半導體產業因生產製造程序繁瑣複雜，生產排程與生產管制在半導體晶圓流程中非常重要。半導體產業主要由IC設計、晶圓代工、IC封裝測試所組成，其中晶圓代工及IC封裝測試更是領先全球成為世界龍頭，促進台灣高科技產業經濟蓬勃發展。
本論文探討的主題是關於IC封裝測試中的金凸塊生產之批量機台排程問題分析與解決。金凸塊製造包含進料檢驗(IQC)、黃光製程(Photoresist)、電鍍製程(Plating)、蝕刻製程(Etching)、退火(Annealing)、最終檢驗(FQC)，退火製程為批量生產機台，因考量產品集批等候問題、產品種類及生產機台限制，在生產線容易發生機台使用率超過產能使用率但產出卻無法達成每日生產目標，無法有效利用機台期望產能，故希望藉此研究能提高機台產出與降低集批等候時間，有效運用期望產能。
本研究嘗試用分段式集批策略，以IC封裝廠進行實例研究，比較一般的派工法則(Dispatching Rule)，建立FlexSim模擬系統，在不同系統負荷情況下，考量機台特性在當站集批原則，透過績效指標衡量發現平均等待時間優於原本依產線人員依生產經驗人工自行判斷，可以避免非瓶頸資源使用率尖峰期的發生而導致資源發生閒置的情況。

Due to the complexity of the manufacturing process in the semiconductor industry, production scheduling and regulation are very important in the semiconductor wafer process. The semiconductor industry is mainly composed of IC design, foundry and IC packaging and testing. Wafer foundry and IC packaging and testing are leading the world and promoting the economic development of Taiwan's high-tech industry.
The subject of this study is the analysis and resolution of batch machine scheduling problems for gold bump production in IC packaging testing. Gold bump manufacturing includes IQC, Photoresist, Plating, Etching, Annealing, FQC, and Annealing is a batch machine process. Because of the batch waiting problem, product type and machine limitation, it is easy to cause the machine utilization rate to exceed the capacity utilization rate but the throughput cannot achieve the daily production target, and make it impossible to effectively use the expected capacity of the machine. This research can improve the throughput, reduce the lead time of the batch, and effectively use the expected production capacity.
In this study, the segmentation batch strategy is used to compare the general dispatching rules and establish the FlexSim simulation model. The average lead time is better than the original by performance indicators. The personnel can judge manually according to the production experience, which can avoid the situation that the non-bottleneck resource usage peak period occurs and the resources are idle.

摘要 i
Abstract ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 4
1.3 研究範圍 4
1.4 研究步驟 5
第二章 文獻探討 7
2.1 半導體金凸塊製程介紹 7
2.2 生產管理思維 9
2.2.1 精實作業(Lean Operation) 9
2.2.2 限制理論(Theory of Constraints, TOC) 10
2.3 派工法則相關文獻 11
2.4 集批作業與批次派工法則相關文獻 12
第三章 研究方法 18
3.1 問題定義 18
3.1.1 Annealing機台生產特性 18
3.1.2「批次加工」對生產系統的影響 18
3.1.3 確定目標及績效指標 21
3.2 批次派工策略之決策參數 22
3.3 模擬建構 22
3.4 只考慮等候集批時間來決定產品生產優先順序的決策 23
3.5 分段式集批策略的派工法則 25
第四章 個案公司案例分析 27
4.1 個案公司簡介 27
4.2 資料蒐集分析 27
4.3 實驗條件設定 30
4.4 FlexSim模擬系統建置 33
4.4.1 FlexSim模擬物件 33
4.4.2 FlexSim模擬系統內容 35
4.5 FlexSim模擬分析結果 37
第五章 結論與建議 47
5.1 結論 47
5.2 建議 47
參考文獻 48

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