引導式自組裝在十奈米先進製程之下已經展現其製造接觸孔及導通孔的潛力，插入冗餘導通孔亦是個重要的議題，因此舉能夠增加電路的良率以及可靠度。先前在繞線後階段結合引導式自主裝以及冗餘導通孔的研究已經分別使用多種技巧來嘗試增進導通孔可製造率，包含二重圖象法，虛擬導通孔，以及導線擾動。本研究使用整數線性規劃，結合冗餘導通孔，虛擬導通孔以及導線擾動其中包含導線彎曲以及L型重新繞線來增進導通孔的可製造性。實驗結果顯示導線擾動以及改變原導通孔的位置有助於引導式自主裝的製程並且提升整體導通孔的可製造率，與先前研究相比，在所有的測試資料中，我們的實驗結果平均又更降低60\%的導通孔不可製造率。

Block copolymer directed self-assembly(DSA) has demonstrated its potential of manufacturing contact/via beyond sub-10nm technology node. Redundant via insertion is also a crucial issue for its improvement on circuit yield and reliability. Previous works have been done on DSA and redundant via insertion at post-routing stage by using techniques such as multiple patterning, dummy via, and wire perturbation. This work combines redundant via insertion, dummy via insertion and wire perturbation including wire-bending and L-shaped reroute techniques to further improve via manufacturability with Integer Linear Programming(ILP) based algorithm.
The experimental result shows that wire perturbation and changing the location of vias can successfully help DSA process to enhance the entire via manufacturability and the average unmanufacturable via rate can be 60\% lower in all the test cases, compared with previous work.

摘要
目錄
第一章------1
第二章------6
第三章------11
第四章------24
第五章------28
參考文獻----29

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