隨著資訊時代對資料傳輸的要求逐漸上升，傳統積體電路的效能已不足以支撐高數據通量的使用，而光子積體電路(Photonic Integration Circuit, PIC)有著積體電路(Integration Circuit, IC)無法達到的高頻寬傳輸能力，因此是作為數據中心與資料中心的首選。
面對PIC內封裝的問題，目前主流的耦光方式主要有兩種，分別是邊緣耦合與光柵耦合。而德國KIT(Karlsruher Institut für Technologie) Christian Koos教授團隊，提出一種光子引線技術(Photonic Wire Bonding, PWB)來嘗試解決元件間封裝整合不易的問題。PWB是透過雙光子微影技術，將高透光性之高分子聚合物材料以3D列印的方式製作在光學元件間達成傳輸效果，此方法的優點在於不需要進行主動對準即可有效的將光訊號傳送至目標端。
然而，在PWB的文獻連線案例中，尚無針對邊射型雷射連結光柵耦合器的案例存在，過去在製作光柵耦合器上微結構的文獻中，也以輔助光纖耦光為主，連線至光源本體文獻較少。
因此，本研究使用KIT所提出之PWB的概念，利用雙光子微影技術，完成邊射型雷射連結至光柵耦合器的連線結構設計，此結構可以在完成元件結合的同時，依靠PWB不需主動對準和光柵耦光器穩定模場優點，使得輸出模場能夠與使用光纖耦合光柵耦合器一樣。
研究內容包含模擬、結構設計與製程三大部分。在研究初期已根據KIT之研究，設計PWB軌跡算法，供需要兩點連線的狀況作使用。在模擬與結構設計階段，借鑒了光子積體電路內波導彎曲的常用概念作為參考來設計結構，並使用模擬軟體測得其傳輸能力約為-11dB。最後在製程階段，使用本實驗室自架之雙光子微影壓電系統，成功實現所設計之新型引線結構，並且誤差皆低於0.5μm。

With the increasing demand for data transmission in the information age, the performance of traditional integrated circuits (ICs) has become inadequate to support high-data-rate applications.Photonic Integrated Circuits (PICs) offer superior high-bandwidth transmission capabilities, making them ideal for data centers and communication networks.
To address packaging challenges within PICs, two main coupling techniques are used: edge coupling and grating coupling. In addition, Professor Christian Koos and his team at Karlsruher Institut für Technologie (KIT) proposed an innovative approach called Photonic Wire Bonding (PWB) to overcome integration issues. PWB utilizes two-photon lithography to 3D-print high-transparency structure for efficient signal transmission without requiring active alignment.
This research aims to apply the PWB concept from KIT and use two-photon lithography to design a wire bonding structure connecting edge-emitting lasers to grating couplers. The structure eliminates the need for active alignment and ensures stable mode profiles comparable to fiber-coupled grating couplers.
The research includes simulation, structural design, and fabrication stages, with promising results achieved using self-built two-photon lithography system.
Finally, the simulated transmission rate of the designed structure was approximately -11 dB. Additionally, the fabrication results, after measurement, exhibited tolerance consistently below 0.5 μm compared to the design.

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vi
表目錄 ix
第一章 緒論 1
1.1前言 1
1.2 文獻回顧 2
1.2.1 雙光子微影 2
1.2.2光子積體電路 6
1.2.3 Photonic Wire Bonding 11
1.4 論文架構 18
第二章 研究方法 19
2.1 雙光子聚合曝光系統 19
2.2 人機介面與加工流程 20
2.3 PWB軌跡演算法 21
第三章 實驗規劃 24
3.1 PWB軌跡演算法求解器 24
3.2 加工環境介紹 27
3.3 光阻材料選擇 29
3.4 實驗流程 35
第四章 實驗結果 37
4.1模擬與結構設計 37
4.1.1 光柵基礎特性測試 37
4.1.2 彎曲半徑結構傳輸效率測試 40
4.1.3 光斑放大器 43
4.1.4 PWB軌跡演算法傳輸效率測試 46
4.1.5 新型引線結構設計 49
4.2製程設計 52
4.2.1 試片製備 52
4.2.2 新型引線結構路徑規劃與結果 53
第五章 結論與未來展望 60
5.1結論 60
5.2未來展望 60
參考資料 62

參考資料
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