近年來雷射被廣泛使用在工業加工上，像是焊接、切割、鑽孔等應用，而為了要提升雷射在加工上的精度及速度，雷射振鏡掃描系統被用來輔助加工製程。在雙軸振鏡掃描系統中有兩片振鏡，其目的是為了將雷射轉向，而為了避免在轉向的過程中有過多的能量損失，因此振鏡就需要有高反射率。本論文的目的即是利用介電質材料來設計並且鍍製出高反射率的振鏡。
本論文中使用薄膜設計軟體Essential Macleod，利用SiO2以及Ti3O5兩種材料做膜堆設計，並透過軟體中的優化功能來提升設計之鏡片反射率，使設計之振鏡在綠光區間內的反射率達到99%。完成振鏡膜層設計後，再利用本實驗室之多層膜光學鍍膜機去做振鏡鍍膜的流程，最後再將製作之振鏡成品透過光譜量測系統去量取振鏡的穿透與反射光譜圖，與設計結果比較，確認其規格是否符合設計目標，達到市售需求之規格。

Nowadays, laser technology has been applied to many applications in industrial manufacture processes, such as welding, cutting, and drilling. To improve the processing speed and precision, laser galvanometer scanning system, generally based on two galvo mirrors, can control the laser beam aiming at work objects. Hence, it is important to increase the reflectivity of the galvo mirrors via the surface coatings for reduction in energy losses in the scanning system.
In this thesis, the design of coatings on galvo mirrors employs Essential Macleod, a thin film design software copyrighted by Thin Film Center Inc. This design use Silicon dioxide(SiO2) and Trititanium pentoxide(Ti3O5) as materials, and with the function of optimization in the software, the reflectivity of galvo mirrors could approach 99% in 500~550nm. Next, an in-house vacuum coater, Made by Showa Zenko Co., conducts the coating process of galvo mirrors based on the design parameters. And, a spectrometer measures the reflectivity of coated galvo mirrors to give assessment of coating processes in order to make the design of coating parameters fulfill the specifications of the mirrors.

摘要 i
ABSTRACT ii
誌謝 iii
圖目錄 vii
表目錄 xi
第一章 簡介 1
1-1研究背景 1
1-2研究目的 2
1-3文獻回顧 3
1-3-1 振鏡掃描系統 3
1-3-2 物理氣相沉積 4
1-3-3 電子槍蒸鍍法 5
1-3-4 光學薄膜特性 7
1-3-5 離子束離子助鍍 7
1-3-6 鍍膜厚度監控 8
第二章 薄膜光學理論 15
2-1均勻介質之光學導納 15
2-2單介面反射與透射 17
2-3單層膜的反射與透射 18
2-4多層膜的反射與透射 20
2-5相干性的反射與透射 21
2-6光波斜向入射 22
2-7包絡法 23
第三章 振鏡膜層設計與分析 30
3-1薄膜設計軟體 30
3-2高反射鏡膜層基礎設計 31
3-3振鏡膜層設計與分析 32
3-3-1 反射帶拓寬設計 32
3-3-2 膜層優化分析 34
第四章 振鏡鍍製及光譜分析 46
4-1鍍膜設備 46
4-2材料折射率計算 47
4-2-1 利用包絡法計算材料折射率 47
4-2-2 帶回原設計分析 49
4-3振鏡鍍膜製程操作 50
4-3-1 膜厚誤差計算 50
4-3-2 振鏡膜層鍍製流程 51
4-4振鏡量測與分析 52
4-4-1 量測設備架設 52
4-4-2 振鏡光譜量測 53
4-4-3 基板粗糙度量測以及分析 55
4-4-4 設計與量測差異之分析 56
4-5總結 57
第五章 結論以及未來展望 80
5-1結論 80
5-2未來工作 81
參考文獻 83

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