為了能使科技走進大眾家庭裡，產品的價格必須越來越親民，在不斷精簡成本的需求下，而本研究的一個相中的對象便是在3C與工業中廣泛運用的導電膠，導電膠是一種具導電性的高分子樹脂混和物，藉由樹脂吸附導電粉體使樹脂具有導電導熱性，根據需求不同選用不同粉體，傳統上最常使用的便是銀粉因其具有最佳的導電導熱特性，但銀的成本居高不下因此我們如果要降低導電粉末的成本首要就是把貴金屬的成分降低，再參照不同文獻後本研究導入了鍍層結構，透過銀離子&銅的置換反應得到鍍銀銅粉，結合銅的高導電性與低成本和銀的強抗氧化性，在降低成本的情況下又不失其導電率，透過製程上的調整，改變合成階段的溫度、時間、氨水濃度等參數去了解鍍銀反應在反應上的包覆完整性與動力學間的關聯性，透過XRD、SEM-EDX等分析儀器交叉比對，找出一條最適合銀銅粉製備的標準反應程序，可以推動國內包含導電導熱在內之任何相關應用的成本下使相關應用端產品在國際上更有競爭力。

To bring state-of-the-art technology products in our home, the price of the products must be affordable, one of our targets to reduce the cost is conductive paste which been applied in industry widely.
Conductive paste is a mixture of conductive metal powder with polymer adhesive,by adsorption of metal powder, the polymer adhesive become both electrical and thermal conductive and can be attach on different material surface, many conductive metal powder can be used according to your demonds, traditionaly in industry using silver powser to fabricate conductive paste but that will accompany high cost, so reducing the usage of precious metal is the top priority, we decide to introduce Core-Shell structure to our experiment, we prepared the micro-scale Silver-coated copper powder by galvanic replacement between copper and silver ion, combining high electrol conductivity and anti-oxidation behavior of silver, we can have powder with lower cost and strong anti-oxidation ability , by modifying the synthesis process including the ammonia concerntration、temperature and synthesis time to get the optimal enperimental process, by analysis the XRD、SEM-EDX、and other instrument to clearify the synthesis reaction dynamics and coverage of silver,we can reduce the cost of any application related of conductive paste and gain more competitive.

摘要 i
Abstract ii
誌謝 iii
目錄 iv
表目錄 vii
圖目錄 viii
第一章 緒論 11
1-1 研究背景 11
1-2 導電膠應用與發展 11
1-3 導電膠組成 12
第二章 文獻回顧 15
2-1 導電粉體現況 15
2-2 導電粉體選擇條件 18
2-2-1 導電粉體形貌篩選 19
2-2-2 導電粉體大小篩選 20
2-3 銀包銅粉製備 20
2-3-1 金屬還原電位 22
2-3-2 表面氧化層清潔 23
2-4 導電膠配置 25
2-4-1 樹脂選擇 26
2-4-2 添加劑選擇 28
2-5 文獻回顧總攬 29
第三章 實驗方法 30
3-1 前言 30
3-2 實驗設計 30
3-2-1 實驗研究方向 30
3-2-2 實驗藥品 31
3-3 實驗流程 31
3-4 實驗分析 38
3-4-1 三用電錶(volt-ohm-milliammeter) 38
3-4-2 循環伏安法 (Cyclic voltammetry, CV) 38
3-4-3 X光繞射分析儀 (X-ray diffraction, XRD) 38
3-4-4 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) 40
3-4-5 X光光電子能譜 (X-Ray Photoemission Spectroscopy, XPS) 41
第四章 結果與討論 42
4-1 自合成銀包銅粉對照組測試 42
4-2 在置換反應中氨水添加量之影響 45
4-2-1 電阻與表面電化學分析 46
4-2-2 物性分析 50
4-2-3 本章總結 57
4-3 不同置換反應時間對於粉體結構的影響 58
4-3-1 電阻與表面電化學分析 58
4-3-2 物性分析 60
4-3-3 本章總結 67
4-4 不同置換反應溫度對結構的影響 68
4-4-1 電阻與表面電化學分析 69
4-4-2 物性分析 71
4-4-3 本節總結 77
4-5 四點探針校對電阻值 78
第五章 結論 & 後續實驗建議 80

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