本論文設計並製作出一個雙模態近接感測單元及觸覺感測陣列垂直整合感測器，本研究將積體電路技術與軟性材料電路板製進行整合，以達到可應用於機械手臂之人類仿真皮膚。製程上使用 TSMC 0.35m 2P4M CMOS 標準製程定義電路，將兩個模態的感測器垂直整合在兩片雙層軟性電路板。近接感測單元大小範圍為20 mm×20 mm；觸覺感測陣列大小範圍為16 mm×16 mm，感測單元大小為2 mm×2 mm，陣列數目為8×8 。
近接感測單元因物體接近造成感測結構的電容變化；觸覺感測陣列因壓力產生位移的變化造成感測結構的電容變化，兩者都會藉由時序選取電路結合CDS(Correlated Double Sampling)電路放大或縮小訊號，再以取樣保持電路取樣資料。採用NI(National Instruments) PCIE系統控制感測電路的時序，以達到分時分段擷取訊號的目的。
量測結果顯示近接感測的感測度為0.14 〖mm〗^(-1)(0 mm至2 mm)、0.048 〖mm〗^(-1)(2 mm至5 mm)、0.0045 〖mm〗^(-1)(5 mm至10 mm)，電路的雜訊為188.9 〖μV〗_rms，最遠可感測的距離為15 mm，最小解析度為0.002 mm(0 mm至2 mm)、0.005 mm(2 mm至5 mm)、0.058 mm(5 mm至15 mm)；觸覺感測的感測度為2.29 MPa^(-1)，電路的雜訊為450 〖μV〗_rms，最大應力感測範圍為353 kPa，最小解析度為0.254 kPa。

This paper designs and fabricates a dual-mode proximity sensing unit and a tactile sensing array integrated vertically into a sensor, aiming for application in humanoid robotic arms with human-like skin. The process involves integrating integrated circuit (IC) technology with flexible printed circuit board (FPCB) fabrication to achieve the desired result. The circuits are defined using the TSMC 0.35μm 2P4M CMOS standard process, and the dual-mode sensors are vertically integrated on two double-layer flexible printed circuit board. The size of the proximity sensing unit is 20 mm×20 mm, and the size of the tactile sensing array is 16 mm×16 mm , with each sensing unit measuring 2 mm×2 mm, arranged in an 8×8 array.
The proximity sensing unit detects changes in capacitance of the sensing structure due to the proximity of objects, while the tactile sensing array detects changes in capacitance of the sensing structure caused by pressure-induced displacement. Both are amplified or attenuated using time-division multiplexing circuits combined with Correlated Double Sampling (CDS) circuits, followed by sample-and-hold circuits for data acquisition. National Instruments (NI) PCIE system is used to control the timing of the sensing circuit to achieve time-division multiplexing of signals.
Measurement results show that the sensitivity of the proximity sensing is 0.14 〖mm〗^(-1)(0 mm to 2 mm),0.048 〖mm〗^(-1)(2 mm to 5 mm),0.0045 〖mm〗^(-1)(5 mm to 10 mm), with circuit noise is 188.9 〖μV〗_rms, maximum detectable distance is 15 mm, and minimum resolution is 0.002 mm(0 mm to 2 mm),0.005 mm(2 mm to 5 mm),0.058 mm (5 mm to 15 mm).The sensitivity of the tactile sensing is 2.29 MPa^(-1), with circuit noise is 450 〖μV〗_rms , a maximum stress sensing range is 353 kPa,and a minimum resolution is 0.254 kPa.

摘要 I
Abstract II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 XI
第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 2
(a) 壓力感測 3
(b) 近接感測 4
(c) 近接感測及壓力感測整合型感測器 6
1-3 研究動機 7
第二章 感測結構設計與模擬 9
2-1 感測器整體系統架構介紹 9
2-2 感測器工作原理 10
2-2-1 電容式近接感測 10
2-2-2 電容式觸覺感測 13
2-3 結構設計與模擬 17
2-3-1 電容式近接感測 18
2-4-2 電容式觸覺感測 24
第三章 電路設計與模擬 29
3-1 電路工作原理 29
3-2 Correlated Double Sampling Amplifier ( CDS ) 31
3-3 取樣保持電路 36
3-4 迴授電容選擇架構 37
3-5 寄生電容消除電路 40
3-6 陣列選擇控制電路 42
3-7 運算放大器電路設計及模擬 44
3-8 感測電路模擬結果 52
第四章 接近及觸覺感測系統實現 55
4-1 軟電路板整合CMOS晶片的佈局考量 55
4-2 感測結構製作 57
4-3 電路板設計 64
第五章 量測結果與討論 65
5-1 量測儀器介紹 65
5-2 電路量測 67
5-3 近接感測模態量測 68
(a) 定量量測 69
(b) 定性量測 73
5-4 觸覺感測模態量測 78
(a) 定量量測 79
(b) 定性量測 81
5-5 雜訊量測以及Allan方差量測 82
第六章 結論與未來工作 85
6-1 研究結果 85
6-2 未來工作 85
參考文獻 87

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