在過去數十年以來，由於電子元件的效能提升，許多團隊都致力於開發高性能的散熱裝置以處理晶片運作中所帶來的廢熱，以延長電子元件的壽命。電子元件的散熱裝置以熱管及均溫板為兩大主要核心，其中的毛細滲透層又以燒結型的管芯結構最為通用。然而，在高溫燒結製程下所帶來的高成本再加上電子元件尺寸持續的縮小，使得燒結型結構將面臨銅粉不易填入熱管的微型化挑戰。本研究透過控制直流電鍍模式的製程參數，成功製備出兩種不同種類的多孔性吸濕微結構銅薄膜。經由掃描式電子顯微鏡的觀察，此銅薄膜具有奈米級(枝狀晶間隙所構成)的孔洞結構以及微米級(氫氣泡之生成)的孔洞結構。利用電鍍方式製備的結構有別於通用的燒結型，具有低成本、短製程時間及穩定的優點，藉由改變銅薄膜的厚度(介於30 ~ 550 μm)可改變其能容納工作流體的量。此外隨著電鍍電流密度的提升，擁有多尺寸孔洞的銅薄膜微結構將由通道型孔洞枝狀晶轉化為隕石坑型孔洞枝狀晶。當電鍍電流密度為0.5 A/cm2 時，吸濕特性參數(K/Reff，K:透透率(Permeability)，Reff:有效孔洞半徑(Effective pore size))可達到0.5 μm。最後，具備多尺寸孔洞之電鍍銅膜最大散熱量可達約66.8 W(應用於等效長度10 cm、毛細結構截面積 3.6×〖10〗^(-5) m^2之平板型熱管，並以水為工作流體)，其等效熱傳導係數為純銅塊的18.5~30倍。

With the advance of microelectronic device technology, a tremendous research effort has been devoted to the development of high-efficiency heat dissipation components for device performance and reliability considerations. Heat pipes and vapor chambers are two cores technology for heat dissipation applications. The wick structure for capillarity operation is commonly prepared by sintering copper powder in copper tube or copper plates. However, with the downsizing of many electronic devices, miniaturization of heat dissipation components and micro-scale wick structures become essential, which is hardly accomplished by traditional powder sintering method. In this study, we have successfully fabricated two types of copper porous structures by a DC electrodeposition method. The porous structure consists of nanoscale dendritic structure and micron-sized channels according to the scanning electron microscopy observation. The structure fabricated by electroplating is different from the general sintered type, it has the advantages of low cost, short processing time, and good stability. The capability of working fluid accommodation can be tailored by changing the thickness of the copper film ranging from 30 to 550 μm. In addition, with the increasing of electroplating current density, the porous structure in the copper films evolved from a channel/dendrite pore structure to a crater/dendrite pore structure. The Cu film deposited at a current density of 0.5 A / cm2 exhibits the best capillary performance of 0.5 μm, as defined as the ratio of permeability (K) to effective pore size (Reff). Finally, the maximum heat transfer capacity was estimated to be 66.8 W by assuming a flat heat pipe dimension of 10 cm in effective length and 3.6×〖10〗^(-5) m^2 in cross section area with water as working fluid. The effective thermal conductivity of the heat pipe is around 18.5~30 times of the value of copper bulk.

摘要...I
Abstract...II
誌謝...III
目錄...V
圖表目錄...VII
表目錄...X
第一章 緒論...1
1.1 研究背景...1
第二章 文獻回顧...2
2.1 散熱裝置...2
2.1.1 散熱裝置發展史...2
2.1.2 散熱裝置之結構與工作原理...3
2.2 散熱裝置之毛細結構類型...4
2.2.1 溝槽型...5
2.2.2 編織網型...5
2.2.3 燒結銅粉型...6
2.2.4 複合型...6
2.3 影響毛細表現之重要參數...7
2.3.1 散熱裝置之最大熱傳極限...7
2.3.2 滲透率及有效孔洞半徑之量測與計算...9
2.4 雙尺寸孔洞毛細結構...11
第三章 實驗步驟...16
3.1 實驗流程...16
3.2 實驗藥品與儀器...17
3.2.1 化學藥品與藥劑...17
3.2.2 實驗儀器...18
3.3 電鍍多孔性銅薄膜...18
3.4 多孔性銅薄膜微結構與毛細表現之分析...19
3.4.1 冷場發射掃描式電子顯微鏡 (CFE-SEM)...19
3.4.2 電動升降具操作台...20
3.4.3 循環伏安法(Cyclic voltammetry)...20
第四章 結果與討論...22
4.1 製備多孔性銅薄膜...22
4.2 電流密度與電鍍時間對銅薄膜微結構之影響...24
4.3 電鍍銅薄膜之毛細表現...32
4.3.1 不同電鍍參數下孔洞大小與滲透率之關係...32
4.3.2 不同電鍍參數下所製備銅薄膜表面孔洞大小與有效孔洞半徑(Reff)之比較...37
4.3.3 不同電鍍參數下之毛細表現...40
第五章 結論...44
參考文獻...45

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