|
[1] S. Datta, “Recent advances in high performance CMOS transistors: from planar to non-planar,” Electrochemical Soc. Interface, vol. 22, no. 1, pp.41-46, 2013. [2] S. H. Kim, H. Kam, C. Hu, and T. J. K. Liu, “Germanium-source tunnel field effect transistors with record high ION/IOFF,” VLSI Symp. Tech. Dig., 2009, pp. 178-179. [3] J. H. Seo, Y. J. Yoon, S. Lee, J. H. Lee, S. Cho, and I. M. Kang, “Design and analysis of Si-based arch-shaped gate-all-around (GAA) tunneling field-effect transistor (TFET),” Appl. Phys. Lett, vol. 15, no. 3, pp. 208-212, 2015. [4] R. Gandhi, Z. Chen, N. Singh, K. Banerjee, and S. Lee, “CMOS-compatible vertical-silicon-nanowire gate-all-around p-type tunneling FETs with ≤ 50 mV/decade subthreshold swing,” IEEE Electron Device Lett., vol. 32, no. 11, pp. 1054-1506, 2011. [5] A. M. Ionescu and H. Riel, “Tunnel field-effect transistors as energy efficient electronic switches,” Nature, vol. 479, pp. 329-337, 2011. [6] J. J. Shik and C. W. Young, “Ambipolarity factor of tunneling field-effect transistors (TFETs),” JSTS, vol. 11, pp. 272-277, 2011. [7] H. Wang, Y. Liu, M. Liu, Q. Zhang, C. Zhang, X. Ma, J. Zhang, Y. Hao, and G. Han, “Performance improvement in novel germanium-tin / germanium heterojunction enhanced p-channel tunneling field-effect transistor,” Superlattices Microstructures, vol. 383, pp. 401-410, 2015. [8] Y. Yang, G. Han, P. Guo, W. Wang, X. Gong, L. Wang, K. L. Low, and Y. C. Yeo, “Germanium-tin p-channel tunneling field-effect transistor: device design and technology demonstration,” IEEE Trans. Electron Devices, vol. 60, no. 12, pp. 4048 -4055, 2013. [9] Y. Yang, S. Su, P. Guo, W. Wang, X. Gong, L. Wang, K. L. Low, G. Zhang, C. Xue, B. Cheng, G. Han, and Y. C. Yeo, “Towards direct band-to-band tunneling in p-channel tunneling field effect transistor (TFET): technology enablement by germanium-tin (GeSn),” IEDM Tech. Dig., pp. 379-382, 2012. [10] S. Datta, H. Liu, and V. Narayanan,“Tunnel FET technology: A reliability perspective,” Microelectronics Reliability, vol. 54, no. 5, pp. 861-874, 2014. [11] Y. Yang, K. L. Low, W. Wang, P. Guo, L. Wang, G. Han, and Y. C. Yeo, “Germanium-tin n-channel tunneling field-effect transistor: device physics and simulation study,” J. Appl. Phys., vol. 113, no. 19, pp. 194507-1-194507-7, 2013. [12] I. A. Young, U. E. Avci, and D. H. Morris, “Tunneling field effect transistors: Device and circuit considerations for energy efficient logic opportunities,” IEDM Tech. Dig., pp. 600-603, 2015. [13] U. E. Avci, D. H. Morris, and I. A. Young, “Tunnel field-effect transistors: Prospects and challenges,” IEEE J. Electron. Devices Soc., vol. 3, no. 3, pp.88-95, 2015. [14] T. Krishnamohan, D. Kim, S. Raghunathan, K. Saraswat, “Double-gate strained-Ge heterostructure tunneling FET (TFET) with record high drive currents and < 60mV/dec subthreshold slope,” IEDM Tech. Dig., 2008. [15] M. S. Ram and D. B. Abdi, “Dopingless PNPN tunnel FET with improved performance: design and analysis,” Superlattices Microstructures, vol. 82, pp. 430-437, 2015. [16] W. Cao, C. J. Yao, G. F. Jiao, D. Huang, H. Y. Yu, and M. F. Li, “Improvement in reliability of tunneling field-effect transistor with p-n-i-n structure,” IEEE Trans. Electron Devices, vol. 58, no. 7, pp. 2122-2126, Jul. 2011. [17] R. Rooyackers, A. Vandooren, A. S. Verhulst, A. Walke, K. Devriendt, S. Locorotondo, M. Demand, G. Bryce, R. Loo, A. Hikavyy, T. Vandeweyer, C. Huyghebaert, N. Collaert, and