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作者(中文):吳上麒
作者(外文):Wu, Shang-Chi
論文名稱(中文):不同披覆層之射頻高電子遷移率電晶體之元件製作
論文名稱(外文):Fabrication of Radio Frequency High-Electron-Mobility-Transistor with Different Passivation
指導教授(中文):吳孟奇
指導教授(外文):Wu, Meng-Chyi
口試委員(中文):羅文雄
楊智超
盧峙丞
學位類別:碩士
校院名稱:國立清華大學
系所名稱:電子工程研究所
學號:106063567
出版年(民國):108
畢業學年度:107
語文別:英文
論文頁數:52
中文關鍵詞:披覆層氮氧化矽氮化矽二氧化矽
外文關鍵詞:PassivationSiO2SiNxSiNO
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本論文主要於研究以不同披覆層之射頻高電子遷移率電晶體之元件製作及分析。在本研究中,氮化矽、二氧化矽及不同製程參數的氮氧化矽披覆層分別被製作成氮化鋁鎵/氮化鎵金半高電子遷移率電晶體並做在高阻值矽基板上。
在比較本研究的所有元件後,以氨氣與氧化二氮比例1:2製作而成的氮氧化矽披覆層當作氮化鋁鎵/氮化鎵金半高電子遷移率電晶體具有最佳的特性,在閘極線寬為2微米,閘極總長160微米的元件之汲極飽和電流密度為726mA/mm,最大轉導值為128 mS/mm。在小訊號表現上,截止頻率和最大震盪頻率分別為2.9和10.4 GHz
This thesis focuses on studying a silicon oxynitride (SiNO) applied to AlGaN/GaN high-electron-mobility-transistors (HEMTs) as the passivation layer for high frequency and RF power applications. High-resistivity silicon substrates were used in this study and were used to fabricate AlGaN/GaN MSHEMTs.
Compared with all types RF-MSHEMTs in this study. Excellent improvements are achieved for 2×80 μm AlGaN/GaN MSHEMT on high resistivity silicon substrate with SiNO passivation (NH3:N2O=1:2) has a drain saturation current density (JDS,max) of 726 mA/mm and maximum transconductance (Gm,max) of 128 mS/mm. The fT and fMAX were 2.9 and 10.4 GHz, respectively.
摘 要 I
Abstract II
誌 謝 III
Contents IV
List of Figures V
List of Tables VII
Chapter 1 Introduction 1
1-1 Gallium Nitride (GaN) 1
1-2 High Electron Mobility Transistor (HEMT) 1
1-3 Motivation 4
1-4 Passivation Layer 5
1-5 Thesis Organization 6
Chapter 2 Fundamental Principles of Measurement 7
2-1 Transmission Line Measurement 7
2-2 Small-Signal Performance 14
2-2-1 Scattering parameters (S-parameters) 9
2-2-2 RF Characteristics for small-signal performance 10
2-2-3 67 GHz S-parameter measurement system setup 13
2-3 Pulse I-V Measurement 14
Chapter 3 Design and Fabrication 16
3-1 Design of Experiment 16
3-2 RF-MSHEMT Process 17
3-2-1 Mask Design of RF-MSHEMT 17
3-2-2 Process Flow for RF-MSHEMT 18
Chapter 4 Results and Discussion 26
4-1 TLM characteristics 27
4-2 The AlGaN/GaN RF-MSHEMT with SiNx, SiO2 Passivation 28
4-2-1 DC characteristics 28
4-2-2 Small-Signal characteristics 32
4-3 The AlGaN/GaN RF-MSHEMT with Different SiNO Passivation 33
4-3-1 DC characteristics 34
4-3-2 Small-Signal characteristics 39
4-4 Comparison with SiNx, SiO2, and SiNO Passivation 41
4-4-1 DC characteristics 41
4-4-2 Small-Signal characteristics 46
4-5 Pulse I-V Measurement 48
Chapter 5 Conclusion 50
Reference 51

[1] 張庭輔,黃智方,”氮化鎵功率元件簡介,” 電子資訊, 第二十卷第一期 (2014)
[2] S. Hamady, "New concepts for normally-off power gallium nitride (GaN) high electron mobility transistor (HEMT)," Universite Toulouse III Paul Sabatier, 2014.
[3] Yole Developpement, “SiC, Sapphire, GaN… : what is the business evolution of the non-Silicon based semiconductor industry ?,”
(https://www.slideshare.net/Yole_Developpement/sic-sapphire-gan-what-is-the-business-evolution-of-the-nonsilicon-based-semiconductor-industry-presentation-held-by-on-semicon-west-2017-by-pierric-gueguen-from-yole-dveloppement)
[4] E. Kohn, I. Daumiller, P. Schmid, N. X. Nguyen, and C. N. Nguyen, “Large signal
frequency dispersion of AlGaN/GaN heterostructure field effect transistors,” Electron.
Lett., vol. 35, no. 12, pp. 1022–1024, Jun. 1999.
[5] O. Seok, Y.-S. Kim, M.-W. Ha, and M.-K. Han, “Effects of SiO2 Passivation on
Oxygen Annealed AlGaN/GaN HEMTs,” ECS Trans., vol. 35, no. 6, pp. 185–190, Apr.
2011.
[6] R. Chu, A. Corrion, M. Chen, R. Li, D. Wong, D. Zehnder, B. Hughes, and K. Boutros,
“1200-V Normally Off GaN-on-Si Field-Effect Transistors With Low Dynamic on -
Resistance,” IEEE Electron Device Lett., vol. 32, no. 5, pp. 632–634, May 2011.
[7] Keysight Technologies, “Understanding the Fundamental Principles of Vector Network Analysis” (http://literature.cdn.keysight.com/litweb/pdf/5965-7707E.pdf)
[8] D. Zhong, Z. Zhang, and L. M. Peng, "Carbon nanotube radio-frequency electronics," Nanotechnology, vol. 28, no. 21, p. 212001, May 26 2017.
[9]劉政志, "高頻氮化鋁鎵/氮化鎵與氮化鋁銦/氮化鎵高電子遷移率電晶體之製作與分析," 碩士, 電子工程研究所, 國立清華大學, 新竹市, 2012.
[10] R. Vetury, N. Q. Zhang, S. Keller, and U. K. Mishra, “The Impact of Surface
States on the DC and RF Characteristics of AlGaN/GaN HFETs,” IEEE
Transaction on Electron Devices, 48(3), pp. 560-566, 2001.
[11] Yung-Chih Wang, "Design and Fabrication of AlGaN/GaN Heterostructure Field Effect Transistors," Electrical Engineering, National Chiao Tung University, 2007
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