IC製造業在追求高生產效率的同時，如能有精確高效率之進料檢驗作業，便可大幅提升產品生產效率，因此除需技術精良的檢驗設備外，也必須有合宜的驗收抽樣準則。本研究提供一自我評估檢驗能力之作法，和一建構於Poisson分配下，低不良率情境適用之驗收方案，能夠協助檢驗管理者評估現行計畫檢出能力，預估產品實際不良率，同時考量品質、成本和營收，制訂合適之驗收抽樣計畫，避免過多不良品進入產線造成生產浪費。
長期上製造業多以MIL-STD-1916或MIL-STD-105E做為進料檢驗之計數型單次驗收抽樣計畫標準，前者0收1退驗收方式，易影響出貨計畫，後者將品質水準區塊化，樣本數則有再調降空間。鑑於此，本研究除考量IC製造業低不良率管理需求外，也希望協助其他產業在制訂驗收抽樣計畫時更有彈性空間，因此，同時提供一般不良率水準管理適用之驗收抽樣計畫表，供不同情境者使用。最後藉一個案，以本研究所提出之方案，對其現況問題建議有效改善策略。

Providing that precise and effective operations are taken in Incoming Inspection, IC Manufacturing Industries can boost much more efficiency greatly while requiring highly productivity simultaneously. Consequently, in addition to pieces of superior inspection equipment, appropriate acceptance sampling rules are necessary as well. In this research, an approach of self-assessment on inspection capability and an applicable scenario for lower yield losses constructed of Poisson distribution are provided. These methods will help inspection managers assess current plans’ capabilities on inspection, estimate product’s real yield losses, but will also consider product’s quality, costs and revenues, and to regulate the suitable Acceptance Sampling Plans that could avoid the costs of waste which are caused by the large number of defective products going into production.
Ever since, most of manufacturing industries have been adopting the standard MIL-STD-1916 or the standard MIL-STD-105E as the Attributes Acceptance Sampling Plans for Incoming Inspection. The former, in the standard of “Ac=0, Re=1”, easily impacts inventory and shipping plans, and the latter, blockenizing the quality levels, still have room for reducing sample size. Accordingly, except the circumstances of lower yield losses in IC Manufacturing Industries are regarded, this research also advised on the Acceptance Sampling Plans for the use of general yield or of others circumstances. Hopefully these can make Acceptance Sampling Plans more of wiggle room flexibly for others operation managers in different industries.
At the end of this research, the scenarios provided above were applied to a case of an Assembly and Test Fab in semiconductor industry, and furtherly to propose effectively advices on improving the status quo problems.

摘要......................................I
Abstract.................................II
目錄......................................V
圖目錄..................................VII
表目錄.................................VIII
第一章 緒論...............................1
1.1 研究背景及動機........................1
1.2 研究目的..............................3
1.3 研究架構..............................3
第二章 文獻回顧...........................5
2.1 樣本比例估計量之近似抽樣分配..........5
2.2 大樣本母體比例之區間估計..............6
2.3 型Ⅰ誤差、型Ⅱ誤差與α、β之關係......7
2.4 驗收抽樣計畫..........................7
第三章 個案分析..........................15
3.1 個案公司簡介.........................15
3.2 現況問題.............................17
3.3 改善策略I............................18
3.4 改善策略II...........................20
第四章 結果驗證..........................25
4.1 驗證方法.............................25
4.2 驗證結果.............................26
第五章 結論與未來發展....................30
5.1 結論.................................30
5.2 未來發展.............................31
文獻參考.................................32
附錄.....................................34

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