隨著科技發展，目前薄膜電晶體液晶面板技術已達到成熟量產的階段；然而，隨著可攜式消費性電子的出現，薄膜電晶體液晶面板低操作視角、殘影、及高功耗等缺點已逐漸不符合需求。而微型發光二極體面板技術的廣角、高反應速度、及低功率等優勢，使此技術成為未來的發展趨勢。由於微型發光二極體面板的操作概念為將不同來源的紅綠藍單色微型發光二極體陣列分次批量組裝於電晶體上，因此組裝上需要批量化、高對準精度、及選擇性的轉移技術，才能縮短組裝時間降低成本使其量產。
評估微型發光二極體面板的組裝需求，本研究利用微機電技術開發微型靜電式轉移頭陣列元件達到批量轉移的功能。此元件具有易陣列化及高精度的優點，並且透過電路控制靜電吸附，達到能在陣列中選擇性去除低良率晶片提升轉移效率。所設計之微型靜電式轉移取頭陣列元件具有靜電電極佈局、有效接觸凸塊、及緩衝彈簧等結構。操作上透過凸塊提供有效晶片接觸，利用電極設計提供足夠靜電力，以彈簧提供接觸操作之緩衝，並將此操作元件陣列化以達到微型發光二極體晶片之批量轉移。

Nowadays, Thin film transistor liquid crystal display (TFT-LCD) has achieved the stage of mass production; however, with the disadvantage of low viewing angle, image sticking, and high power consumption, it cannot satisfy the demands of consumer electronics. On the other hand, with the advantage of high viewing angle, low responding time, and low power consumption, Micro Light Emitting Diode Display (μLED Display) technology becomes the development trend of displays. A μLED Display contains single red, green, and blue self color emitting elements forming a single pixel element, which requires mass productive, high-precision, and selective Transfer technology for assembly to lower the cost.
This research use MEMS technology to develop a Micro Electrostatic Transfer Heads Array to achieve mass production of μLED Display. With the help of MEMS technology’s batch process and high precision, a Transfer Heads Array is able to mass transfer selectively with electrode design, mesa structure, spring structure, precision stage and circuit control to increase the assembly efficiency of μLED Display.

摘要 I
Abstract II
致謝 III
目錄 VI
圖目錄 X
表目錄 XVIII
第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 6
1-2-1 轉移流程探討 6
1-2-2 轉移機制 8
1-2-3 靜電吸盤及轉移頭探討 12
1-3 研究動機與目標 14
第二章 設計與分析 28
2-1 轉移系統及流程 28
2-2 元件結構概念 30
2-3 靜電電極 31
2-3-1 靜電力原理 32
2-3-2 初步電極設計 34
2-3-3 靜電力模擬 36
2-4 彈簧結構 38
2-4-1 吸收接觸表面起伏 39
2-4-2 提供足夠反力 39
2-5 凸塊結構 39
2-6 元件設計 41
2-6-1 微型靜電式轉移頭元件 42
2-6-2 電極佈局測試元件 44
2-6-3 陣列化測試元件 45
第三章 製程流程與結果 61
3-1 光罩設計 61
3-1-1 對準圖形 61
3-1-2 微型靜電式轉移頭元件 62
3-1-3 陣列化測試元件 63
3-1-4 陣列化晶片元件 64
3-1-5 電極佈局測試元件 64
3-1-6 溼蝕刻測試結構 65
3-2 製程流程 65
3-3 製程結果討論 68
3-3-1 微型靜電式轉移頭元件及陣列化測試元件 69
3-3-2 電極佈局測試元件 70
3-4 結論 71
第四章 量測架設及結果 86
4-1 電極佈局測試元件 86
4-1-1 晶片吸取實驗 86
4-1-2 電子秤靜電力量測 90
4-1-3 結果討論 94
4-2 微型靜電式轉移頭元件 94
4-2-1 彈簧特性量測 95
4-2-2 結果討論 96
4-3 陣列化測試元件 97
4-3-1 電子秤量測 97
4-3-2 結果討論 98
第五章 結論及未來工作 117
5-1 結論 117
5-2 未來工作 118
參考資料 123
附錄 127
附錄A 晶片吸取架設及量測 127
A-1 晶片吸取系統 127
A-2量測架設及流程 129
A-3 結果討論 130

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