
第一節 結論 50
第二節 建議 51
參考文獻 53

中文文獻
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英文文獻
Azémar, J. (2015). Fan-Out and Embedded Die: Technologies & Market Trend. Yole Développement.
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網路資源
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