銅合金高導電與耐磨的特性，應用於電子工業與機械製造業，其中銅鈹合金使用最多，但鈹元素高成本與具毒性，故材料設計與使用仍受限制。近年著重發展CuNiSi 合金，此系統具良好強度與導電度。大多研究以低鎳矽銅合金研究，較少有高含量鎳矽之研究，在此類銅合金常見介金屬物，影響合金強度與加工之機械性質。
因此，本研究高鎳矽之CuNiSiCrFeSn 合金系統，分別透過熱機處理、室溫高溫性質分析及成份調質深入研究。探討導電銅合金之熱機製程，對其微結構與磨耗性質的影響。研究均質化溫度熱處理對微結構影響，並以700°C 、750°C、800°C、850°C、900°C下之高溫壓縮實驗，研究CuNiSiCrFeSn合金於高溫加工之流變應力曲線。透過分析計算，探討本研究合金之預測組合方程式、活化能圖及熱加工圖。研究結果顯示高鎳矽之CuNiSiCrFeSn合金，具有連續介金屬相，室溫拉伸分析結果顯示合金為脆性破斷特徵，YS 314 MPa、UTS 530 MPa及伸長率 11%。
為提升其加工性與兼顧強度，研究調整鎳矽含量並微量添加Ti，設計兩款無介金屬之單相CuNiSiFeSnTi 合金，其均質化處理，拉伸伸長率分別是 22% 及 17%。探討熱機處理，450°C 及 500°C 時效溫度對析出強化影響，比較鎳矽添加量對時效軟化之現象。綜合比較本研究結果顯示，高鎳矽CuNiSiCrFeSn 合金最佳之時效熱處理具有硬度314 HV 與導電率22.2 %IACS；經過調質改良之兩款CuNiSiFeSnTi合金，最佳尖峰時效，其硬度與導電率分別可達 253 HV 及 25.9 %IACS以及325 HV 及 22.5 %IACS。以室溫黏著磨耗及高溫250°C黏著磨耗測試，將本研究開發之上述合金與 C17200 商用銅鈹合金比較，模擬實際材料使用壽命。結果顯示，室溫下CuNiSiFeSnTi合金，因磨屑細小且圓滑，摩擦係數下降，故提升磨耗阻抗為 C17200 之1371%。高溫磨耗時，合金表面形成之保護層，提升高溫磨耗性質，阻抗為 C17200 之359%。

Copper alloys have high electrical conductivity and wear resistance, and are used in the electronics and machinery manufacturing industry. The beryllium copper alloys are used the most widely. Beryllium elements are expensive and toxic, so the applctions are still limited for material design. In recent years, the research of CuNiSi alloy is the main system because of high strength and electrical conductivity. However, most alloys are low-nickel-silicon-copper alloys. In this system, intermetallics affect the strength of the alloy and the mechanical properties of processing, but few of high-content nickel-silicon alloys are stuied.
Therefore, in this study, the CuNiSiCrFeSn alloy with high nickel and silicon was researched with thermal-mechanical treatment, the mechanical and eletriacl properties are analized at room and elevated temperature, and the new alloys are designed. After thermomechanical process of the present alloys, the microstructure and wear properties are compared to C17200. The effect of homogenization temperature heat treatment on the microstructure was studied firstly, and the flow stress curve of CuNiSiCrFeSn alloy was studied by high temperature compression experiments at 700°C, 750°C, 800°C, 850°C, and 900°C. Through mathematical analysis and calculation, the predicted combination equations, activation energy maps and processing maps of the alloys are established. The high nickel-silicon CuNiSiCrFeSn alloy is shownn the continuous intermetallic phase, and characterized by brittle fracture, YS 314 MPa, UTS 530 MPa and elongation 11% after tensile test at room temperature.
To improve the workability and strength, the concentration of nickel and silicon are adjusted, and small amount of Ti are added. Two single-phase CuNiSiFeSnTi alloys without intermetallicare are designed. The elongation of as-homogenized state is the 22% and 17% respectively. The effects of aging temperatures on precipitation strengthening and the effect of Ni-Si addition on aging softening was studied at 450°C and 500°C.
The peak aged high nickel-silicon CuNiSiCrFeSn alloy has a hardness of 314 HV and a conductivity of 22.2 %IACS; the two CuNiSiFeSnTi alloys the hardness and conductivity achieve 253 HV 25.9 %IACS and 325 HV and 22.5 %IACS respectively.
Those alloys were estimated service life and compared to the C17200 commercial copper beryllium alloy by adhesive wear test at ambiemt temperature and at 250°C. Thewear resistance of CuNiSiFeSnTi alloy is 1371% higher than C17200, because the low friction coefficient contributes by a small and smooth wear debris at room temperature. The wear resistance is 359% higher than that of C17200 at high temperature wear, since the glazing layer formed on the surfaces increased wear resistance at the high temperature.

壹、前言 ...1
貳、文獻回顧...3
2-1 時效析出... 3
2-2 高強度高導電銅合金...7
2-3 CuNiSi銅合金系統...10
2-4 高溫 Gleeble 壓縮...25
2-5 乾式磨耗...40
參、研究方法...45
3-1 合金成份與實驗流程...46
3-2 真空電弧熔煉 (Vacuum arc melting, VAM)...48
3-3 熱機處理...48
3-4 微結構與晶體結構分析...49
3-5 機械性質與導電性質分析...50
肆、結果與討論...55
4-1 N7熱加工製程圖...55
4-2 新型銅合金設計...76
4-3 尖峰時效態磨耗分析...91
4-4 尖峰時效態之250°C高溫磨耗性質...100
4-5 尖峰時效態機械性質綜合比較...109
伍、結論...111
陸、本研究之貢獻...113
柒、未來研究方向...114
捌、參考文獻...115

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