|
1. R.R. Tummala and E.J. Rymaszewski, "Microelectronics packaging handbook", Van Nostrand Reinhold New York, 1989 2. J.H. Lau, "Ball Grid Array Technology", McGraw-Hill, 1995 3. T.-K. Lee, T.R. Bieler, C.-U. Kim and H. Ma, "Fundamentals of lead-free solder interconnect technology", Springer, 2015 4. K.J. Puttlitz and K.A. Stalter, "Handbook of lead-free solder technology for microelectronic assemblies", CRC Press, 2004 5. M. Abtew and G. Selvaduray, "Lead-free solders in microelectronics", Materials Science and Engineering: R: Reports, 27, (2000) 6. S. Cheng, C.-M. Huang and M. Pecht, "A review of lead-free solders for electronics applications", Microelectronics Reliability, 75, (2017) 7. K.-N. Tu, "Solder joint technology", Springer, 2007 8. K. Zeng and K.-N. Tu, "Six cases of reliability study of Pb-free solder joints in electronic packaging technology", Materials science and engineering: R: reports, 38, (2002) 9. B. Ebersberger and C. Lee,"Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects" in 2008 58th Electronic Components and Technology Conference (2008), pp. 59-66 10. Y. Wang, I.M. De Rosa and K. Tu,"Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints" in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015), pp. 632-639 11. R.-W. Yang, Y.-W. Chang, W.-C. Sung and C. Chen, "Precipitation of large Ag3Sn intermetallic compounds in SnAg2. 5 microbumps after multiple reflows in 3D-IC packaging", Materials Chemistry and Physics, 134, (2012) 12. S. Ahat, M. Sheng and L. Luo, "Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging", Journal of electronic materials, 30, (2001) 13. K. Kim, S. Huh and K. Suganuma, "Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys", Materials Science and Engineering: A, 333, (2002) 14. K.S. Kim, S.H. Huh and K. Suganuma, "Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints", Journal of Alloys and Compounds, 352, 226 (2003) 15. F. Ochoa, J.J. Williams and N. Chawla, "Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder", Journal of Electronic Materials, 32, (2003) 16. F. Abd El-Salam, R.H. Nada and A.M. Abd El-Khalek, "Effect of Cu additions on the structural and mechanical properties of Sn–Zn alloy", Materials Science and Engineering: A, 448, (2007) 17. M. Kamal and E.S. Gouda, "Effect of zinc additions on structure and properties of Sn–Ag eutectic lead-free solder alloy", Journal of Materials Science: Materials in Electronics, 19, (2007) 18. M.G. Cho, S.-K. Seo and H.M. Lee, "Undercooling, microstructures and hardness of Sn-rich Pb-free solders on Cu-xZn alloy under bump metallurgies", Materials transactions, 50, (2009) 19. H.Y. Song, Q.S. Zhu, Z.G. Wang, J.K. Shang and M. Lu, "Effects of Zn addition on microstructure and tensile properties of Sn–1Ag–0.5Cu alloy", Materials Science and Engineering: A, 527, (2010) 20. S.-K. Seo, M.G. Cho, S.K. Kang, J. Chang and H.M. Lee,"Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders" in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (2011), pp. 84-89 21. M. Genanu, F. Mutuku, E.J. Cotts, J. Wilcox, B. Arfaei and E. Perfecto,"Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints" in IEEE Electronic Components and Technology Conference (ECTC) (2017), pp. 423-428 22. Y.M. Leong, A.S.M.A. Haseeb, H. Nishikawa and O. Mokhtari, "Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions", Journal of Materials Science: Materials in Electronics, 30, (2019) 23. T. Laurila, V. Vuorinen and M. Paulasto-Kröckel, "Impurity and alloying effects on interfacial reaction layers in Pb-free soldering", Materials Science and Engineering: R: Reports, 68, (2010) 24. S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-i. Cho, J. Yu and W.K. Choi, "Controlling Ag 3 Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying", Jom, 56, (2004) 25. Z.-B. Luo, J. Zhao, Y.-J. Gao and L. Wang, "Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1 wt.% Zn addition", Journal of Alloys and Compounds, 500, (2010) 26. C.-Y. Yu and J.-G. Duh, "Stabilization of hexagonal Cu6 (Sn, Zn) 5 by minor Zn doping of Sn-based solder joints", Scripta Materialia, 65, (2011) 27. H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green and S.H. Mannan, "Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates", Journal of Alloys and Compounds, 511, (2012) 28. Y.M. Kim, H.-R. Roh, S. Kim and Y.-H. Kim, "Kinetics of intermetallic compound formation at the interface between Sn-3.0 Ag-0.5 Cu solder and Cu-Zn alloy substrates", Journal of electronic materials, 39, (2010) 29. C.-Y. Yu, W.-Y. Chen and J.-G. Duh, "Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing", Journal of Alloys and Compounds, 586, (2014) 30. S. Yang, Y. Wang, C. Chang and C. Kao, "Analysis and experimental verification of the volume effect in the reaction between Zn-doped solders and Cu", Journal of Electronic Materials, 37, (2008) 31. S.C. Yang, C.E. Ho, C.W. Chang and C.R. Kao, "Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu", Journal of Materials Research, 21, (2011) 32. Y.M. Kim, K.