IC設計服務公司除提供客戶IP設計能力外，半導體的供應鏈管理也是其核心服務。而IC設計服務業者並未擁有生產製造的功能，需完全仰賴於供應鏈廠商支援。與一般IC設計業者相比，其並無自有產品，且客戶來源廣泛、需求多樣化，導致供應鏈管理範疇更大且更難以掌握實際需求。加上半導體供應鏈在新技術及不同國家間角力的催化下，以往未遭遇的新挑戰不斷出現且速度越來越快。在此狀況下，IC設計服務業者對於供應源管理的風險探討已成為一個重要議題。

本研究採用以「卡拉傑克矩陣」採購組合分析為架構，以其內容核心「利潤影響」及「供給風險」為基礎分析，本研究透過文獻上的回顧並結合產業專家意見，有系統地探討影響IC設計服務業者利潤與風險的關鍵要因。結果發現影響IC設計服務業者利潤之要因分別1.採購占比(48.3%)、2.技術先進程度(39.8%)及3.可預見的需求成長(11.9%)。而風險因為要因複雜而歸納出四大構面，按重要性排序為1.供應商風險(40.3%)、2.原物料風險(26.5%)、3.半導體市場環境風險(20.1%)及4.程序與控制風險(12.8%)。以個別要因來看，則以(1).原物料之短缺風險(14.4%)、(2).半導體環境市場之法律條文與變化(13.2%)，及(3).供應商之技術不可取代性(12.4)%為前三大之風險要因來源。

進一步結合上述兩要因，將個案供應鏈品項進行定位以辨識出關鍵品項。結果發現除晶圓多數品項外，封裝品項中之「FCBGA封裝」、「CoWoS封裝」及「打線基板封裝」都落於策略象限，而「導線架封裝」與「FCCSP封裝」則落於瓶頸象限。可發現封裝品項也成為IC設計服務公司中需要被關注的品項。

最後，探討如何改善IC設計服務業者對於供應源管理的關鍵供應品項，本研究針對關鍵品項的關鍵風險要因提出11項改善方案，預期能減少晶圓及封裝品項所面臨的風險，進而有助於個案公司達成供應鏈管理的目標。其結果並可作為後續供應商管理的重要參考依據，經結合買賣權力關係分析，可進一步探討供應鏈品項在不同狀況之供應商下會有何不同的管理意義。

Besides the IP design capability, the supply chain management is the core competence of IC design service house. Especially, IC design service house owns no manufacturing line, all components and processes dependents on suppliers. Furthermore, in contrast to IC design house, design service house faces the extensive source of customer and the complex applications. Moreover, it has no own products. The reasons bring about more difficulties in handling the actual demand in this complex supply chain environment. New challenge that keeps happening at increasing rate was caused by new technology and competition between nations. In this situation, the investigation on supply risk of sourcing management is start to be more important.

The “Kraljic Matrix” model is adopted in this research to purchasing analysis of IC design service. The “Profit impact” and “Supply risk” were the research foundation. The research investigated the key factors that impact to profit and risk combines with literature and expert opinion by the systematic approach. The result shows the factors of profit impact were 1. The value of purchase (forty-eight percent). 2. Technological advance (forty percent). 3. Expected growth in demand (twelve percent). Moreover, the supply risk was divided to 4 aspects due to the great complexity. The 4 aspects were 1. Supplier risk (forty percent). 2. Material/Components risk (twenty-seven percent). 3. The environment risk of semiconductors. (twenty percent). 4. Control and procedures risk (thirteen percent). By factors to review, the top three were (1). The shortage risk of material/components (fourteen percent). (2). The change of trade law for semiconductor environment (thirteen percent). (3). The irreplaceability of suppliers’ technology (twelve percent)

In addition, this research indicated the right position of key supply chain items via evaluates these factors one by one. The result shows the assembly items becomes more critical than before. The “Flip-chip BGA”, “CoWoS” and” Wire-bond substrate” were be classified to strategy item. The “Lead-frame” and “Flip-chip CSP” were be classified to bottleneck item.

Finally, this research discusses how to improve the key factors of key supply chain items. This research proposed eleven action plans and estimated to reduce the supply risk of wafer and assembly items then help close to the target of supply chain management. For future research, the matrix result also could be the basis to develop the strategy of supplier management. It could continue to discover the significance of management between different buyer-supplier relationship in the future.

第一章 緒論......................................1
1.1 產業背景.....................................1
1.1.1 服務範圍與營利模式..........................1
1.1.2 設計服務業者之核心競爭力與供應鏈管理之關係....2
1.1.3 客戶需求與產業特性..........................4
1.2 研究動機.....................................5
1.2.1 個案公司觀察現象............................5
1.2.2 痛、望點分析................................7
1.3 研究目的.....................................8
1.4 研究流程與架構................................9
1.5研究限制......................................10
第二章 文獻回顧...................................11
2.1 採購組合分析..................................11
2.1.1 採購管理發展過程............................11
2.1.2 採購組合分析介紹............................13
2.2卡拉傑克矩陣...................................16
2.2.1 卡拉傑克象限轉移之策略.......................20
2.2.2 卡拉傑克研究案例............................22
2.2.3 買賣權力分析................................25
2.3 供應鏈風險....................................27
2.3.1 供應鏈管理範疇..............................28
2.3.2 風險定義....................................28
2.3.3 風險系統與要素..............................29
2.4 群體決策法....................................35
2.5 多準則決策....................................38
2.5.1 多準則決策應用...............................38
2.5.2 多準則決策下成對比較之洞見.................47
第三章 問題定義、研究架構與方法.....................50
3.1 問題定義......................................50
3.1.1 研究對象與問題定義...........................50
3.1.2 卡拉傑克模式組合解析.........................51
3.2 研究步驟......................................52
3.3 研究方法......................................54
3.3.1 柏拉圖分析..................................54
3.3.2 修正式德菲法................................55
3.3.3 成對比較法..................................56
3.3.4 建構卡拉傑克模型.............................58
3.3.5 卡拉傑克象限轉移.............................60
3.3.6 供應商偏好分析...............................61
第四章 個案分析....................................62
4.1個案介紹........................................62
4.1.1 產業特色.....................................62
4.1.2個案採購現況..................................63
4.2 個案分析.......................................63
4.2.1 組織專家團隊.................................63
4.2.2 確認關鍵供應鏈品項............................64
4.2.3 確認利潤影響與供給風險要因.....................68
4.2.4 確認利潤影響及供給風險之要因權重...............78
4.2.5 建構卡拉傑克模型與分析........................88
4.2.6 象限轉移之策略運用結果........................90
4.2.7 供應商偏好分析與應用..........................94
第五章 結論與建議...................................96
5.1 研究發現與貢獻..................................96
5.1.1研究發現.......................................97
5.1.2研究貢獻.......................................98
5.2 未來研究方向....................................100
參考文獻............................................101
附錄................................................106
附錄1：德菲法問卷....................................106
附錄2：DEMATEL問卷...................................107
附錄3：兩兩成對比較之問卷.............................109
附錄4：個案供應鏈品項於卡拉傑克兩維度分數總覽表.........110
附錄5：個案供應鏈品項之專家給分一覽表..................111
附錄6：個案卡拉傑克象限分布圖..........................112

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網路資料
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