2020年以來，隨著新冠疫情的爆發，居家辦公的需求提升，也帶動筆記型電腦、平板電腦與行動裝置的需求成長，除了受到疫情的影響，受惠於科技的創新，如物聯網、人工智慧、5G通訊、雲端運算及電動車等科技，皆進一步的提升了市場對於半導體需求的提升。

為了提升半導體晶片生產的效率，勢必要提升半導體工廠中的自動化程度。本研究與世界知名半導體封裝與測試廠商合作，依據其需求提出了晶圓刻號辨識系統，旨在取代主要依據人力來判讀的現況。

半導體封裝與測試的過程中，需要頻繁的對晶圓刻號進行確認。除了晶圓從製造廠商那邊收到後所進行的入庫檢查，晶圓在產線內也設有多個檢查點確保其使用了正確的製程。受到晶圓鏡面反射、蝕刻與擴散製程導致的刻號模糊、字體多樣化等影響，使用人力來判讀並無很好的效率。

本研究透過統一朔模語言，來說明整體的系統架構，包含硬體上所使用到的元件。軟體的部分，則依據廠商需求設計使用者介面，並透過物件偵測技術來實現晶圓刻號的判讀，提升合作廠商整體的流程效率。

Since 2020, with the outbreak of the COVID-19, the demand for working from home has increased. Which has also driven the growth of the demand for notebook, tablet and mobile. Technologies such as artificial intelligence, 5G communication, cloud computing and electric vehicles have further enhanced the market's demand for semiconductors.

In order to improve the efficiency of semiconductor industry. It is necessary to increase the level of automation in semiconductor factories. This research cooperates with world-renowned semiconductor packaging and testing company. Proposes a wafer identification(wafer-id) recognition system according to their requirement. Our goal is to replace the current recognition method that is mainly based on humans.

In the process of semiconductor packaging and testing. It is necessary to confirm the wafer-id frequently. In addition to the inspection of wafers after they are received from the upstream manufacturer, wafers are also inspected at multiple processes in the production line to ensure that the correct process is used. Affected by the mirror reflection of the wafer, the blurring caused by the etching and diffusion processes. It is not very efficient to use human to recognize wafer-id.

This research uses Unified Modeling Language(UML) to describe the overall system structure, including the components used in the hardware. For the software, the user interface is designed according to the practical needs. And the wafer-id recognition program is construct through the object detection technology. This system improves the quality control process efficiency of the cooperative company.

摘要 i
Abstract ii
目錄 iv
圖目錄 vi
表目錄 vii
第一章、緒論 1
1.1 研究背景 1
1.2 研究動機與目的 2
1.3 研究架構 3
第二章、相關研究 4
2.1 合作廠商現行晶圓刻號辨識方法 4
2.2 光學字符辨識 5
2.3 物件偵測 7
2.4 物件偵測模型改善方法 8
第三章、問題描述 12
3.1 晶圓刻號辨識問題特性 12
3.2 資料集說明 14
3.3 研究績效指標說明 15
第四章、晶圓刻號辨識系統 18
4.1 系統架構 19
4.2 系統活動與流程 21
4.3 使用者介面 24
4.4 物件偵測辨識模型 27
第五章、概念驗證與系統驗收 32
5.1 單片晶圓辨識物件偵測模型概念驗證 33
5.2 多片Dummy Wafer辨識系統概念驗證 36
5.3 多片Pattern Wafer辨識系統確認與驗證 38
第六章、結論 40
參考文獻 42

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