隨著智慧手機，人工智慧，第五代移動通訊(5G)等技術的發展，資訊技術產業中的大小企業仍然生機勃勃，但之前處於資訊產業中領先地位的半導體製造業卻有向著寡頭壟斷發展的趨勢。現今還能在新一代資訊產業中進行大規模投資的公司已經限制在五個以內。因此，半導體設備製造方面的價格競爭比以前更加激烈。在價格競爭日趨激烈的同時，新半導體設備的開發週期也要日益縮短，在競爭如此加劇之情況下，半導體製造設備公司更需要提高製造設備和晶圓加工的開發效率，以求在激烈的競爭中生存與發展。半導體設備製造商一般在獲得業務合作後，會承諾擔負保固服務，相應會產生保固成本，是指當設備製造商提供的產品和晶片工藝有缺陷時，半導體設備商需要承擔的成本支出。保固成本有時會過度膨脹並可能導致半導體製造設備公司承受高額損失。如何降低保固成本是半導體設備製造商新產品開發及運營都需要面臨的問題，除了不斷提高技術水準，半導體製造設備公司也需要不斷降低設備的保固成本。本文提出使用同步工程取代傳統開發的順序流程：從大規模產品銷售到半導體製造公司的售後服務。在同步工程中，各部門從開發的初始階段即開始參與，這樣可以縮短開發週期和保固成本，並保證設備和晶圓工藝的完整性。

Although the IT industry is expected to remain active due to the development of Smart phones, AI, 5G, etc., the leading-edge semiconductor manufacturing industry is becoming oligopolistic. And now, the number of companies that can make large-scale investments in new generations has been limited to around five. Therefore, the price competition of semiconductor manufacturing equipment used for semiconductor manufacture is more intense than before. Not only the price competition but also the new semiconductor development period has been shortened, and it is very important for the semiconductor manufacturing equipment company to improvement of the development efficiency of both the manufacturing equipment and the wafer processing which is performed with the manufacturing equipment for survival. Also, even if it is possible to acquire a business, the cost called "Warranty cost", which is generated when the equipment and wafer process have some defects, sometimes swells enormously and may cause manufacturing equipment companies to suffer. It is a business operation problem that the capital that should be able to invest in new development disappears to the warranty cost. Not only high technology, but also semiconductor manufacturing equipment companies are required to produce highly complete equipment and keep the cost of warranty low. In place of the sequential flow from conventional development — mass product sales, and after service in the semiconductor manufacturing company — the paper proposes using concurrent engineering in which various departments participate from the initial stage of development. This may shorten the development period and costs, and equipment & wafer process completeness.

Abstract I
Acknowledgement III
Table of Contents IV
List of Figures VI
List of Tables VII
Chapter 1. Introduction 1
1.1 Research Background 1
1.2 Motivation for Studies 2
1.3 Purpose of Study 3
1.4 Structures of Chapters 4
Chapter 2. Literature Study 5
2.1 Concurrent Engineering 5
2.1.1 Concurrent engineering (CE) vs. Sequential engineering (SE) 6
2.1.2 The Principles of CE 8
2.2 Technology Readiness Level & Manufacturing Readiness Level 10
Chapter 3. Methodology 13
3.1 Action Research 13
3.2. Interview 13
Chapter 4. Industry Background 16
4.1 Semiconductor Market Status 16
4.2 Semiconductor Manufacturing Equipment Business Field Status 17
Chapter 5. Case Study 23
5.1 Tokyo Electron ES BU: Warranty Cost Analysis and Target 23
5.2 Research of Concurrent Engineering Effect in Development Stage 28
Chapter 6. Conclusions 32
List of Reference 34
Appendix 36

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Koezuk, H，2018， 「半導体製造装置企業の競争環境とイノベーション戦略」, 立命館経営学，56（6），145
和田木哲哉・横山貴子著/ 奥村勝弥監修［2009］『徹底解析 半導体製造装置産業』工業調査会