製程參數回饋控制系統(Run-to-run, RtR, R2R)為製造業為維持製程穩定度常使用的製程控制方法，然而，R2R導入評估仍須透過一連串的實驗、模擬、建構，為找到一流程協助評估R2R導入，是以進行本研究。
本研究為求提升製程穩定度、找到最佳R2R方法，基於半導體乾蝕刻製程收集數據後，透過模擬方法，加入前製程因子之影響，以簡單移動平均(Simple Moving Average, MA)、加權移動平均指數(Weighted Moving Average, WMA)與指數移動平均(Exponentially Weighted Moving Average, EWMA)進行模擬，探討R2R系統的有效性並以製程能力指標(Process Capability Index, Cpk)與檢定確認結果。
本研究結論，加入前製程因子影響後，改善不顯著，使用MA, WMA, EWMA之R2R都有顯著改善，EWMA有最佳的改善率，但經檢定後差異並不顯著。

R2R(Run-to-run, RtR) is a process control method commonly used in the manufacturing industry to maintain process stability. However, the evaluation of R2R introduction still requires a series of experiments, simulations, and constructions. The purpose of this study is to find a process for evaluating R2R introduction.
In order to improve the process stability and find the best R2R method, this study collects data based on the semiconductor dry etching process, and adds the influence of the pre- process factors through the simulation method, using MA(Simple Moving Average) and WMA(Weighted Moving Average) and EWMA(Exponentially Weighted Moving Average are simulated to explore the effectiveness of the R2R system and the results are confirmed by Cpk(Process Capability Index) and verification.
The conclusion of this study is that after adding the influence of pre-process factors, the improvement is not significant, and the R2R of MA, WMA, and EWMA are all significantly improved. EWMA has the best improvement rate, but the difference is not significant after verification.

目錄
摘要……………………………………………………………………………………………i
Abstract……………………………………………………………………………………ii
誌謝…………………………………………………………………………………………iii
目錄…………………………………………………………………………………………iv
表目錄………………………………………………………………………………………vi
圖目錄………………………………………………………………………………………vii
第一章 緒論…………………………………………………………………………………1
1.1 研究背景…………………………………………………………………………1
1.2 研究目的…………………………………………………………………3
1.3 預期改善方法…………………………………………………………………6
1.4 研究步驟…………………………………………………………………………8
第二章 文獻回顧………………………………………………………………………10
2.1 蝕刻率……………………………………………………………………10
2.2 Run-to-run………………………………………………………………………10
2.3 模擬及決策模型……………………………………………………………11
2.4 統計製程管制圖與製程能力指標…………………………………………12
2.5 預測與移動平均……………………………………………………………15
第三章 研究方法………………………………………………………………………17
3.1 研究流程…………………………………………………………………………17
3.2 資料來源…………………………………………………………………………18
3.3 資料處理…………………………………………………………………………19
3.4 分析工具…………………………………………………………………………22
3.5 執行模擬…………………………………………………………………………23
第四章 資料驗證與分析…………………………………………………………………26
4.1 模擬方式說明……………………………………………………………………26
4.2 驗證結果分析……………………………………………………………………29
第五章 結論與未來展望…………………………………………………………………37
5.1 結論………………………………………………………………………………37
5.2 未來展望…………………………………………………………………………38
參考文獻……………………………………………………………………………………40

英文文獻
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網路資源
1.應用材料公司，蝕刻，
(https://www.appliedmaterials.com/tw/zh_tw/semiconductor/semiconductor-technologies/etch.html)