A. Thean, “A new complementary hetero-junction vertical tunnel-FET integration scheme,” in IEDM Tech. Dig., pp. 92-95, 2013. [18] E. H. Toh, G. H. Wang, G. Samudra, and Y. C. Yeo, “Device physics and design of germanium tunneling field-effect transistor with source and drain engineering for low power and high performance applications,” J. Appl. Phys., vol. 103, no. 10, pp. 104504-1-104504-5, 2008. [19] D. B. Abdi and M. J. Kumar, “PNPN tunnel FET with controllable drain side tunnel barrier width: Proposal and analysis,” Superlattices Microstructures, vol. 86, pp. 121-125, 2015. [20] H. Ishiwara, “Current status of ferroelectric-gate Si transistors and challenge to ferroelectric-gate CNT transistors,” Current Appl. Phys., vol. 9, no. 1, pp. S1-4, Jan. 2009. [21] A. M. Ionescu, L. Lattanzio, G. A. Salvatore, L. D. Michielis, K. Boucart, and Didier Bouvet, “The hysteretic ferroelectric tunnel FET,” IEEE Trans. Electron Devices, vol. 57, no. 12, pp. 3518-3524, 2010. [22] J. Müller, T. S. Böscke, D. Bräuhaus, U. Schröder, U. Böttger, J. Sundqvist, P. Kücher, T. Mikolajick, and L. Frey, “Ferroelectric Zr0.5Hf0.5O2 thin films for nonvolatile memory applications,” Appl. Phys. Lett., vol. 99, no. 11, pp. 112901-1-112901-3, 2011. [23] J. Müller, T. S. Böscke, U. Schröder, S. Mueller, D. Bräuhaus, U. Böttger, L. Frey, and T. Mikolajick, “Ferroelectricity in simple binary ZrO2 and HfO2,” Nano Lett., vol.12, no. 8, pp.4318-4323, 2012. [24] U. E. Avci, B. C. Kung, A. Agrawal, G. Dewey, V. Le, R. Rios, D. H. Morris, S. Hasan, R. Kotlyar, J. Kavalieros, and I. A. Young, “Study of TFET non-ideality effects for determination of geometry and defect density requirements for sub-60mV/ dec Ge TFET,” in IEDM Tech. Dig., pp. 891-894, 2015. [25] G. Han, S. Su, C. Zhan, Q. Zhou, Y. Yang, L. Wang, P. Guo, W. Wei, C. P. Wong, Z. X. Shen, B. Cheng, and Y. C. Yeo, “High-mobility germanium-tin (GeSn) p-channel MOSFETs featuring metallic source/drain and sub-370 °C process modules,” in IEDM Tech. Dig., pp. 402-404, 2011. [26] M. Bauer, J. Taraci, J. Tolle, A. V. G. Chizmeshya, S. Zollner, David J. Smith, J. Menendez, C. Hu, and J. Kouvetakis, “Ge–Sn semiconductors for band-gap and lattice engineering,” Appl. Phys. Lett., vol. 81, no. 16, pp. 2992-2994, 2002. [27] B. Vincent, F. Gencarelli, H. Bender, C. Merckling, B. Douhard, D. H. Petersen, O. Hansen, H. H. Henrichsen, J. Meersschaut, W. Vandervorst, M. Heyns, R. Loo, and M. Caymax, “Undoped and in-situ B doped GeSn epitaxial growth on Ge by atmospheric pressure chemical vapor deposition,” Appl. Phys. Lett., vol. 99, no. 15, pp. 152103-1-152103-3, 2011. [28] J. Xie, J. Tolle, V. R. D’Costa, C. Weng, A. V. G. Chizmeshya, J. Menendez, and J. Kouvetakis, “Molecular approaches to p- and n-nanoscale doping of Ge1-ySny semiconductors: Structural, electrical and transport properties,” Solid-State Electronics, vol. 53, no. 8, pp. 816-823, 2009. [29] R. W. Olesinski and G. J. Abbaschian, “The Ge-Sn (germanium-tin) system,” Bulletin of Alloy Phase Diagrams, vol. 5, no. 3, pp. 265-271, 1984. [30] H. P. L. D. Guevara, A. G. Rodrı́guez, H. N. Contreras, and M. A. Vidal, “Ge1-xSnx alloys pseudomorphically grown on Ge(001),” Appl. Phys. Lett., vol. 83, no. 24, pp. 4942-4944, 2003. [31] R. Chen, Y. C. Huang, S. Gupta, A. C. Lin, E. Sanchez, Y. Kim, K. C. Saraswat, T. Kamins, and J. S. Harris, “Material characterization of high Sn-content, compressively-strained