本研究旨在探討企業在技術路徑方面是如何產生差異以及產生差異的原因。我們採用質性比較個案法，分析聯電和台積電技術路徑的發展歷程。技術路徑是一個演化以及組織層級的創新過程，並由路徑依賴和路徑創造共構而成。本研究使用主題模型的方法來辨別技術路徑中的路徑依賴和路徑創造，並分析它們對企業技術路徑結構的影響。我們的研究指出，聯電和台積電分別採用兩種不同的策略－技術融合（聯電）和技術深化（台積電）。由於兩家企業策略上的差異，使得它們產生相異的技術路徑結構。最後，我們的研究除了對技術路徑結構差異的來源提供豐富的解讀外，也從組織結構的觀點指出策略行動如何影響技術路徑的結構。

This is a comparative case study of two Taiwan-based Integrated Circuits (IC) foundry firms, UMC and TSMC, aiming to examine how firms develop and build their technological paths over time. The technological path is as an evolutionary, organization-level process of innovation, characterized by both the path-dependent and path-creating natures that build on each other. We draw on a topic modeling approach to distinguish between path dependence and path creation, and to discern into their different effects on the structuring of technological path inside a firm. Two different strategies were identified in the two firms – technology blending (in UMC) and technology deepening (in TSMC), serving as generative mechanisms for spawning a diversity in sources of technological advance that characterize distinctive technological paths, accounting for path difference across the two focal firms. Overall, our central contribution is an organizational structuring view of technological paths, whereby actions create structures.

誌謝 I
摘要 II
ABSTRACT III
TABLE OF CONTENTS IV
LIST OF TABLES VI
LIST OF FIGURES VI
CHAPTER 1 INTRODUCTION 1
CHAPTER 2 THEORETICAL BACKGROUND 4
2.1 INNOVATION CAPABILITY AND TECHNOLOGICAL PATHS 4
2.2 PATH DEPENDENCE AND PATH CREATION 5
CHARPTER 3 REASERCH METHOD 7
3.1 CASE SELECTION 7
3.2 TOPIC MODELING APPROACH 7
3.3 MEASURING TOPIC SIMILARITY AND TECHNOLOGICAL DIVERSIFICATION 9
3.4 DATA COLLECTION 10
3.5 DATA PRE-PROCESSING 14
3.6 OPTIMAL NUMBER OF TOPICS 15
CHARPTER 4 RESULTS 18
4.1 TOPIC ANALYSIS 18
4.2 TECHNOLOGICAL PATHS OF UMC AND TSMC 21
4.3 UMC’S TECHNOLOGICAL PATHS UNFOLDING 23
Memory 25
Lithography process 26
Fabrication and structure of semiconductor device 26
Manufacturing system 27
4.4 TSMC’S TECHNOLOGICAL PATHS UNFOLDING 28
SRAM 28
Fabrication and structure of semiconductor device 28
Process and environmental control 29
Lithography process, and manufacturing system 30
4.5 COMPARISON BETWEEN UMC AND TSMC 31
CHARPTER 5 DISCUSSION 34
5.1 FROM STRATEGIC ACTIONS TO THE STRUCTURE OF TECHNOLOGICAL PATHS 34
5.2 THEORETICAL IMPLICATIONS 36
5.3 PRACTICAL IMPLICATIONS 37
5.4 LIMITATIONS AND FUTURE RESEARCH 38
CHARPTER 6 CONCLUSION 39
REFERENCES 40

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