固態硬碟(Solid State Drive , SSD)比傳統硬碟(Hard Disk Drive, HDD)在嚴苛的環境中更耐用，因為它們沒有機械部件。SSD 可以承受衝擊、振動和極端溫度、體積輕薄、消耗功率低。由於 SSD 愈來愈小，隨著產品多樣化，零件佈局愈設計愈密集。生產過程的表面粘著技術 (Surface Mount Technology, SMT) 使用的零件尺寸不得不微型化。0201尺寸在現代零件市場使用佔比逐漸升高。本研究旨在SMT製程中，減少0201尺寸的電容製程缺陷，提高產品良率和減少生產損失。
本研究首先將顧客關注的品質議題轉化到公司內部的產品規格，找出影響出貨品質的「關鍵品質要素」為PCBA的銲錫性。接著採用「田口方法」探討鋼板（Stencil）開孔、印刷(Printing)和置件(Mounting)的精度、迴銲爐(Reflow oven)的溫度曲線以及PCB上0201銲墊（Pad）間距，期望以較少的實驗次數，找到最佳生產條件，提升SMT的銲接強度與降低品質變異。
研究結果發現0201零件銲墊間距0.2mm對於改善立碑缺陷和增強銲錫性最為顯著。銲接應力平均提高6%，標準差降低28%，SMT製程良率從98.5%提高到99.5%。本研究應用田口方法在SMT製程中得到了最佳參數組合。達成了提升產量、減少報廢、降低生產成本，提高產品品質的預訂目標。

The SSDs are more durable than HDDs in strict and extreme environments because they don’t have mechanical parts. SSDs can endure shocks, vibration, extreme temperatures better than HDDs. The other advantage is their small size and lower power. Since SSDs are getting thinner and compact as the diversifying product grows, the size of components adopted for the Surface Mount Technology (SMT) become smaller and the density of layout becomes significantly greater. The 0201 chips have grown in the modern component market and will continue to increase as time goes on. This study started from reducing SMT defects of 0201 size Capacitor for the improvement of product yield and production lose.
The product quality of customer requirement will be transferred to the specifications of product in company-wide. The solderability of PCBA is critical to quality for products shipped out. The Taguchi Methods were applied to check apertures on stencil, accuracy of printer and mounter, temperature profile in reflow oven and distance between pads on PCB with less experiments, hoping to minimize variation in SMT process and quality for the optimized yield.
Implementation results showed that the 0.2mm of distance between pads of 0201 chips is the most effective to improve the defect of tombstoning issue as well as the solderability enhancement. The experiment performed quality characteristics of soldering force increased 6% .and standard deviation decreased 28%. Over all the SMT yield were improved from 98.5% to 99.5%. The optimal condition obtained by the Taguchi methods has significantly reduced the scrap and production cost and improve the throughput and product quality.

目錄 V
圖目錄 VII
表目錄 IX
第 1 章 緒論 1
1.1 背景 1
1.2 動機 3
1.3 目的 4
1.4 論文架構 5
第 2 章 文獻探討 6
2.1 SMT 介紹 6
2.1.1 銲接原理 6
2.1.2 SMT製程 7
2.2 田口方法 11
2.2.1 品質工程 11
2.2.2 影響品質特性的參數 12
2.2.3 直交表 13
2.2.4 信號雜音比 14
2.2.5 最佳因子水準組合 15
2.3 文獻探討 16
第 3 章 研究方法 18
3.1 品質關鍵要素 19
3.2 田口參數設計步驟 20
第 4 章 個案分析 23
4.1 現況問題描述 23
4.2 關鍵品質要素 23
4.2.1 歷史數據分析 25
4.2.2 立碑異常原因分析 27
4.2.3 設定研究目標 29
4.3 設計實驗 30
4.4 執行實驗及收集數據 36
4.5 資料分析 37
4.6 確認實驗 40
4.7 效益分析 44
第 5 章 結論與建議 46
5.1 結論 46
5.2 產業貢獻 46
5.3 研究限制 47
5.4 未來研究建議 47

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