應用鑽石切割線切割矽晶圓被認為是最具有效率、低污染及低切削損失的一項晶圓切割技術。製作晶圓切割線時為了將鑽石粉固定於高碳鋼線上，通常需要在電鍍鎳浴中同時將鎳金屬及鑽石粉沉積於高碳鋼線上，此步驟稱之為上砂。由於鑽石粉不具導電性無法直接上砂，因此在上砂之前需先將不具導電能力之鑽石粉以無電鍍鎳程序將之金屬化。此外在上砂的過程中，金屬化的鑽石粉的磁性會影響其線上鑽石顆粒密度，但無電鍍鎳沉積過程中會有磷的共沉積，使其磁性喪失，因此須將含無電鍍鎳之鑽石粉再進行電鍍純鎳以提高磁性以利上砂。換言之，為了顧及上砂的品質，原始的鑽粉需要經過無電鍍以及電鍍的程序，造成金屬化鑽粉的製程較繁瑣，成本也較高。
相較於鎳，鈷具有較強的磁性，甚至與其他金屬合金後依然可以保有高磁性。因此在此研究中，我們開創一種新的方法來將鑽石粉金屬化，就是利用無電鍍鈷或鈷鎳合金技術，在將鑽石粉金屬化過程中同時賦予磁性，如此一來可以不需後續的粉體電鍍程序。此新式方法不僅可使製程縮短及簡化，並同時保有高磁性。除此之外，可以藉由無電鍍液中的鈷鎳離子濃度來控制鎳鈷合金鍍層的元素比例進而控制其磁性。實驗結果顯示上砂後之線上鑽石顆粒密度，可藉由鍍層磁性的控制，達到高於商用鑽石粉之每100微米有68顆鑽石，也能控制低於商用之32顆鑽石，充分展現可控性。
本研究中發現在上砂的過程中，金屬化後的鑽石粉會被上砂電鍍液所腐蝕，導致喪失磁性與導電性，藉由退火後所產生晶相進行耐腐蝕比較，得知Ni2P具有優異的抗腐蝕性能，因此我們藉由磷化在無電鍍鈷鎳鑽石粉外面生成Ni2P以保護內層金屬不被腐蝕。商用電鍍鎳鑽石粉浸泡在上砂電鍍液中2小時後，在鑽石粉表面金屬剩餘接近0%，而鈷鎳鑽石粉在未處理的情況下可以保留35%之金屬，有磷化後鑽石粉還可保有高達80%金屬殘留，顯示了在鑽石粉磷化之優異抗腐蝕效果。

Diamond wire sawing (DWS) is considered most efficient for wafer slicing in terms of low cutting loss and low slurry waste. One of the key technical goals of DWS technology is to firmly attach diamond powder (DP) onto steel wire. This process is called sand tacking and is achieved by electroplating nickel film and DP simultaneously onto steel wire. To facilitate sand tacking, the magnetism of nickel-coated DP is important as it affects the tacking-on-density significantly. Because the electroless plating nickel (ELP Ni) layer contains the phosphor (P), it will lose its magnetism significantly. To enhance magnetism of nickel-coated DP, additional electroplating of pure nickel overlayer must apply on pre-electroless Ni/P-coated DP.
Compared with nickel, cobalt (Co) has stronger magnetism, and it can maintain high magnetic properties even when alloying with other elements. Consequently, in the first part of this study we attempt to develop an unprecedented approach to complete the metallization of DP for the DWS industry by using ELP Co/Ni alloy without the need for additional electroplating steps. This single-step method allows efficient DP metallization process while maintaining good magnetic property. More importantly, the magnetism of resultant ELP Co/Ni film is easily manipulated by controlling the stoichiometry of metal precursors in the ELP bath. The morphology, chemical composition, magnetic property, and mass increment of ELP Co/Ni film on the DP are carefully characterized. Sand tacking on steel wire confirms that tacking-on-density of DP is proportional to the magnetism of ELP Co/Ni DP. Our study provides a controllable and cost-effective process for the metallization of DP for DWS.
In the second part of this study, we found that the metal on diamond powders would be corroded by the electroplating solution, leading to loss of magnetism and conductivity. Through the comparison of the different crystal phases from the metal film after annealing, we found that Ni2P has excellent corrosion resistance. Therefore, we generated Ni2P on the metalized DP by phosphorization to protect the inner metal. Compared with commercial electroplating DP, the Ni2P, Co-Ni DP has 80% of metal remained after immersed in the electroplating solution for 2 hours while the commercial one has no metal remained on its surface under the same circumstance. Thus, the results of this study showed the excellent anti-corrosion effect produced by the phosphorization of diamond powder.

