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[1] F. Zahoor, T. Z. A. Zulkifli, and F. A. Khanday, “Resistive random access memory (RRAM): An overview of materials, switching mechanism, performance, multilevel cell (MLC) storage, modeling, and applications,” Nanosc. Res. Lett., vol. 15, no. 1, p. 90, 2020 [2] S. Tehrani, “Status and outlook of MRAM memory technology,” in Proc. Int. Electron Devices Meeting, pp. 1–4, 2006 [3] W. Kang et al., “Variation-tolerant and disturbance-free sensing circuit for deep nanometer STT-MRAM,” IEEE Trans. Nanotechnol., vol. 13, no. 6, pp. 1088–1092, 2014 [4] S. G. Sarwat, ‘‘Materials science and engineering of phase change random access memory,’’ Mater. Sci. Technol., vol. 33, no. 16, pp. 1890–1906, 2017 [5] T. Mikolajick et al., “Next generation ferroelectric material for semiconductor process integration and their applications,” J. Appl. Phys., vol. 129, no. 10, p. 100901, 2021 [6] T. Schenk et al., “About the deformation of ferroelectric hystereses,” Appl. Phys. Rev., vol. 1, no. 4, p. 41103, 2014 [7] F. P. G. Fengler, “Domain pinning: Comparison of Hafnia and PZT based ferroelectrics,” Adv. Electron. Mater., vol. 3, no. 4, p. 1600505, 2017 [8] T. S. Böscke, J. Müller, D. Bräuhaus, U. Schröder, U. Böttger, “Ferroelectricity in hafnium oxide thin films, ” Appl. Phys. Lett. 99, 102903, 2011 [9] J. Müller et al., “Ferroelectricity in simple binary ZrO2 and HfO2,” Nano Lett., vol. 12, no. 8, pp. 4318–4323, 2012 [10] M. Pesic, U. Schroeder, S. Slesazeck, and T. Mikolajick, “Comparative study of reliability of ferroelectric and anti-ferroelectric memories,” IEEE Trans. Device Mater. Rel., vol. 18, no. 2, pp. 154–162, 2018 [11] J. Bouaziz, P. R. Romeo, N. Baboux, R. Negrea, L. Pintilie, and B. Vilquin, “Dramatic impact of pressure and annealing temperature on the properties of sputtered ferroelectric HZO layers,” APL Mater., vol. 7, no. 8,. 2019 [12] M. Materano, D. Patrick Lomenzo, A. Kersch, M. H. Park, T. Mikolajick, and U. Schroeder, “Interplay between oxygen defects and dopants: Effect on structure and performance of HfO2-based ferroelectrics,” Inorganic Chem. Frontiers, vol. 8, pp. 2650–2672, 2021 [13] Y. Zhou, Y. K. Zhang, Q. Yang, J. Jiang, P. Fan, M. Liao, and Y. C. Zhou, “The effects of oxygen vacancies on ferroelectric phase transition of HfO2-based thin film from first-principle,” Comput. Mater. Sci., vol. 167, pp. 143–150, 2019 [14] J. Hur et al., “Direct comparison of ferroelectric properties in Hf0.5Zr0.5O2 between thermal and plasma-enhanced atomic layer deposition,” Nanotechnology, vol. 31, no. 50, 2020 [15] T. Mittmann, F. P.G. Fengler, C. Richter, M. H. Park, T. Mikolajick, and U. Schröder, “Optimizing process conditions for improved Hf1−xZrxO2 ferroelectric capacitor performance,” Microelectron. Eng., vol. 178, pp. 48–51, 2017 [16] T. Schenk et al., "Complex Internal Bias Fields in Ferroelectric Hafnium Oxide," ACS Applied Materials & Interfaces, vol 7, pp. 20224-20233, 2015 [17] H. J. Kim et al., “A study on the wake-up effect of ferroelectric Hf0.5Zr0.5O2 films by pulse-switching measurement,” Nanoscale, vol. 8, no. 3, pp. 1383–1389, 2016 [18] P. J. Liao et al., ‘‘Characterization of fatigue and its recovery behavior in ferroelectric HfZrO,’’ in Proc. Symp. VLSI Technol., p. T52, 2021 [19] M. Peši´c et al., “Physical mechanisms behind the field-cycling behavior of HfO2-based ferroelectric capacitors,” Adv. Funct. Mater., vol. 26, no. 25, pp. 4601–4612, 2016 [20] A. K. Tagantsev, I. Stoilichnov, and N. Setter, "Polarization fatigue in ferroelectric films: Basic experimental findings, phenomenological scenarios, and microscopic features", J. Appl. Phys., Vol. 90, pp. 1387-1402, 2001 [21] S. Starschich, S. Menzel, and U. U. Böttger, “Evidence for oxygen vacancies movement during wake-up in ferroelectric hafnium oxide,” Appl. Phys. Lett., vol. 108, no. 3, pp. 32903-1–32903-5, 2016 [22] C. Pike and A. Fernandez, “An investigation of magnetic reversal in submicron-scale Co dots using first order reversal curve diagrams,” J. Appl. Phys., vol. 85, pp. 6668–6676, 1999 [23] S. Li, D. Zhou, Z. Shi, M. Hoffmann, T. Mikolajick, and