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作者(中文):賴昕皞
作者(外文):Lai, Hsin-Hao
論文名稱(中文):研究在微波領域利用類表面電漿極化子差分線結構減少串間干擾
論文名稱(外文):Reduction of Crosstalk Noise Using Spoof Surface Plasmon (SSP) Polariton Differential Pair Structures in the Microwave Region
指導教授(中文):柳克強
指導教授(外文):Leou, Keh-Chyang
口試委員(中文):李志浩
張家豪
口試委員(外文):Lee, Chih-Hao
Chang, Chia-Hao
學位類別:碩士
校院名稱:國立清華大學
系所名稱:工程與系統科學系
學號:108013513
出版年(民國):112
畢業學年度:111
語文別:中文
論文頁數:102
中文關鍵詞:差分對高頻傳輸遠端串擾微帶線類表面電漿極化子
外文關鍵詞:Differential pairHigh frequency transmissionFar-end crosstalkMicrostripSpoof surface plasmon polariton
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由於電信產業中傳輸速率需求越來越高,差分線被廣泛應用在PCB 上進行訊號傳輸。為了保持好的訊號完整性,必須縮小相鄰差分線之間的串間干擾,以避免訊號失真。根據乙太技術路線2020,傳輸速率在未來十年內預計達到1.6TbE/800GbE,因此在有限的電路板面積下,設計差分傳輸線的尺寸大小變得非常重要。
為了克服這些挑戰,本研究提出一種以tab 形狀利用spoof surface plasmon
polariton 的特性建立差分傳輸線的方法。這種方法不需要增加額外的電路板面積,卻可以減少差分訊號傳輸線之間的串間干擾。
研究結果顯示,在頻率大於67.5 GHz 後,採用tab_2 差分對結構的遠端串擾低於傳統差分對結構,在目標80 G Hz 改善了1 dB,達到 12 dB,而在71 和93 GHz 相較於傳統差分線,都降低了16.5 dB 的遠端串擾,但距離在高頻傳輸線的遠端串擾目標 20 dB 還需要改善3.5 dB 左右。但從研究模擬解果意味著在頻率範圍67.5 至100 GHz 的高頻傳輸中,tab_2 週期性差分對結構確實符合研究的設想,相較於傳統差分對結構,在相同的間距下具有較低的遠端干擾。這有助於提高訊號傳輸的完整性並有效降低高頻傳輸下的串間干擾。
因此,本研究的主要貢獻在於提出了一種新的差分傳輸線結構,並通過模擬和比較分析證明了其在高頻範圍內具有較低的遠端串擾。這對於高頻電路和通訊系統的設計和性能優化具有重要意義。
As the demand for higher transmission speeds in the telecommunications industry continues to grow, differential lines are widely used on printed circuit boards (PCBs) for signal transmission. In order to maintain good signal integrity, it is important to minimize crosstalk between adjacent differential transmission lines to avoid signal distortion. According to the Ethernet technology roadmap for 2020 [1], transmission speeds are expected to reach 1.6 TbE/ 800GbE in the next decade, making it crucial to design differential transmission lines with appropriate dimensions within limited PCB space.

To overcome these challenges, this study proposes a method of establishing differential transmission lines using tab shapes and exploiting the characteristics of spoof surface plasmon polaritons (spoof SPPs). This approach does not require additional circuit board area but can reduce the crosstalk between the differential signal transmission lines.

The research results show that, after a frequency of 67.5 GHz, the tab_2 differential pair structure exhibits lower far-end crosstalk than the traditional differential pair structure. At the target frequency of 80 GHz, the far-end crosstalk is improved by 1 dB, reaching -12 dB. Additionally, at 71 and 93 GHz, the far-end crosstalk is reduced by 16.5 dB compared to the traditional differential lines. However, achieving the target far-end crosstalk of -20 dB at high-frequency transmission lines requires an improvement of approximately 3.5 dB.

Nevertheless, the simulation results suggest that the tab_2 periodic differential pair structure indeed fulfills the envisioned objectives in the frequency range of 67.5 to 100 GHz, as it demonstrates lower far-end interference than the traditional differential pair structure at the same spacing. This contributes to enhancing the integrity of signal transmission and effectively reducing crosstalk at high-frequency transmission.

Therefore, the primary contribution of this study lies in proposing a novel differential transmission line structure and demonstrating, through simulation and comparative analysis, its lower far-end crosstalk in the high-frequency range. This holds significant implications for the design and performance optimization of high-frequency circuits and communication systems.
目錄
摘要------------i
Abstract-------ii
目錄-----------iv
圖目錄---------vi
第一章 簡介-----1
1.1研究背景------1
1.2 類表面電漿極化子之簡介----------------------------------------1
1.2.1 表面電漿( Surface plasmon )------------------------------- 1
1.2.2 表面電漿極化子( Surface plasmon polaritons )---------------2
1.2.3 類表面電漿極化子( Spoof Surface Plasmon Polaritons )--------5
1.2.4 週期性結構-------------------------------------------------5
1.3研究目的------------------------------------------------------8
第二章 文獻回顧---------------------------------------------------9
2.1 Spoof SPP結構[6]---------------------------------------------9
2.2 Tabbed lines- Intel[10]-------------------------------------12
2.3 非均勻的 tabbed microstrip lines[11]-------------------------14
2.4 均勻的 tabbed microstrip lines[12]---------------------------19
2.5 T形狀的週期性凹槽[13]----------------------------------------22
第三章 物理模型與研究方法----------------------------------------25
3.1 模擬軟體介紹-------------------------------------------------25
3.1.1 HFSS -有限元素分析法 (Finite element momentum)-------------26
3.1.2 ADS – 矩量法(Method of moments)----------------------------28
3.2 差分傳輸線(Differential pair)--------------------------------31
3.3 串間干擾(crosstalk)------------------------------------------38
3.4 眼圖(eye-diagram)[18]--------------------------------------39
第四章 模型------------------------------------------------------43
4.1 單一結構分析(unit-cell):--------------------------------------43
4.1.1 收斂條件設定:-----------------------------------------------43
4.1.2 電磁場分布:-------------------------------------------------46
4.2 差分對結構:--------------------------------------------------52
4.2.1收斂條件及板材設定-------------------------------------------52
4.2.2 差分對電場結果----------------------------------------------54
4.2.3 S-parameter:-----------------------------------------------56
4.3 高頻下的單一週期性結構分析(unit-cell):-------------------------59
4.3.1 板材以及單一晶胞差分對之幾何結構設定:-------------------------60
4.3.2 邊界及收斂條件設定:------------------------------------------63
4.3.3 電磁場分布:-------------------------------------------------65
4.4 高頻下的差分線對結構:------------------------------------------71
4.4.1 收斂條件及板材設定:------------------------------------------72
4.4.2 差分對內的間距以及兩對差分對距離設定:-------------------------75
4.4.3 傳統差分對:-------------------------------------------------78
4.4.4 Tab_2之SPP差分對:------------------------------------------80
4.4.5 傳統與tab_2之SPP差分對之比較:-------------------------------82
第五章 結論------------------------------------------------------84
參考文獻----------------------------------------------------------85


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