GeSn epitaxial films after rapid thermal processing,” J. Crystal Growth, vol 365, pp.29-34, 2013. [32] T. Maeda1, W. Jevasuwan1, H.Hattori1, N. Uchida1, S. Miura, M. Tanaka, N. D. M. Santos, A. Vantomme, J. P. Locquet, and R. R. Lieten, “Ultrathin GeSn p-channel MOSFETs grown directly on Si(111) substrate using solid phase epitaxy,” Japan. J. Appl. Phys., vol. 54, pp. 04DA07-1-04DA07-4, 2015. [33] J. Wang, S. S. Mottaghian, and M. F. Baroughi, “Passivation properties of atomic-layer-deposited hafnium and aluminum oxides on Si surfaces,” IEEE Trans. Electron Devices, vol. 59, no. 2, pp.342-348, 2012. [34] R. J. Carter, E. Cartier, A. Kerber, L. Pantisano, T. Schram, S. De Gendt, and M. Heyns, “Passivation and interface state density of SiO2/HfO2-based/polycrystalline-Si gate stacks,” Nano Lett., vol. 83. no. 3, pp. 533-535, 2003. [35] E. Cartier, M. Hopstaken, and M. Copel, “Oxygen passivation of vacancy defects in metal-nitride gated HfO2/SiO2/Si devices,” Appl. Phys. Lett., vol. 95, no. 4, pp. 042901-1-042901-3, 2009. [36] N. Wu, Q. Zhang, C. Zhu, D. S. H. Chan, M. F. Li, N. Balasubramanian, A. Chin, and D. L. Kwong, “Alternative surface passivation on germanium for metal-oxide-semiconductor applications with high- gate dielectric,” Appl. Phys. Lett., vol. 85, no. 18, pp.4127-4129, 2004. [37] W. P. Bai, N. Lu, J. Liu, A. Rarmrez, D. L. Kwong, D. Wristers, A. Ritenour, L. Lee, D. Antoniadis, “Ge MOS Characteristics with CVD HfO2 Gate Dielectrics and TaN Gate Electrode,” 2003 Symp. VLSI Technology, pp.121-122, 2003. [38] A. Chroneos1, U. Schwingenschlög, and A. Dimoulas1, “Impurity diffusion, point defect engineering, and surface/interface passivation in germanium,” Annalen der Physik, vol. 524, no. 3-4, pp. 123-132, 2012. [39] K. Kita, S. K. Wang, M. Yoshida, C. H. Lee, K. Nagashio, T. Nishimura, and A. Toriumi, “Comprehensive study of GeO2 oxidation, GeO desorption and GeO2-metal interaction-understanding of Ge processing kinetics for perfect interface control,” IEDM Tech. Dig., pp.639-696, 2009. [40] C. H. Lee1, T. Nishimura, N. Saido1, K. Nagashio, K. Kita, and A. Toriumi, “Record-high electron mobility in Ge n-MOSFETs exceeding Si universality,” IEDM Tech. Dig., pp.457-460, 2009. [41] S. Mookerjea, D. Mohata, T. Mayer, V. Narayanan, and S. Datta, “Temperature dependent I–V characteristics of a vertical In0.53Ga0.47 as tunnel FET,” IEEE Electron Device Lett., vol. 31, no. 6, pp. 564–566, 2010. [42] A. C. Seabaugh and Q. Zhang, “Low voltage tunnel transistors for beyond CMOS logic,” Proc. IEEE, vol. 98, no. 12, pp. 2095–2110, 2010. [43] A. Villalon, G. L. Carval, S. Martinie, C. L. Royer, M. A. Jaud, and S. Cristoloveanu, “Further insights in TFET operation,” IEEE Trans. Electron Devices, vol. 61, no. 8, pp. 2893–2898, 2014. [44] S. Garg and S. Saurabh, “Suppression of ambipolar current in tunnel FETs using drain pocket: proposal and analysis,” Superlattices Microstruct., vol. 113, p.p. 261-270, 2018. [45] T. N. Theis, “New devices for computing,” Silicon Nanoelectronics Workshop, 2014. [46] R. Rita, V. Anne, S. V. Anne, M. W. Amey, S. Eddy, D. Katia, L. C. Sabrina, D. Marc, B. George, L. Roger, H. Andriy, V. Tom, H. Cedric, C. Nadine, and V. Y. T. Aaron, “Ge source vertical tunnel FETs using a novel replacement source integration scheme,” IEEE Trans. Electron Devices, vol. 61, no. 12, pp. 4032-4039, 2014.
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