摘要 I
Abstract II
誌謝 IV
總目錄 V
圖目錄 VIII
表目錄 XII
第一章 緒論 1
1-1 前言 1
第二章 文獻回顧 3
2-1 矽晶圓切片技術 3
2-1-1 矽晶圓切片發展 3
2-1-2 線切割技術 6
2-1-3 鑽石切割線 10
2-2 無電鍍沉積 13
2-2-1 無電鍍沉積原理 13
2-2-2 無電鍍鎳與鈷的反應機制 14
2-2-3 無電鍍鍍液組成及功用 15
2-2-4 鑽石粉金屬化 17
2-3 物質的磁性 18
2-3-1 物質磁性成因 18
2-3-2 磁學分類 20
2-3-3 鐵磁性物質的磁滯曲線 26
2-4 鍍鎳鑽粉的腐蝕現象 28
2-4-1 腐蝕機制 28
2-4-2 腐蝕型態分類 30
2-4-3 防腐蝕方法 32
2-5 研究目的與動機 35
第三章 實驗 36
3-1 實驗藥品 36
3-2 設備與儀器 37
3-2-1 掃描式電子顯微鏡(Scanning electron microscope, SEM) 37
3-2-2 能量散射X射線譜(Energy-dispersive X-ray Spectroscopy, EDS) 39
3-2-3 感應耦合電漿原子發射光譜儀(Inductively Coupled Plasma Optical Emission Spectrometry, ICP-OES) 39
3-2-4 超導量子干涉磁力儀(Superconducting Quantum Interference Device Magnetometer, SQUID) 40
3-2-5 X光繞射儀 (X Ray Diffractometer, XRD) 42
3-3 實驗方法 43
3-3-1 自吸附奈米鈀 (ETAS-PVA-Pd) 觸媒合成 43
3-3-2 無電鍍液藥水配置 43
3-3-3 鑽石粉無電鍍沉積 44
3-3-4 上砂槽配置與流程 45
3-3-5 電鍍腐蝕液配置及腐蝕模擬 47
3-3-6 無電鍍鈷鎳鑽石粉退火 48
3-3-7 鑽石粉上製備Ni2P塗層 48
第四章 結果與討論 50
4-1 無電鍍鈷系統 50
4-1-1 無電鍍鈷鑽石粉之鍍層組成與沉積速率 50
4-1-2 無電鍍鈷鍍層附著力測試 54
4-1-3 無電鍍鈷鑽石粉之磁性 56
4-1-4 無電鍍鈷鑽石粉上砂 57
4-2 無電鍍鎳鈷合金系統 58
4-2-1 無電鍍鎳鈷合金鑽石粉 58
4-2-2 無電鍍鈷鎳合金鑽石粉磁性 65
4-2-3 無電鍍鈷鎳合金鑽石粉上砂 67
4-3 無電鍍鎳鈷鑽石粉之腐蝕現象及改善 69
4-3-1 退火對於金屬化鑽石粉之抗腐蝕影響 72
4-3-2 退火對於無電鍍鈷鑽石粉之磁性影響 78
4-4 無電鍍鎳鈷鑽石粉之抗腐蝕 81
4-4-1 鈷鎳鑽石粉二次無電鍍之晶相變化 84
4-4-2 無電鍍鈷鎳鑽石粉磷化之晶相變化 86
4-4-3 無電鍍鈷鎳鑽石粉磷化之抗腐蝕行為 89
4-4-4 無電鍍鈷鎳鑽石粉磷化後之磁性影響 91
第五章 結論 94
第六章 未來展望 96
第七章 參考文獻 97

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