-M. Harr and Y.-H. Kim, "Mechanism of the delayed growth of intermetallic compound at the interface between Sn− 4.0 Ag− 0.5 Cu and Cu− Zn substrate", Electronic Materials Letters, 6, (2010) 33. C.-Y. Yu and J.-G. Duh, "Microstructural variation and phase evolution in the reaction of Sn-xAg-Cu solders and Cu-yZn substrates during reflow", Journal of electronic materials, 39, (2010) 34. C.-Y. Yu and J.-G. Duh, "Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging", Journal of Materials Science, 47, (2012) 35. H. Shang, Z.L. Ma, S.A. Belyakov and C.M. Gourlay, "Grain refinement of electronic solders: The potential of combining solute with nucleant particles", Journal of Alloys and Compounds, 715, (2017) 36. L.F. Miller, "Controlled Collapse Reflow Chip Joining", IBM Journal of Research and Development, 13, (1969) 37. https://amkor.com/packaging/laminate/fcbga/ 38. R. Pandher and T. Lawlor,"Effect of Silver in Common Lead-free Alloys" in Proceedings of the International Conference on Soldering and Reliabilty (2009), pp. 1-14 39. J.-H. Lee, "Reaction Properties and Interfacial Intermetallics for Sn-xAg-0.5Cu Solders as a Function of Ag Content", Metals and Materials International, 14, 649 (2008) 40. S. Terashima, Y. Kariya, T. Hosoi and M. Tanaka, "Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects", Journal of Electronic Materials, 32, 1527 (2003) 41. S.K. Kang, D.-Y. Shih, N. Donald, W. Henderson, T. Gosselin, A. Sarkhel, N. Charles Goldsmith, K.J. Puttlitz and W.K. Choi, "Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu", JOM, 55, 61 (2003) 42. J. Shen, Y.C. Liu, H.X. Gao, C. Wei and Y.Q. Yang, "Formation of bulk Ag3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification", Journal of Electronic Materials, 34, 1591 (2005) 43. D.R. Frear, J.W. Jang, J.K. Lin and C. Zhang, "Pb-free solders for flip-chip interconnects", JOM, 53, 28 (2001) 44. E.F. De Monlevade and W. Peng, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", Journal of electronic materials, 36, (2007) 45. M. Wang, J. Wang, H. Feng and W. Ke, "In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM", Materials Science and Engineering: A, 558, 649 (2012) 46. I.E. Anderson, "Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications", Springer, 2006 47. C.M. Miller, I.E. Anderson and J.F. Smith, "A viable tin-lead solder substitute: Sn-Ag-Cu", Journal of Electronic Materials, 23, (1994) 48. C. Melton, "The effect of reflow process variables on the wettability of lead-free solders", JOM, 45, (1993) 49. G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai and J. Luo, "A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates", Journal of Materials Science: Materials in Electronics, 21, (2010) 50. R. Labie, W. Ruythooren and J. Van Humbeeck, "Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions", Intermetallics, 15, (2007) 51. S. Fürtauer, D. Li, D. Cupid and H. Flandorfer, "The Cu–Sn phase diagram, Part I: New experimental results", Intermetallics, 34, (2013) 52. Z. Mei, M. Ahmad, M. Hu and G. Ramakrishna,"Kirkendall voids at Cu/solder interface and their effects on solder joint reliability" in Proceedings Electronic Components and Technology, 2005. ECTC'05. (2005), pp. 415-420 53. K. Zeng, R. Stierman, T.-C. Chiu, D. Edwards, K. Ano and K. Tu, "Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability", Journal of applied physics, 97, (2005) 54. S.-W. Chen, C.-H. Wang, S.-K. Lin and C.-N. Chiu, "Phase diagrams of Pb-free solders and their related materials systems", Springer, 2006 55. J.-Y. Park, C.-U. Kim, T. Carper and V. Puligandla, "Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8 Ag-0.7 Cu alloys", Journal of electronic materials, 32, (2003) 56. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello and C.A. Handwerker, "Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys", Journal of Electronic Materials, 29, (2000) 57. M. Loomans and M. Fine, "Tin-silver-copper eutectic temperature and composition", Metallurgical and Materials Transactions A, 31, (2000) 58. G. Parks, A. Faucett, C. Fox, J. Smith and E. Cotts, "The nucleation of Sn in undercooled melts: the effect of metal impurities", Jom, 66, (2014) 59. G. Parks, B. Arfaei, M. Benedict, E. Cotts, M. Lu and E. Perfecto,"The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry" in 2012 IEEE 62nd Electronic Components and Technology Conference (2012), pp. 703-709 60. M. Kerr and N. Chawla, "Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales", Acta Materialia, 52, (2004) 61. H.-T. Lee and K.-C. Huang, "Effects of cooling rate on the microstructure and morphology of Sn-3.0 Ag-0.5 Cu solder", Journal of Electronic Materials, 45, (2016) 62. H.