在先進封裝技術中，扇出型面板級封裝(Fan-Out Panel-Level Packaging，FO-PLP )因其薄型化、高I/O數、異質整合等優勢，近年來受到業界所重視且未來將成為封裝生產主力。然而，扇出型面板級封裝雖有大面積製造優勢，但其製程過程中引起的翹曲現象易發生後續製程和電子元件良率等問題。對於封裝製程上的可行性以及後續可靠度問題，結構翹曲為迫切解決之問題，而造成該翹曲行為主要歸因於結構內部相異材料間熱膨脹係數不匹配導致。欲改善翹曲的現象通常需要大量實驗進行開發與研究，而時間與經費的成本將不容小覷。因此多數研究採用有限元素模擬分析探討製程翹曲之議題。故此，本研究將建立重新佈線層優先之扇出型面板級封裝多尺度模型製程導向模擬技術。在製程導向模擬時，使用等效材料方法考慮封裝結構較為複雜之重新佈線層(Redistribution Layer，RDL)與微凸塊(Micro Bump)結構，同時，加入等效材料之製程參考溫度的影響，並且考量到模封材料在固化過程中引起的化學收縮量。由於扇出型面板級封裝厚度極薄，自身重力將不容忽視，故在載具模型底部將會設置接觸元素施加重力場效應。此外 於重新佈線層優先之扇出型面板級封裝製程中有著切割之步驟；經過分割後對於模型的建構勢必會出現多尺度上的問題，本研究之其一創新特點在於多尺度模型將會一次性地完整建構；期間使用到多點約束(Multipoint Constraint，MPC)來連接不同尺度下的模型。MPC方程式將被視為多尺度模型的橋樑，確立製程模擬後會與實驗載具進行模擬技術之階段驗證；分別在面板級與單位封裝體。模擬結果指出單位封裝體在不同位置下會有相異的翹曲表現。此模擬方法將有利於後續重新佈線層優先之扇出型面板級封裝製程之開發與研究。

With the advantage of high I/O account, thin substrate, and good heterogeneous ability, the fan-out panel-level packaging (FO-PLP) has become a major topic for the future design of novel packaging. Despite of the enlarged area of the panel-level package, the process-induced warpage may cause a serious yielding problem in the subsequent process and assembly for the package. The process-induced warpage would be an urgent issue need to be solved for the FO-PLP. The coefficient of thermal expansion (CTE) mismatch between the materials is the main cause of the warpage. The process temperature for material is also a factor need to be considered. The tremendous cost of time for investigating the effect between materials through experiment is a problem that cannot be ignored. Therefore, the finite element analysis (FEA) is proposed in many researches to overcome the problem of time cost. Another issue is the discontinuous model and warpage after the sawing process from panel to stripe, and stripe to unit package. In this research, a redistribution layer (RDL) first FO-PLP is presented with integrated multiple scale of package model in FEA analysis. The complicated fine RDL and micro-bump is considered with the equivalent materials method and the equivalent stress-free temperature in the process-orientation simulation. The chemical shrinkage of molding underfill (MUF) is also concerned for the material characteristic. The effect of gravity cannot be ignored in the simulation due to the large area of FO-PLP. A rigid plane is constructed on the bottom of model to give a reference plane for the FEA. To give an entire process flow simulation, the saw process of panel to stripe and stripe to package is presented. The saw process must have a multiple scale problem in the FEA. Therefore, the multipoint constraint (MPC) is applied on the boundary of multiple scale model. The estimated warpage from the FEA is verified with measured warpage from experiment for three process steps, panel-level, stripe-level, and single unit package. The measured warpage of a single unit package is found that the position of package on the stripe-level would determine the warpage. The presented methodology for FEA also indicated the same results as the experiment. The warpage error between the simulation and experiment are below 10 %. Accordingly, the presented simulation methodology is validated, which can be utilized to estimate the warpage of FO-PLP. The factor and the material for the process can be further optimized based on the proposed methodology with FEA.

摘要 I
ABSTRACT III
目錄 VI
圖目錄 VIII
表目錄 X
第一章 緒論 1
1.1 前言 1
1.2 電子封裝技術發展簡介 2
1.3 文獻回顧 5
1.3.1 等效材料方法於有限元素模擬之應用 6
1.3.2 扇出型封裝翹曲模擬分析 11
1.4 研究動機 16
1.5 研究目標 18
第二章 基礎理論 19
2.1 等效材料機械特性 19
2.1.1 等效材料機械性質之模擬估算法 19
2.1.2 等效材料之製程模擬參考溫度 23
2.2 次模型模擬分析技術之建立 32
2.3 熱固性高分子聚合物之機械特性 35
2.3.1 固化反應行為 35
2.3.2 固化收縮之力學分析 36
第三章 多尺度重新佈線層優先之扇出型面板級封裝製程模擬方法 42
3.1 重新佈線層優先之扇出型面板級封裝實驗載具 42
3.2 重新佈線層優先之扇出型面板級封裝製程導向模擬分析 45
3.2.1 製程導向模擬分析流程 45
3.2.2 多尺度模型與邊界條件的設定 47
第四章 多尺度重新佈線層優先之扇出型面板級封裝製程模擬分析結果與討論 52
4.1 網格收斂性分析 52
4.2 重新佈線層優先之扇出型面板級封裝翹曲模擬與實驗驗證 55
4.2.1 Panel階層下翹曲之驗證與討論 55
4.2.2 Strip階層下翹曲之驗證與討論 58
4.2.3 Unit package階層下翹曲之驗證與討論 60
第五章 結論與未來展望 64
5.1 結論 64
5.2 未來研究方向 64
參考文獻 66

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