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At the early stage, semiconductor companies are mostly one by one consistent production process model, from IC design, wafer manufacturing, packaging, testing to the finished product sales are their own single-handedly, called the integrated device manufacturer；IDM, such as Intel, Texas, Motorola, Samsung, Philips, Toshiba and so on ..... Taiwan initially adopted the IDM model to open the semiconductor industry, Base on wafer process Shrink down, Wafer size continues to growing, wafer design and production more and more complex, the cost is getting higher, wafer factory costs a hundreds of millions of dollars, this is not a small and medium enterprises can afford it；The IC design company will not be able to afford the high cost of R & D and construction of the plant if cooperate with the foundry fab, and the foundry fab will focus on manufacturing and its capacity to provide to multiple customers, to minimum the risk of market volatility and capacity supply/demand imbalance.
Therefore, at the end of 1980, the semiconductor industry gradually transformed into a professional division of labor model, separate Fabless、foundry fab and assembly testing, Taiwan's first foundry semiconductor manufacturing plant TSMC was established in 1987, thus reversing the Taiwan semiconductor industry type, foundry can share IDM company the lack of capacity and high production costs, let IC design companies can focus more on design and development, enhance its competition.
This research is mainly to investigate the automatic visual inspector(AVI) sampling method of foundry fab outgoing inspection, and chooses the appropriate sampling method, increases 70K wafers to do AVI inspection and saves 1.6 times of manpower.
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