焊線(Wire Bond)在IC元件中負責連接晶片與基板，為半導體封裝的核心製程，若不能有效控管，則可能造成焊點強度不足或晶片損壞等品質問題。影響焊線製程的因素有很多，包含生產參數、線的材質、底座等，在本文中將針對如何降低由焊線機台所造成的變異進行探討。然而焊線製程之複雜的產品組合與頻繁的換線，使其難以有效建立機台健康指標，進而導致焊線設備管理困難；且現行的機台調整流程，牽涉硬體調教過程繁瑣耗時，造成機台養護單位的負擔。因此需要一個有效的機台維護架構，其中應包含機台的健康指標，以標定需要調整的異常機台、藉由導入視情維護來降低非必要的人力物力消耗；並建立參數調整的反饋機制，協助工程師快速校正異常的機台。本研究針對IC封裝中的焊線製程，提出一套設備維護管理架構。首先以累積和管制圖(Cumulative Sum Control Chart)進行資料預處理，並以產品別的平均作為基準計算每筆偏量測資料的移幅度；接著以指數加權移動平均(Exponential Weighted Moving Average)建立機台健康指標，最後根據健康指標和機台設定參數建立模型，發展僅涉及參數設定更新的新機台校正流程，節省調機所需時間。透過本架構，可以克服前述的問題，協助廠方掌握各機台生產狀態，並且提出適當的參數調整建議，降低產品變異、提升品質。

Wire bonding is one of the most important processes in IC package industry. To ensure a competitive delivery time, one order will be allocated to different machines speeding up the production. As a result, the difference between machines will directly influence the variance and quality of the product. This also leads to a frequent changeover production schedule, which makes the machine monitoring hard to conduct. To solve this problem, we develop an equipment maintenance framework, providing a machine's health index for identifying its status and whether it needs maintenance. In the framework, first thing is to construct a baseline for different products, then use the normalization technique to make all the data comparable. The health index was calculated by performing an exponentially weighted moving average (EWMA) on normalized data. Last but not least, a machine parameter correction system was built based on the health index to reduce the difference between machines and improve the quality of products.

目錄
目錄 i
表目錄 iii
圖目錄 iv
第一章 緒論 1
1.1 研究背景、動機與重要性 1
1.2 研究目的 3
1.3 論文結構 3
第二章 文獻回顧 4
2.1 各國工業轉型策略 4
2.1.1先進製造國家的轉型策略 4
2.1.2工業3.5策略 5
2.2 機台保養維護策略 7
2.2.1事後維修與預防性維修 7
2.2.2視情維修 8
2.2.3機台健康指標 9
2.3 品質管制 10
2.3.1製程管制圖 10
2.3.2時間加權管制圖 11
2.3.3移動點分析 12
2.4 封測產業與焊線製程 14
2.4.1封裝測試製程 14
2.4.2焊線製程 15
2.4.3推球測試 15
2.4.4焊線機台的生產狀態分析 16
第三章 研究方法 17
3.1 問題定義 18
符號定義 19
3.2 機台健康指標 20
3.2.1資料蒐集 20
3.2.2資料清理 20
3.2.3建立機台健康指標 21
3.3 機台調整模型 22
3.3.1資料蒐集 22
3.3.2測試實驗 22
3.3.3比例調整模型 23
3.4 結果驗證 23
3.5 焊線設備維護管理架構 24
第四章 實證研究 25
4.1 問題定義 25
4.2 機台健康指標 26
4.2.1資料蒐集 26
4.2.2資料清理 26
4.2.3建立機台健康指標 28
4.3 機台調整模型 30
4.3.1資料蒐集 30
4.3.2測試實驗 30
4.3.3比例調機模型 31
4.4 結果驗證 33
4.4.1機況判斷模型驗證 33
4.4.2機台參數調整模型-實機驗證 33
4.5 焊線設備維護管理架構 35
4.5.1產品基準卡控系統 36
4.5.2機台健康指標 37
第五章 結論 38
5.1研究貢獻 38
5.2研究限制與未來研究方向 39
參考文獻 40

表目錄
表4.1 管制圖資料欄位介紹 26
表4.2 程式標定結果 27
表4.3 調機紀錄資料欄位介紹 30
表4.4 比例模型比較 31
表4.5 機況判斷模型結果 33
表4.6 實機驗證結果 33
表4.7原版調機與快速版調機流程比較 34
表4.8機台狀態報表範例 37


圖目錄
圖2.1 工業3.5概念圖 (簡禎富等,2016) 6
圖2.2 封裝生產步驟 14
圖3.1 研究架構圖 17
圖3.2 理論驗證模式 24
圖4.1產品資料標定流程 27
圖4.2 CPA偏移標定範例 27
圖4.3 CUSUM於產品別偏移偵測範例 28
圖4.4 機台健康指標運行範例 29
圖4.5 不同CF設定下的推球克數表現 31
圖4.6 架構使用流程圖 35
圖4.7產品基準卡控系統介面主頁 36
圖4.8產品基準卡控系統之CUSUM管制圖介面 36
圖4.9 機台狀態視覺化應用範例 37

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