本論文研究內容為實現全整合熱致動式微機械振盪器，主要採用0.35μm CMOS-MEMS製程平台來針對熱致動共振器進行介面讀取電路的設計與開發。
本實驗室先前開發的振盪系統已實現晶片系統構裝，而本研究進一步使系統達到微型化、積體化，將MEMS與電路整合而達成系統單晶片。論文內容涵蓋介面電路原理設計與量測、微機械元件運作原理、元件製程與量測以及振盪器性能量測。目前此一系統於大氣環境已能產生持續振盪，且於偏置頻率1 kHz及10 kHz處分別有-76.4 dBc/Hz和-79.1 dBc/Hz的表現，已達到頻率解析度與質量感測解析度分別為19Hz和0.83pg的良好表現。經過一系列的量測後，驗證此系統有潛力能成為細懸浮微粒(PM2.5)感測器，最終希望能將其與各式之感測器整合，應用於物聯網中，完成整合型環境懸浮微粒感測器中樞平台。

This work focuses on the implementation of a fully integrated thermally actuated micromechanical oscillator, as well as design and development of the integrated interface circuits for the resonator which is realized by the TSMC 0.35μm CMOS-MEMS process technology platform.
Our previous oscillating system has realized the System in Package (SiP). This research further miniaturized and integrated the system, and achieved the System on Chip (SoC). The content of this thesis covers the principles, design, measurement of the interface circuit, MEMS device operation principles, manufacturing processes and metrology, and oscillator performance verification. The oscillation in atmospheric condition was verified; the phase noise has performance of -76.4dBc/Hz and -79.1dBc/Hz at offset frequencies of 1 kHz and 10 kHz, respectively. The oscillation system also demonstrates a frequency resolution of 19Hz, corresponding to a mass resolution of 0.83pg. After a series of measurements, it was verified that this system has the potential to become a sensor for fine particulate matter (PM2.5). Such devices can be potentially integrated with other sensors, and applied to the Internet of Things (IoT) to complete a Fully Integrated Environmental Particulate Matter Sensor Hub Platform.

摘要 i
Abstract ii
致謝 iii
目錄 v
圖目錄 viii
表目錄 xii
第一章 前言 1
1 - 1 研究動機與背景 1
1 - 2 文獻回顧 4
1 - 3 內容架構 9
第二章 原理分析與設計 11
2 - 1 熱致動壓阻感測式振盪器運作原理 11
2 - 2 熱致動壓阻感測共振器結構與等效模型 13
2 - 2 . 1 共振器結構 13
2 - 2 . 2 共振器等效模型 14
2 - 3 運算放大器架構比較 16
2 - 3 . 1 疊接組態(Cascode) 17
2 - 3 . 2 摺疊疊接組態(Folded-Cascode) 19
2 - 3 . 3 二級組態(Two-Stage) 21
2 - 3 . 4 放大器架構比較 24
2 - 4 介面讀取電路設計 25
2 - 4 . 1 放大器主電路 27
2 - 4 . 2 偏壓電路(Bias Circuit) 27
2 - 4 . 3 共模回授(CMFB) 28
2 - 5 全差動式緩衝器 30
2 - 6 元件偏壓電路 31
第三章 製作過程與結果 33
3 - 1 CMOS-MEMS元件製程與結果 33
3 - 1 . 1 CMOS-MEMS元件製程 33
3 - 1 . 2 CMOS-MEMS元件結果 38
3 - 2 積體電路檢視結果 41
3 - 3 整體系統說明與打線結果 43
第四章 模擬與量測結果 45
4 - 1 熱致動壓阻式共振器 45
4 - 2 介面讀取電路 47
4 - 3 開迴路量測 50
4 - 4 閉迴路量測 51
第五章 結論與未來研究 57
5 - 1 結論 57
5 - 2 未來研究 58
5 - 2 . 1 熱致動壓阻感測共振器結構修改 58
5 - 2 . 2 支撐放大電路 59
參考文獻 61

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