本研究是以固溶多元素銅合金為基礎，經熱處理後析出硬化，開發數款兼具硬度與導電性之銅合金，旨在取代昂貴且製程中具有毒性的銅鈹合金。於研究中觀察合金微結構、硬度與導電度之時效曲線，並探討其於室溫下、高溫與潤滑油環境下之耐磨耗性質。量測本研究尖峰時效態合金之導電度，並與 C17200 銅鈹合金進行比較，探討新合金的實際應用性質。
在此合金系列中，鎳矽化合物為主要析出相，可在合金時效處理後，提升其硬度與導電度；鋁、鉻、鐵、錫元素則提供固溶強化、晶粒細化之性質。故本實驗將針對鎳、矽、鋁含量的變化，對合金微結構、硬度與導電度表現進行研究。
應用性質方面，本研究開發之新型合金綜合性能表現優異，其滾軋退火態在具有 290.4 Hv 硬度與 23.7 % IACS 導電度的同時，也保有 2199.25 m/(MPa∙mm^3) 的室溫磨耗阻抗，其摩擦係數為 0.73。有 6840.00 m/(MPa∙mm^3) 的油溫磨耗阻抗。對比銅鈹合金，本研究合金之硬度為C17200其 72 %、導電度為其99 %，更具有 208 % 之室溫磨耗阻抗與 205 % 之油溫磨耗阻抗之提升。

On the basis of multi-component alloy with precipitation hardening, a series of innovative copper alloys with superior hardness and conductivity are developed to replace beryllium copper for high cost and toxicity. For further commercial application, microstructures, age hardening, dry and wet sliding wear resistances of the present alloys are analyzed and compared with C17200 beryllium copper.
In this study, Ni-Si compounds act as precipitates, giving rise to the increases on hardness and conductivity. Additionally, aluminum, chromium, iron, and tin elements provide properties such as solid solution strengthening and grain refining. Therefore, the effects of nickel, silicon, and aluminum on microstructure, hardness, and conductivity are studied.
In the aspect of commercial application, the innovative copper alloy in this study demonstrates excellent performance with 290.4 Hv in hardness and 23.7 % IACS in conductivity, which are 72 % and 99 % of those of C17200 alloy. Besides, the dry and wet sliding wear resistances of the innovative copper alloy are 2199.25 m/(MPa∙mm^3) at ambient temperature and 6840.00 m/(MPa∙mm^3) at elevated temperature, respectively, which makes an improvement of 208 % and 205 % compared with those of C17200 alloy.

致謝 I
摘 要 V
Abstract VI
目錄 VIII
圖目錄 XII
表目錄 XVI
第一章 前言 1
第二章 文獻回顧 4
2.1 純銅之基本性質與用途 4
2.2 銅合金之種類 4
2.2.1 黃銅 5
2.2.2 青銅 5
2.2.3 特殊青銅(磷青銅、鋁青銅、銅鎳矽合金與銅鈹合金) 6
2.3 時效析出對合金硬度與導電度之影響 14
2.4 元素混合焓 14
2.5 析出物的形成 16
2.6 添加固溶元素對銅合金硬度之影響 17
2.7 氧化沾黏層之生成 19
2.8 本研究之目的 21
第三章 實驗方法 22
3.1 實驗步驟 22
3.2 合金原料配製與真空電弧熔煉 22
3.3 放電切割 24
3.4 均質化處理 24
3.5 冷滾軋 24
3.6 時效處理 25
3.7 微結構觀察 25
3.7.1 X-ray 結晶繞射分析 (XRD) 25
3.7.2 掃描式電子顯微鏡 (SEM) 25
3.7.3 穿透式電子顯微鏡 (TEM) 26
3.8 機械性質量測 26
3.8.1 硬度量測 26
3.8.2 室溫黏著磨耗試驗 26
3.8.3 油溫磨耗試驗 27
3.9 室溫電阻量測 28
第四章 實驗結果 30
4.1 合金微結構 30
4.1.1 第一型銅合金 30
4.1.2 第二型銅合金 33
4.1.3 第三型銅合金 37
4.1.4 第四型銅合金 41
4.1.5 第五型銅合金 45
4.1.6 TEM 微結構分析 49
4.2新型銅合金系列之物理性質 51
4.2.1 室溫硬度比較 51
4.2.2 室溫導電度比較 57
4.2.3 室溫磨耗比較 64
4.2.4 油溫磨耗比較 80
4.3合金系列之應用特性 81
第五章 討 論 83
5.1熱處理之奈米晶析出強化微結構 83
5.2冷滾軋對析出強化之影響 84
5.3鋁含量對導電度之影響 87
5.4合金之抗磨耗性質 89
第六章 結 論 93
第七章 研究貢獻 95
第八章 未來研究方向 96
第九章 參考文獻 97

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