近年來材料科學的快速發展，科技產業包含光電材料及半導體等微小化製程的進步，穿透式電子顯微鏡 (transmission electron microscope, TEM)可從材料的微結構上可明確地分析出哪些結構會帶來可見的特性，而哪些結構會導致材料的崩壞，尤其在奈米科學快速發展的情況下，高倍率的空間解析能力越發重要，平面影像的微觀結構終究有其限制，因此發展電子斷層掃描的技術對材料科學的推進也扮演舉足輕重的角色。
電子斷層掃描術最主要的限制來自於投影張數的不足，歸因於樣品的脆弱性及受限於樣品的製備方法，將導致輻射損傷嚴重和缺失角問題。為了使電子斷層掃描術廣泛應用於各式樣品，本文的研究著重於探討各式樣品拍攝影像的方式乃至重建三維結構的技巧。
本文中以鉑釕金奈米粒子、薄膜式的高分子聚合物、針狀式的高熵合金為樣品，上述列舉的三種實驗樣品不論從形貌、結構組成甚至到製備方式都大相逕庭，因此從實驗操作上到重組過程都有其各自適當的方式。面對不同樣品採取不同的處理方式皆成功得到了三維影像，此成果展示電子斷層掃描術可以廣泛應用於各式樣品上。

In recent years, the rapid development of materials science with the progress of semiconductor technology scaling, high resolution microscopy becomes more and more important. The transmission electron microscope (TEM) can directly analyze the microstructure of the material. With the TEM images, we can clearly distinguish what kind of microstructures can lead to which kind of material behaviors. However, 2D images will ultimately reach the limit as the rapid development of nanotechnology. Therefore, electron tomography plays an important role in the advancement of materials science.
The main limitation of electron tomography is the insufficient number of projections. Due to the fragility of sample and the limitation in its preparation, it will occur serious radiation damage and missing wedge problem. In order to fully unleash the potential of electron tomography, this research conducts and discusses different applications with rich variety of specimen.
In this thesis, PtRuAu nanoparticles, thin-film polymer, and needle shaped high-entropy-alloy are used as specimens. The above mentioned are quite different in terms of morphology, compositions, and preparation methods; the appropriate methods for each sample are also proposed. Finally, we successfully obtained three-dimensional images of each specimen. The result proofs a great potential of applying electron tomography analysis to a wide variety of samples.

誌謝 i
摘要 ii
Abstract iii
目錄 v
圖目錄 vi
表目錄 vii
第一章 序論 1
1-1 前言 1
1-2 實驗動機 2
第二章 儀器介紹與實驗流程 5
2-1電子顯微鏡基本介紹 5
2-2樣品製備前置工作 7
2-3實驗操作流程 9
第三章 斷層掃描術三維影像重組 12
3-1斷層掃描術原理 12
3-2傅立葉切片定理(Fourier Slice Theorem) 13
3-3廣義傅立葉迭代重建(GENFIRE) 15
3-4影像旋轉軸校正 18
3-4-1 交叉相關法（cross-correlation） 18
3-4-2質心法 19
3-4-3 背投影法 20
第四章 各式樣品介紹與實驗結果 21
4-1 鉑釕金奈米粒子 21
4-2 高分子聚合物—膜狀樣品 24
4-3 高熵合金—針狀樣品 28
4-3-1高熵合金225k重組（低倍率） 29
4-3-2高熵合金1p8M重組（高倍率） 35
第五章 結論 42
參考文獻 44
附錄 47
附錄1: PtRuAu -65°~65°，共27張投影 47
附錄2：高分子聚合物-65°~57°共123張投影 49
附錄3：高熵合金225k從-45°~140°的投影 60
附錄4：高熵合金1p8M(拼圖完) 的投影 64
附錄5：高熵合金1p8M重組 y=500~800 68

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