-T. Lee and Y.-F. Chen, "Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5 Ag solder", Journal of Alloys and Compounds, 509, (2011) 63. D. Swenson, "The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints", Journal of Materials Science: Materials in Electronics, 18, (2007) 64. J.H. Perepezko, "Nucleation in undercooled liquids", Materials Science and Engineering, 65, (1984) 65. I. Anderson, J. Foley, B. Cook, J. Harringa, R. Terpstra and O. Unal, "Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability", Journal of Electronic Materials, 30, (2001) 66. Y.-c. Huang, S.-w. Chen and K.-s. Wu, "Size and substrate effects upon undercooling of Pb-free solders", Journal of Electronic Materials, 39, (2010) 67. J.W. Elmer, E.D. Specht and M. Kumar, "Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys", Journal of Electronic Materials, 39, (2010) 68. I.E. Anderson, J.W. Walleser, J.L. Harringa, F. Laabs and A. Kracher, "Nucleation control and thermal aging resistance of near-eutectic Sn-Ag-Cu-X solder joints by alloy design", Journal of Electronic Materials, 38, (2009) 69. R. Kinyanjui, L. Lehman, L. Zavalij and E. Cotts, "Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys", Journal of Materials Research, 20, (2005) 70. S. Wang, Y. Yao and X. Long, "Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging", Applied Sciences, 9, (2019) 71. Z. Min-Bo, M. Xiao and Z. Xin-Ping,"Size effect on the intermetallic compound coalescence in sn-ag-cu solder and sn-ag-cu/cu solder joints" in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (2011), pp. 1-6 72. L. Lehman, S. Athavale, T. Fullem, A. Giamis, R. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae and J. Wang, "Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder", Journal of Electronic Materials, 33, (2004) 73. J. Shen, Y.C. Chan and S. Liu, "Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification", Intermetallics, 16, (2008) 74. Y.-S. Park, Y.-M. Kwon, J.-T. Moon, Y.-W. Lee, J.-H. Lee and K.-W. Paik,"Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability" in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (2010), pp. 1436-1441 75. Y.K. Jee, Y.H. Ko and J. Yu, "Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad", Journal of Materials Research, 22, (2007) 76. A.A. El-Daly, H. El-Hosainy, T.A. Elmosalami and W.M. Desoky, "Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying", Journal of Alloys and Compounds, 653, (2015) 77. D. Jiang, Y. Wang and C.S. Hsiao,"Effect of minor doping elements on lead free solder joint quality" in 2006 8th Electronics Packaging Technology Conference (2006), pp. 385-389 78. M.G. Cho, S.K. Kang, D.-Y. Shih and H.M. Lee, "Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging", Journal of Electronic Materials, 36, (2007) 79. K.-W. Moon and W.J. Boettinger, "Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic", JOM, 56, (2004) 80. R.R. Chromik, R.P. Vinci, S.L. Allen and M.R. Notis, "Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation", JOM, 55, (2003) 81. G. Ghosh, "Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging", Journal of materials research, 19, (2004) 82. S.K. Kang, P. Lauro, D.-Y. Shih, D.W. Henderson and K.J. Puttlitz, "Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications", IBM Journal of Research and Development, 49, (2005) 83. M.G. Cho, H.Y. Kim, S.-K. Seo and H.M. Lee, "Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures", Applied Physics Letters, 95, (2009) 84. K. Yazzie, H. Xie, J. Williams and N. Chawla, "On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints", Scripta Materialia, 66, (2012) 85. M.G. Cho, S.K. Kang and H.M. Lee, "Undercooling and microhardness of Pb-free solders on various under bump metallurgies", Journal of Materials Research, 23, (2008) 86. C.-Y. Ho, M.-T. Tsai, J.-G. Duh and J.-W. Lee, "Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies", Journal of Alloys and Compounds, 600, (2014) 87. J. Keller, D. Baither, U. Wilke and G. Schmitz, "Mechanical properties of Pb-free SnAg solder joints", Acta Materialia, 59, (2011) 88. F. Mutuku, B. Arfaei and E.J. Cotts, "The influence of processing on strengthening mechanisms in Pb-free solder joints", Journal of Electronic Materials, 46, (2017) 89. F. Che, W. Zhu, E.S. Poh, X. Zhang and X. Zhang, "The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures", Journal of Alloys and Compounds, 507, (2010) 90. R. Abbaschian and R.E. Reed-Hill, "Physical metallurgy principles", Cengage Learning, 2008 91. J.E. Spinelli and A. Garcia, "Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders", Journal of Materials Science: Materials in Electronics, 25, (2014) 92. F. Ochoa, J. Williams and N. Chawla, "Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder", Journal of Electronic Materials, 32, (2003)
|