屬於先進製程的產業之一的半導體產業，應用了很多精密先進的自動化設備，來達到高精密度、高純度、完整性、以及安全性。雖然如此，但並非全部的生產過程都是仰賴先進設備，仍有部分的作業程序還是會依靠人工方式作業。然而，人工作業的速度勢必比不上機器作業的速度，精準度及不良率也是不可比擬的。這些都會影響到產品生產的週期時間。
本論文探討的主題是關於IC包裝流程的改善，透過精實生產的消除浪費概念，找出令生產週期時間增加的浪費來加以改善。測試廠產品種類眾多，所要經過的流程都不盡相同，因為包裝站是影響主要產品生產週期長的關鍵且欲透過自動化設備來進行改善，故以此作為本研究所要探討的主題。
本研究是透過P-Q分析找出工廠內的主要產品系列，找出產品之間的共通流程，透過價值流圖來分析其共通生產流程，找出生產中的浪費以及對客戶無價值時間，透過自動化設備消除浪費以及減少無價值時間，達到縮短生產週期的目的，也因此提升速度與品質，達到客戶的要求跟提升公司競爭力。

The semiconductor industry is one of the advanced process industries, uses many sophisticated automation equipment to achieve high technology. Even so, not all processes rely on advanced equipment and some procedures still rely on manual methods. However, the speed of manual work is inevitably inferior to the speed of machine, high accuracy and low reject rate are incomparable. These will affect the cycle time of production.
This paper discussed is about the improvement of IC packaging process, through eliminating waste in lean production, and finding out the waste that increases the lead time of the production. There are many kinds of products in the testing house and the processes are different. Because the packing station is the key to affect the lead time of main products. So, it is the subject of this paper to improve the packing station through automation equipment.
The research is to find out the main product groups in the factory by PQ analysis, find out the major process between main products, analyze the major process through value stream mapping, find out the waste in the flow, solve the waste and reduces worthless time through by automation, shortening the production cycle, and thus improving speed and quality, meeting customer requirements and enhancing company competitiveness.

摘要 I
ABSTRACT II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 1
1.3 研究流程 2
第二章 文獻探討 3
2.1 精實生產 3
2.2 價值流圖 5
第三章 研究方法 13
3.1 問題定義 13
3.2 價值流圖的主要目的與原則 13
3.3 實踐精實生產 15
第四章 個案研究與分析 18
4.1 個案公司發展背景介紹 18
4.2 資料蒐集與分析 18
4.3 選擇產品系列 20
4.4 識別產品製程共同性 22
4.5 識別主要價值流 23
4.6 識別和分析浪費 26
4.7 自動化改善方案 31
4.8 確認改善狀態 33
4.9 模擬拓展成效 40
第五章 結論與建議 47
5.1 結論 47
5.2 未來研究方向與建議 48
參考文獻 49

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