本論文旨在探討薄膜擠壓阻尼效應(Squeeze-film damping effect)於壓力感測器之應用。在微機電領域中，薄膜擠壓效應已被廣泛的研究，但主要聚焦於此效應對於動態結構所造成的非理想性，直到近年才開始誕生將此效應應用在壓力感測上的概念。在本研究中，我們採用TSMC MEMS shuttle製程，製作出大小為4mm×4mm、厚度為40μm之晶片，並設計九個不同面積、彈力係數的壓力感測器，將其與壓電片、感測電路整合在PCB板上。PCB板將放置於壓力控制腔中，透過壓電式驅動、電容式感測的方式，捕捉結構共振頻隨壓力的變化，並與模擬結果做比較，以一面積為800μm×800μm的感測元件為例，其感測度能達到0.945 Hz/Pa。

In this thesis, we discuss the use of squeeze-film damping effect for pressure sensing. In the field of microelectromechanics system(MEMS), this effect has been extensively studied, but mostly focused on the non-ideal effect it causes on dynamic structures. Recently, the concept of applying this effect to atmospheric pressure sensing has been proposed. In this work, 9 pressure sensors of 40μm in thickness are designed in a 4mm×4mm chip, which is fabricated by the TSMC MEMS shuttle process. The sensor chip is integrated with a piezoelectric actuator and the corresponding sensing circuit on a printed-circuit board(PCB). The PCB is placed in a pressure controlled chamber for testing. Combined with piezoelectric driving and capacitive sensing mechanism, the resonant frequency shift is comparable to the simulations. The sensitivity of an 800μm×800μm structure is 0.945 Hz/Pa.

摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VII
表目錄 XIII
第1章 緒論 1
1-1 前言 1
1-2 文獻回顧 8
1-3 研究動機 12
1-4 量測系統架構 13
第2章 薄膜擠壓效應之分析與模擬 15
2-1 薄膜擠壓效應介紹 15
2-2 薄膜擠壓效應之理論 17
2-3 薄膜擠壓效應之應用 21
2-4 薄膜擠壓效應之模擬 25
第3章 壓力感測器結構之設計與模擬 29
3-1 感測器結構設計 29
3-2 結構感測度模擬 32
3-3 結構製程設計 38
3-4 電容式感測原理與感測電容設計 39
3-5 壓電驅動與電容感測機制 41
3-6 電路板設計 42
第4章 量測與討論 43
4-1 製程量測 43
4-2 共振頻量測 45
4-2-1 LDV共振頻量測結果與COVENTOR模擬結果 45
4-2-2 LDV頻率響應量測結果與MATLAB模擬結果 52
4-3 截止電壓與壓力感測範圍 56
4-4 壓力感測度量測 60
4-4-1 壓力控制與量測系統 60
4-4-2 10 kPa感測度量測 61
4-4-3 1 kPa感測度量測 71
第5章 結論與未來 81
5-1 研究成果與討論 81
5-2 未來工作 82
第6章 參考文獻 83
第7章 附錄 87
7-1 轉阻放大器規格表 87
7-2 壓電片規格表 88
7-3 結構OM量測 89

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