U. Schroeder, “Involvement of unsaturated switching in the endurance cycling of Si-doped HfO2 ferroelectric thin films,” Adv. Electron. Mater., vol. 6, no. 8, pp. 2000264, 2020 [24] S. Li, D. Zhou, Z. Shi, M. Hoffmann, T. Mikolajick, and U. Schroeder, ‘‘Temperature-dependent subcycling behavior of Si-doped HfO2 ferroelectric thin films,’’ ACS Appl. Electron. Mater., vol. 3, no. 5, pp. 2415–2422, 2021 [25] G. A. Boni et al., “Multiple polarization states in symmetric ferroelectric heterostructures for multi-bit non-volatile memories,” Nanoscale, vol. 9, no. 48, pp. 19271–19278, 2017 [26] K. Ni, J. Smith, H. Ye, B. Grisafe, G. B. Rayner, A. Kummel, and S. Datta, “A novel ferroelectric superlattice based multi-level cell non-volatile memory,” in IEDM Tech. Dig., pp. 669–712, 2019 [27] K. Lee et al., “Stable subloop behavior in ferroelectric Si-doped HfO2,” ACS Appl. Mater. Interface, vol. 11, no. 42, pp. 38929–38936, 2019 [28] Hao-Kai Peng, Chia-Ming Liu, Yu-Cheng Kao, Pin-Jiun Wu, and Yung-Hsien Wu, “Improved Immunity to Sub-Cycling Induced Instability for Triple-Level Cell Ferroelectric FET Memory by Depositing HfZrOx on NH3 Plasma-Treated Si,” IEEE Electron Device Lett., vol. 43, no. 8, pp. 1219-1222, 2022 [29] M. H. Park, H. J. Kim, Y. J. Kim, W. Lee, T. Moon, and C. S. Hwang, “Evolution of phases and ferroelectric properties of thin Hf0.5Zr0.5O2 films according to the thickness and annealing temperature,” Appl. Phys. Lett., vol. 102, no. 24, p. 242905, 2013 [30] Khakimov, R. R., Chernikova, A. G., Lebedinskii, Y., Koroleva, A. A., and Markeev, A. M., “Influence of the Annealing Temperature and Applied Electric Field on the Reliability of TiN/Hf0.5Zr0.5O2/TiN Capacitors.” ACS Appl. Electron. Mater., vol 3, pp. 4317–4327, 2021 [31] M. G. Kozodaev, A. G. Chernikova, E. V. Korostylev, M. H. Park, R. R. Khakimov, C. S. Hwang, and A. M. Markeev, “Mitigating wakeup effect and improving endurance of ferroelectric HfO2-ZrO2 thin films by careful La-doping,” J. Appl. Phys., vol. 125, no. 3, 2019 [32] M. Hoffmann, T. Schenk, M. Peši´c, U. Schroeder, and T. Mikolajick, “Insights into antiferroelectrics from first-order reversal curves,” Appl. Phys. Lett., vol. 111, no. 18, 2017 [33] A. Stancu, D. Ricinschi, L. Mitoseriu, P. Postolache, and M. Okuyama, “First-order reversal curves diagrams for the characterization of ferroelectric switching,” Appl. Phys. Lett., vol. 83, no. 18, pp. 3767–3769, 2003. [34] R. Cao, Y. Wang and S. Zhao, "Effects of capping electrode on ferroelectric properties of Hf0.5Zr0.5O2 thin films," IEEE Electron Device Lett., vol. 39, no. 8, pp. 1207-1210, 2018. [35] S. H. Kim, H. Park, K. H. Lee, S. H. Jee, D. J. Kim, Y. S. Yoon and H. B. Chae, "Structure and mechanical properties of titanium nitride thin films grown by reactive pulsed laser deposition," J. Ceram. Process. Res., vol. 10, no. 1, pp. 49-53, 2009 [36]S. J. Kim, D. Narayan, J.-G. Lee, J. Mohan, J. S. Lee, J. Lee, H. S. Kim, Y.-C. Byun, A. T. Lucero, C. D. Young, S. R. Summerfelt, T. San, L. Colombo, and J. Kim, “Large ferroelectric polarization of TiN/Hf0.5Zr0.5O2/TiN capacitors due to stress-induced crystallization at low thermal budget,” Appl. Phys. Lett., vol. 111, no. 24, p. 242901, 2017 [37] J. Hur, Y.-C. Luo, N. Tasneem, A. I. Khan, S. Yu, “Ferroelectric hafnium zirconium oxide compatible with back-end-of-line process,” IEEE Transactions on Electron Devices, early access, 2021. [38] V. Gaddam, D. Das, and S. Jeon, “Insertion of HfO2 seed/dielectric layer to the ferroelectric HZO films for heightened remanent polarization in MFM capacitors,” IEEE Trans. Electron Devices, vol. 67, no. 2, pp. 745–750, 2020 [39] T. Onaya, T. Nabatame, N. Sawamoto, A. Ohi, N. Ikeda, T. Chikyow, and A. Ogura, “Improvement in ferroelectricity of HfxZr1−xO2 thin films using ZrO2 seed layer,” Appl. Phys. Express, vol. 10, no. 8, pp. 081501-1–081501-4, 2017 [40] W. Xiao et al., “Performance improvement of Hf0.5Zr0.5O2 based ferroelectric-field-effect transistors with ZrO2 seed layers,” IEEE Electron Device Lett., vol. 40, no. 5, pp. 714–717, 2019
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