本研究目標為開發客製化設計的晶圓級自動化量測平台，可應用於同一晶片上不同微機電元件之量測。以NI公司的LabVIEW程式做為開發工具，利用所建立的視覺辨識系統找出基準標記及銲墊座標，藉由機器視覺進行晶圓定位以及探針的位置回授，整合自製探針控制機構以及三軸精密晶圓移動平台，完成自動化之客製化晶片量測系統。
　　目前在半導體製程上大多使用探針卡來進行晶圓的檢測，但受限於探針卡自身的設計，需要隨著量測晶片的不同而更換不同的探針卡使用。而在微機電製程中則大多使用晶圓檢測通用探針台進行量測，雖然能夠針對需求改變探針的位置，但是在對位上需要有人工視覺的輔助，在使用上除了耗費人力外也容易產生控制誤差。
　　為了解決上述問題，本研究設計了一自動化量測系統，克服了探針卡需要因應晶片設計而更換的缺點以及通用探針台需人工對位的問題。利用晶圓標記、機器視覺演算法進行晶圓及探針的定位，再搭配自動化調整機構及視覺回授系統把探針移動至需量測的點位進行量測，便能實現針對不同設計之客製化晶片或同一晶片上不同微機電元件之量測，並藉由人機介面告知使用者目前的量測進度以及機器視覺資訊，進而成功建立了全自動化晶圓級量測平台。

This thesis mainly develops an automated wafer-level testing platform for customized design of various devices in the same wafer. It uses LabVIEW, which is developed by National Instruments, as development tool to construct visual identification system for finding fiducial marker and the coordinate of pads. The testing platform, consisting of visual feedback system for wafer positioning and probe identification, self-made probe control system, and three-axis precision mobile stations, can automatically perform the wafer-level testing system for customized design.
Currently, a probe card is mostly used for semiconductor wafer testing. But, probe cards have to be replaced for different design on wafer because of the structure of itself. Besides, it often uses probe station to test wafer in microelectromechanical fabrication. Although probe station can change the location of probes easily, but it needs the vision assistance by humans in alignment. It not only consumes manpower but also leads to control error easier.
　　In order to solve above problems, this thesis develops an automated testing system which overcomes the shortcomings of probe cards and probe stations. With fiducial marker, machine vision algorithms, probe control mechanisms and visual feedback system, the testing system can position the wafer and move the probes to test points for electrical measurements. This testing system can complete testing for different design on wafer, and inform users of current testing progress and machine vision information. Then, the automated wafer-level testing platform for customized design is established successfully.

摘要--------------------------I
Abstract----------------------II
目錄--------------------------IV
圖目錄------------------------VII
表目錄------------------------XI
第一章　緒論-------------------1
1.1前言-----------------------1
1.2研究動機--------------------2
1.3文獻回顧--------------------5
1.4本文架構--------------------12
第二章　自動化量測平台設計------14
2.1晶圓移動平台----------------14
2.2自動化探針座----------------15
2.3探針座載台------------------24
2.4視覺回授系統----------------26
2.5量測平台建立----------------29
第三章　系統架構---------------31
3.1系統運作流程----------------31
3.2 LabVIEW介面設計------------34
3.2.1銲墊辨識系統--------------34
3.2.2探針回授系統--------------36
3.3視覺回授之目標定位設計-------37
3.3.1基準標記辨識設計-----------37
3.3.2銲墊辨識方法設計-----------42
3.4探針位置控制設計-------------44
3.4.1探針端點辨識---------------45
3.4.2探針位置控制---------------47
3.4.3探針Z軸控制----------------47
第四章　實驗結果----------------50
4.1視覺回授目標辨識結果----------50
4.1.1中心基準標記---------------50
4.1.2銲墊座標辨識---------------52
4.2探針控制結果-----------------54
4.2.1探針針尖位置判斷-----------54
4.2.2探針移動表現---------------55
4.2.3探針位置控制結果-----------60
4.3系統運動特性-----------------67
第五章　結論與未來展望-----------71
5.1結論-------------------------71
5.2未來展望---------------------72
參考文獻------------------------73

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